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7368666 |
Surface-mounting type electronic circuit unit without detachment of solder
A surface-mounting type electronic circuit unit includes pedestal bases. The pedestal bases are attached to first lands provided on the bottom surface of an insulating substrate and are made of...
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7363705 |
Method of making a contact
Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building...
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7365274 |
Electronic circuit board
A board for high frequency device includes a plurality of electrode terminals connected to an electronic component or another electronic circuit board by flowable conducting material such as...
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7361845 |
Wiring line for high frequency
Wiring lines for use at a high frequency having reduced resistance and/or inductance are disclosed that may be readily manufactured in a semiconductor integrated circuit. Wiring lines can include...
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7361846 |
High electrical performance semiconductor package
A high electrical performance semiconductor package is proposed. A carrier is provided having a first surface, an opposite second surface, and conductive vias for electrically connecting the first...
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7358607 |
Substrates and systems to minimize signal path discontinuities
Arrangements are used for minimizing signal path discontinuities.
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7355128 |
Wired circuit board
A wired circuit board having improved adhesion between the conductive pattern and an insulating layer to prevent a plating solution from remaining between a metal plating layer and the insulating...
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7355127 |
Printed wiring board and electronic device using the same
The present invention provides a printed wiring board which has high insulation resistance between wirings and is unlikely to cause failures such as leakages or short circuits, attributable to ion...
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7353595 |
Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon
A tape substrate includes IC lands electrically connected to pins of a driver IC (integrated circuit), circuit board terminal lands electrically connected to an external circuit board, test lands...
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7355283 |
Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the...
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7351313 |
Production device and production method for conductive nano-wire
The object of the present invention is to provide a nano-scale molecular assembly such as a conductive nano-wire. Specifically, there is provided an electrolytic apparatus for forming a molecular...
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7351917 |
Vents with signal image for signal return path
A method, structure, and method of design relating an electrical structure that includes a metal voltage plane laminated to a dielectric substrate. A determination is made as to where to place an...
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7350292 |
Method for affecting impedance of an electrical apparatus
A method for affecting an impedance of a portion of an electrical circuit loop in an electrical circuit apparatus includes providing an electrical circuit apparatus having at least a portion of an...
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7348496 |
Circuit board with organic dielectric layer
Embodiments of the present invention include forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate, using an...
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7348497 |
Mounting structure for electronic components
A mounting structure for electronic components is provided with a circuit board that has a step portion formed at one end portion thereof. The step portion is sandwiched by a lead of the electronic...
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7345244 |
Flexible substrate and a connection method thereof that can achieve reliable connection
A flexible substrate is connectable to electrodes of an external member. The flexible substrate includes a base material having flexibility and including an insulative base film and a conductive...
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7345246 |
Wiring board and capacitor to be built into wiring board
An intermediate board has a board core formed by a main core body and a sub-core portion. The main core body has a plate-like shape and includes an open sub-core housing portion in which the...
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7345889 |
Method and system for reducing radiated energy emissions in computational devices
A method and system for reducing the release of high frequency electromagnetic energy into the environment is disclosed, wherein local regions of distributed capacitance are embedded within a...
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7342182 |
Printed board
A printed board suitable for having a LSI surface-mounted thereto and improves high-speed transfer characteristic while maintaining the circumference of a pad formed on the printed board. The pad...
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7342180 |
Flexible printed circuit and liquid crystal display device using same
An exemplary liquid crystal display device ( 200 ) includes a liquid crystal display panel ( 21 ), and a flexible printed circuit ( 2 ) joined to the liquid crystal display panel. The flexible...
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7342179 |
Electronic device and method for producing the same
An electronic device includes a plurality of components, nanoparticles to bond the components, and a receiving layer for holding the nanoparticles, the receiving layer being disposed on at least...
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7342181 |
Maximizing capacitance per unit area while minimizing signal transmission delay in PCB
A printed circuit board (PCB) is provided that maximizes compensation capacitance per unit area of the PCB while minimizing signal transmission delays in the PCB. The PCB includes a first section...
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7339791 |
CVD diamond enhanced microprocessor cooling system
Cooling systems for microprocessors are addressed. Some systems may include a chemical vapor deposited (CVD) diamond heatspreader mounted to a base of a heat sink and to a microprocessor chip,...
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7332816 |
Method of fabricating crossing wiring pattern on a printed circuit board
A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58 b , 58 c and 58 d , and a wiring pattern 58 is...
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7329817 |
Partially completed wiring circuit board assembly sheet and production method of wiring circuit board using said sheet
The present invention provides a partially completed wiring circuit board assembly sheet capable of preventing deposition of a plating metal on the surface of a metal sheet, even when pinholes are...
