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7470864 |
Multi-conducting through hole structure
A multi-conducting through hole structure is provided. The multi-conducting through hole structure has a substrate, at least two signal lines and at least a reference line. The substrate has a...
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7465882 |
Ceramic substrate grid structure for the creation of virtual coax arrangement
Signal line conductors passing through vertical vias in an insulative substrate for supporting and interconnecting integrated circuit chips are provided with shielding conductors in adjacent vias...
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7458149 |
Printed circuit board and method of manufacturing the same
A wiring pattern can be formed with a high density on a substrate as a highly reliable printed circuit board. A method of manufacturing a printed circuit board includes a step of forming a...
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7459202 |
Printed circuit board
A sequentially laminated printed circuit board having highly reliable vias can be fabricated by pattern plating flanges or via lands on a copper foil, laminating the foil to a prepreg so that the...
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7459055 |
Bonding structure with buffer layer and method of forming the same
A bonding structure with a buffer layer, and a method of forming the same are provided. The bonding structure comprises a first substrate with metal pads thereon, a protection layer covered on the...
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7459637 |
Semiconductor device, manufacturing method thereof, circuit board, and electronic appliance
The semiconductor device includes the following: a semiconductor chip, in which an integrated circuit is formed, having a polygon surface, and a plurality of electrodes thereon, that is...
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7457132 |
Via stub termination structures and methods for making same
Vias are used in multilayer printed circuit boards to route electrical interconnects between layers. Some via constructions embodiments result in the formation of a via-stub section. Via stub...
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7452612 |
Wiring substrate
Provided is a wiring portion capable of suppressing diffusion from occurring in a wiring portion or between the wiring portion and a substrate. In the wiring substrate, a first high melting point...
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7453702 |
Printed wiring board
A printed wiring board comprises the insulating layer 11 ( 12 ); at least one resistance element 31 1 ( 31 2 ) comprising a metal as a main component has 0.5 to 5 μm of a roughened surface in...
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7450396 |
Skew compensation by changing ground parasitic for traces
According to embodiments, small holes or openings may be cut on or through the ground plane(s) adjacent to a selected trace line, so that C and L will be changed accordingly. Then phase velocity...
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7446262 |
Laminated electronic component and method for producing the same
A laminated electronic component includes a ceramic substrate having a first groove provided on a principal surface thereof and extending to the side surfaces, and a resin sheet. The resin sheet...
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7446403 |
Carrier structure stacking system and method
The present invention provides a system and method for selectively stacking and interconnecting leaded packaged integrated circuit devices with connections between the feet of leads of an upper IC...
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7439451 |
Tape carrier
Only individual piece-like flexible wiring boards produced separately and judged to be non-defective products in an inspection step in advance are mounted at regular intervals on a carrying support...
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7439450 |
Plating buss and a method of use thereof
The present invention relates generally to a plating buss design and method for minimizing short circuit problems in PCB panel singulation. More particularly, the invention encompasses a serpentine...
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7430800 |
Apparatus and method for far end noise reduction using capacitive cancellation by offset wiring
A mechanism for reducing the vertical cross-talk interference experienced in signal lines due to the inductive affects from signal lines in other signal planes of a multi-layer ceramic package is...
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7426118 |
Printed wiring board
To cancel a magnetic field in an interconnection pattern of a printed wiring board. A first interconnection pattern 3 a is formed on a surface 1 a of an insulating substrate 1 . A second...
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7425081 |
LED lamp assembly with conductive epoxy LED interconnections
A lamp assembly including at least two light emitting diodes (LEDs) attached to an electrically non-conductive housing by at least two beads of electrically conductive epoxy. The electrically...
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7425684 |
Universal systems printed circuit board for interconnections
In Electronics, there exists three distinctive areas namely, discrete components or devices, circuits, and systems. A circuit is built from devices and a system is built from circuits. This...
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7418779 |
Method for balancing power plane pin currents in a printed wiring board using collinear slots
A method and apparatus for balancing power plane pin currents in a printed wiring board (PWB) uses a set of collinear slots in the form of a dashed line to reduce pin counts required for power...
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7417197 |
Direct contact power transfer pad and method of making same
A power transfer pad, having: a non-conductive board having a top and a bottom; a plurality of conductive substrate sections disposed across the top of the non-conductive board; at least one...
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7417196 |
Multilayer board with built-in chip-type electronic component and manufacturing method thereof
A chip-type electronic component built-in multilayer board includes a multilayer board including two or more layered dielectric layers and an inner conductor pattern, and a chip-type electronic...
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7414858 |
Method of manufacturing an electronic device
A semiconductor device ( 100 ) comprising a semiconductor substrate ( 20 ) and a functional element ( 31 ), such as a microstrip, an inductor, a coupler or the like, is provided. Herein the...
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7411135 |
Contour structures to highlight inspection regions
An integrated circuit has a wiring layer below an insulator layer. A pad comprises a conductive material that is on the insulator layer. The pad has a wirebond connection region and a probe pad...
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7411134 |
Hybrid ground grid for printed circuit board
Electrical mounting boards and methods for their fabrication and use are disclosed herein. In particular, such mounting boards embodiments utilize hybrid ground lines interconnected through a...
