|
Match
|
Document |
Document Title |
|
|
6303877 |
Multilayer thin-film wiring board
A multilayer thin-film wiring board including a base material provided with a plurality of wiring layers and an insulating layer laminated on the base material, and including a via formed by...
|
|
|
6300576 |
Printed-circuit board having projection electrodes and method for producing the same
A printed-circuit board, especially a multilayer printed-circuit board, with projection electrodes integrated with via hole conductors. Each of the projection electrodes is highly adhesive to a...
|
|
|
6300575 |
Conductor interconnect with dendrites through film
A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive layer, forming...
|
|
|
6300577 |
Film carrier and method of burn-in testing
A film carrier includes a base film (1), a first interconnect line (5a) formed on the top surface of the base film (1) and connected to test pads (3), and a second interconnect line (5b) formed on...
|
|
|
6300846 |
Flat flexible cable with ground conductors
A flexible circuit member includes first and second pseudo-twisted flexible conductors on a flexible dielectric substrate. The first pseudo-twisted conductor is on a first side of the substrate and...
|
|
|
6297964 |
Semiconductor device, method of fabricating the same film carrier tape, circuit board, and electronic apparatus
A semiconductor device comprising an insulating film having a device hole, a plurality of bumps formed on the insulating film, a plurality of first leads having end faces thereof exposed on an...
|
|
|
6297460 |
Multichip module and method of forming same
An electrical interconnection medium is provided having first and second overlying interconnection layers. Each interconnection layer includes parallel conductors, and the conductors of the first...
|
|
|
6294742 |
Apparatus and method for adapting surface mount solder pad for heat sink function
A surface mount solder pad that is adapted to function as a heat sink for an electronic component soldered to the pad. Included is a printed wiring board having solder pads disposed on its surface...
|
|
|
6294744 |
Multilayer print circuit board and the production method of the multilayer print circuit board
The present invention provides a multilayer print circuit board having at least an inner print circuit pattern and an outer print circuit pattern which are laminated on a substrate through an...
|
|
|
6288346 |
System and method for easily inspecting a bonded state of a BGA/CSP type electronic part to a board
In a BGA/CSP type electronic part having a matrix-shaped array of solder pads on its back surface, the solder pads at first two corners on one side of the array are connected with each other by an...
|
|
|
6288347 |
Wiring board for flip-chip-mounting
A wiring board for flip-chip-mounting in which a conductor layer is provided in a portion under the semiconductor element-mounting surface of the ceramic insulating board, the electrically...
|
|
|
6288906 |
Multiple layer printed circuit board having power planes on outer layers
A multi-layer printed circuit board includes power planes located on outer conductive layers. The outer conductive layers are patterned to accept circuitry, such as integrated circuits and surface...
|
|
|
6285560 |
Method for increasing device reliability by selectively depopulating solder balls from a foot print of a ball grid array (BGA) package, and device so modified
A routing technique for improving device reliability by selectively depopulating solder balls (12) (and their respective solder ball pads (34), vias (32) and traces or lines (30)) from a...
|
|
|
6281448 |
Printed circuit board and electronic components
A printed circuit board has: a base material layer having a first via hole; and an insulating layer having a second via hole, the insulating layer being provided on one surface of the base material...
|
|
|
6281447 |
Substrate structure
A semiconductor substrate structure includes a conductor supported by a substrate, and has an outer surface and a pair of spaced-apart conductive sidewalls joining with the outer surface at...
|
|
|
6281446 |
Multi-layered circuit board and method of manufacturing the same
A multilayer wiring board comprising a mother wiring board and a carrier wiring board, in which all of the composing layers have IVH structure. The mother wiring board (11) is formed in the manner...
|
|
|
6281450 |
Substrate for mounting semiconductor chips
A substrate for mounting a semiconductor chip having bumps using an adhesive thereon, said substrate being, for instance, provided with an insulating coating having an opening in the semiconductor...
|
|
|
6281449 |
Printed board, manufacturing method therefor and structure for connecting conductor elements to the printed board
A printed board (5) for mounting electronic component, a method for making the same, and an arrangement for connecting a conductive elements (8, 8') to the printed board are provided. The printed...
|
|
|
6274824 |
Method of arranging signal and destination pads to provide multiple signal/destination connection combinations
An electronic circuit assembly having an arrangement of signal and destination pads for two or more signals which provides multiple signal/destination connection combinations. One embodiment of the...
|
|
|
6274819 |
Method and article for the connection and repair of flex and other circuits
An article and method for making and repairing connections between first and second circuits, such as flex circuits. The article 10 includes: a flexible dielectric substrate 12 having first and...
|
|
|
6274822 |
Manufacture of semiconductor connection components with frangible lead sections
A semiconductor chip connection component having numerous leads extending side-by-side across a gap in a support structure, each lead having a frangible section to permit detachment of one end of...
|
|
|
6274823 |
Interconnection substrates with resilient contact structures on both sides
An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The...
|
|
|
6271481 |
Pad configurations for improved etching of multilayer circuit assemblies
There is disclosed herein a tri-metal-layer precircuit 50 which may be selectively etched to provide a multilayer electronic circuit 60 having air bridge crossovers 49. The enlarged ends 44 of the...
|
|
|
6271483 |
Wiring board having vias
A wiring board has vias which penetrate the wiring board from one side to the other side. The vias are radially arranged in the direction from one side to the other side so that the interval...