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7328506 |
Method for forming a plated microvia interconnect
A method for forming a plated microvia interconnect. An external dielectric layer (EDL) is mounted on a surface of the substrate and is in direct mechanical contact with a conductive element...
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7329818 |
Transmission circuit board
In a transmission circuit board, ground terminal portions ( 10 ) are disposed at every other two rows in both end columns. Each of signal circuit layers ( 20 ) includes at least a pair of adjacent...
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7327569 |
Processor module with thermal dissipation device
Embodiments include apparatus, methods, and systems of a processor module for a system board. An electronic module is removably connectable to a system board. The electronic module has first and...
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7326856 |
Multi-layer wiring board
In a multi-layer wiring board in which board wirings are arranged in a plurality of wiring layers so as to be connected via a through hole, two through holes are provided in parallel, and two...
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7323642 |
Thin printed circuit board for manufacturing chip scale package
Provided is a thin printed circuit board (PCB) for manufacturing a chip scale package (CSP). The thin printed circuit board includes a plurality of unit printed circuit boards, each of which is...
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7320173 |
Method for interconnecting multi-layer printed circuit board
A method for fabricating a multi-layer printed circuit board can include forming an etching resist layer on a first metal layer having plating grooves that selectively expose the first metal layer,...
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7312403 |
Circuit component mounting device
A circuit component mounting device includes a resin substrate, vias, a circuit component composed of a main body and electrode portions, a solder, and an insulative sealing resin that covers the...
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7309838 |
Multi-layered circuit board assembly with improved thermal dissipation
A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature...
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7307221 |
Fabrication method and structure of PCB assembly, and tool for assembly thereof
A fabrication method and structure for a PCBA, and tool for assembly of the structure. The structure includes a circuit board, at least one first solder joint, a plurality of second solder joints,...
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7307222 |
Printed circuit board test access point structures and method for making the same
A test access point structure for accessing test points of a printed circuit board and method of fabrication thereof is presented. In an x-, y-, z-coordinate system where traces are printed along...
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7305509 |
Method and apparatus for zero stub serial termination capacitor of resistor mounting option in an information handling system
A method of implementing zero stub serial termination component mounting in an information handling system includes providing a first and second serial terminator option. The first serial...
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7303639 |
Method for producing Z-axis interconnection assembly of printed wiring board elements
A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one...
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7299547 |
Method for manufacturing tape wiring board
A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern, thereby reducing the number of processes for...
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7298625 |
Expansion structure of memory module slot
An expansion structure of memory module slots is provided. A circuit switch board and a substrate are disposed on a motherboard, wherein a plurality of first memory module slots is disposed on the...
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7297876 |
Circuit board and method of manufacturing the same
Apply heat to thermoplastic resin film, which is eventually to become an insulating resin layer, and press the film against a mold for forming grooves on a surface of the film. Next, press-fit an...
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7294791 |
Circuitized substrate with improved impedance control circuitry, method of making same, electrical assembly and information handling system utilizing same
A circuitized substrate designed to substantially eliminate impedance disruptions during passage of signals through signal lines of the substrate's circuitry. The substrate includes a first...
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7292148 |
Method of variable position strap mounting for RFID transponder
A method of coupling an RFID chip to an antenna includes the steps of, iteratively until a test criterion is met, positioning an RFID chip relative to an antenna and testing the RFID chip and...
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7290333 |
Manufacturing method of a multilayer printed wiring board
A conductive film has a plurality of clearances (openings) and a plurality of auxiliary clearances. The plurality of clearances and the plurality of auxiliary clearances are formed to have such...
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7288726 |
Hollow wire and method for making the same
A hollow wire for enhancing the wires used in a Liquid Crystal Display includes hollow portions so as to increase the cross sectional area and reduce the resistance. An isolation layer with a low...
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7288729 |
Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same
A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided...
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7286372 |
Transceiver module with PCB having embedded traces for EMI control
A PCB is provided that is suitable for use in applications where EMI control is of interest. The PCB includes circuitry that communicates with an edge connector having edge traces located on its...
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7285729 |
Printed circuit board
A printed circuit board includes circuit lines having different transmission characteristics. In the printed circuit board, mounted components are connected to each other at a plurality of points...
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7286370 |
Wired circuit board and connection structure of wired circuit board
A wired circuit board is provided that is formed by connecting a first wired circuit board and a second wired circuit board, which include a first connection terminal and a second connection...
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7282649 |
Printed circuit board
On the surface of a back board outermost-layer signal lines have different lengths. A difference in lengths of connector lines connected to the outermost-layer signal lines makes the total signal...
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7283373 |
Electronic device
An electronic device comprises an IC provided with an array of pads a preselected number of which define inspection pads of the IC. A substrate has inspection patterns and is mounted on the IC so...
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