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7408120 |
Printed circuit board having axially parallel via holes
Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing...
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7408119 |
Electrical interconnection for high-frequency devices
Wire bonds connect current-carrying edges of high-frequency planar conductors to other electrical devices. In one embodiment, planar transmission lines are interconnected using two wire bonds. One...
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7405363 |
Connecting sheet
A first high speed transmission line board ( 1 ) having a stripline structure is composed of a first elastomer sheet ( 1 A) that has a fixed dielectric constant, plural first elastomer strips ( 1...
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7405364 |
Decoupled signal-power substrate architecture
A device comprises a substrate core having power paths through it and an input/output signal routing layer upon the core substrate. An integrated circuit may be arranged on the routing layer such...
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7406344 |
Wireless network card with antenna selection option
A wireless network card includes an adaptable antenna connection structure that includes connections for one or more internal antennas and for one or more Radio Frequency (RF) connectors that may...
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7405946 |
Ball grid array assignment
A pattern of contacts that includes high speed transmitter contacts disposed in a first portion of the pattern, where the high speed transmitter contacts are disposed in first ordered channels of...
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7402755 |
Circuit board with quality-indicator mark and method for indicating quality of the circuit board
A circuit board with a quality-indicator mark and a method for indicating quality of the circuit board. The circuit board includes a plurality of circuit board units. A plating bus is formed around...
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7402757 |
Method, system, and apparatus for reducing transition capacitance
A printed circuit board (PCB) is provided. The PCB includes a signal layer, a first reference plane defined adjacent to a first side of the signal layer, and a via passing through the signal layer...
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7400512 |
Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor
A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing...
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7400515 |
Circuit board electrode connection structure
An electrode connection structure between outer lead(s) of TCP(s), being first circuit board(s), and actuator member electrode(s) for connection to external circuitry, being second circuit...
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7397001 |
Multi-strand substrate for ball-grid array assemblies and method
A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board ( 11 ) having a plurality of BGA substrates ( 12 ) arranged in N rows ( 14 ) and...
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7397672 |
Flip chip mounting substrate
The present invention provides a flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line...
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7394028 |
Flexible circuit substrate for flip-chip-on-flex applications
A circuit substrate for attachment to an integrated circuit chip comprises an electrical trace, a mounting pad and a dielectric layer. The mounting pad has a first surface, one or more sidewalls...
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7394026 |
Multilayer wiring board
In a wiring layer of a first layer of a multilayer wiring board, respective wiring patterns are drawn out from pads in an outermost portion of a pad placement region, from pads located on diagonal...
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7390973 |
Memory module and signal line arrangement method thereof
The pesent invention discloses a memory module and a signal line arrangement method thereof. The memory module includes memory chips mounted on both sidees in a mirror form; and a printed circuit...
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7388158 |
Concentric spacer for reducing capacitive coupling in multilayer substrate assemblies
In one embodiment, a substrate assembly includes a flat substrate having oppositely disposed planar surfaces and a conductor. The conductor is formed on at least one of the planar surfaces and...
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7380338 |
Circuit board and manufacturing method thereof
A circuit board includes a substrate, an insulating layer, at least one protrusion, and a first circuit layer. The insulating layer is disposed on the substrate and has at least one...
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7378598 |
Printed circuit board substrate and method for constructing same
A printed circuit board (PCB) substrate and method for construction of the same. In one embodiment, a first dielectric material is associated with a first current return layer and a second...
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7375983 |
Circuit board for reducing crosstalk of signals
A circuit board includes a first group of layers located close to a top side of the circuit board, and a second group of layers located close to an underside of the circuit board. Signals which are...
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7375286 |
Printed circuit board and manufacturing method thereof
A plurality of wiring patterns in a stripe form are formed to be parallel to one another on one surface of a base insulating layer. The wiring patterns each have a layered structure including a...
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7375432 |
Via attached to a bond pad utilizing a tapered interconnect
An interconnect includes a pad and at least two vias coupled to the pad. In one embodiment, the pad has five substantially straight edges, one via directly coupled to the pad by being formed...
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7375288 |
Apparatuses and methods for improving ball-grid-array solder joint reliability
In some embodiments, apparatuses and methods for improving ball-grid-array solder joint reliability in printed circuit boards. Such apparatuses may comprise, in an exemplary embodiment, a stiffened...
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7375290 |
Printed circuit board via with radio frequency absorber
A printed circuit board with vias that reduce or eliminate radio frequency interference and method of forming the same. The printed circuit board includes non-conductive layers, conductive-layers...
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7371971 |
Wired circuit board and producing method thereof
A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a...
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7371972 |
Electrical wiring structure, manufacturing method thereof, electro-optical device substrate having electrical wiring structure, electro-optical device, and manufacturing method thereof
An electrical wiring structure is provided which can be formed simultaneously when non-linear elements containing corrosion resistant metal wires and non-corrosion resistant metal wires are formed....
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7368665 |
Circuit board and a power module employing the same
A circuit board containing a metal-insulator composite member including an insulator substrate and a metal layer having a pattern, the composite member having an area where the spacing between a...
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