|
|
|
6271480 |
Electronic device
The electronic device is provide that includes a body having an underside; a plurality of conducting members for transferring electronic signals; and at least two alignment pins mounted...
|
|
|
6272020 |
Structure for mounting a semiconductor device and a capacitor device on a substrate
A semiconductor device-mounting substrate is provided with a semiconductor device, a capacitor device, and a wiring substrate. The wiring substrate has a space in which the capacitor device should...
|
|
|
6265671 |
Printed-wiring board and a production method thereof
A printed-wiring board has a copper foil (the first conductive layer) providing electric conductivity formed on one or both sides of an insulating board providing electrical insulation, an...
|
|
|
6265674 |
Terminal connecting structure of flexible board and printed circuit board
A terminal connecting structure between flexible board and printed circuit board for securely making connections thereof at a low cost. Width dimension W of each land portion 13a of a copper foil...
|
|
|
6260264 |
Methods for making z-axis electrical connections
The present invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes the step of the steps pre-applying adhesive directly to a bumped side...
|
|
|
6256880 |
Method for preparing side attach pad traces through buried conductive material
A circuit substrate utilizes buried edge connectors. The buried edge connectors are mechanically disposed within the edge of the substrate and have substantial thickness. The configuration and...
|
|
|
6259038 |
Semiconductor chip mounting board and method of inspecting the same mounting board
A semiconductor chip mounting circuit board includes a substrate, a wiring circuit formed on a substrate, a conducting pad electrically connected to an electrode of a semiconductor chip which is to...
|
|
|
6255601 |
Conductive feedthrough for a ceramic body and method of fabricating same
A conductive feedthrough connector for conducting electrical current through a ceramic body. A ceramic body is generally fabricated by stacking a plurality of layers of ceramic material and then...
|
|
|
6255602 |
Multiple layer electrical interface
A universal design of a multiple layer printed circuit board incorporates a series of routing vias interconnecting the various layers. The routing vias are connected to conductive traces in the...
|
|
|
6250968 |
Electrical connector system with cross-talk compensation
An electrical connector system with an electrical connector having signal contacts exhibiting unwanted cross-talk; and a circuit substrate engaging the connector. The substrate has a plurality of...
|
|
|
6248962 |
Electrically conductive projections of the same material as their substrate
An electrically conductive apparatus includes, a) an electrically non-conducting substrate, the substrate having a base surface and an adjacent elevated surface, the elevated surface being spaced...
|
|
|
6246016 |
Edge-mountable integrated circuit package and method of attaching the same to a printed wiring board
An edge-mountable integrated circuit (IC) package and methods of manufacturing and assembling the same onto a printed wiring board (PWB). In one embodiment, the package includes: (1) a substrate...
|
|
|
6246013 |
Surface mounting structure and surface mount type electronic component included therein
A surface mounting structure is arranged to minimize a height dimension of an electronic component. A surface mount type electronic component is provided on the surface mounting structure. The...
|
|
|
6246014 |
Printed circuit assembly and method of manufacture therefor
A printed circuit assembly and method of making the same utilize in one embodiment an adhesive layer including a plurality of non-conductive "gauge particles" disposed within a non-conductive...
|
|
|
6246015 |
Printed circuit board for ball grid array semiconductor packages
A printed circuit board for BGA semiconductor packages has structure for effectively grounding the PCB to a grounded mold during molding of the package, thus preventing any accumulation of...
|
|
|
6243272 |
Method and apparatus for interconnecting multiple devices on a circuit board
A method and apparatus interconnecting multiple devices on a circuit board. One disclosed circuit board has a first attach region on a first surface for coupling a first set of pins from a first...
|
|
|
6242079 |
Printed wiring board and method for manufacturing the same
There is provided a multilayer printed wiring board 52 comprising an underlayer conductor circuit 26, an interlaminar resin insulating layer 37 formed on the underlayer conductor circuit 26, an...
|
|
|
6239385 |
Surface mountable coaxial solder interconnect and method
A surface mountable coaxial solder interconnect. The invention provides a small, low-cost, passively self-aligning, high-frequency electronic interconnect adapted to mass production and method. The...
|
|
|
6239384 |
Microelectric lead structures with plural conductors
A microelectronic connection component has flexible leads formed by polymeric strips with metallic conductors thereon. The metallic conductors may be very thin, desirably less than 5 microns thick,...
|
|
|
6239982 |
Electronic device having a single-sided circuit board
In one embodiment of the present invention, an electronic device comprises a circuit board having a first side and a second side and having circuit traces formed only on the first side. The...
|
|
|
6239984 |
Backplane circuit board for an electronic chassis
A backplane circuit board for an electronic chassis includes a bracket and an upper circuit board operatively connected to the bracket. A lower circuit board is also operatively connected to the...
|
|
|
6239387 |
Sinusoidal radio-frequency clock distribution system for synchronization of a computer system
A clock generation system generates and distributes sinusoidal signals. Also, the clock lines are configured and shielded in a manner so as to provide the same overall propagation characteristics...
|
|
|
6238779 |
Laminated electric part
A multilayer type electronic part includes a laminated structure formed by stacking a plurality of first and second ceramic layers, the first ceramic layers being provided with internal electrode...
|
|
|
6235997 |
LSI package with equal length transmission Lines
An LSI package including an area for mounting an LSI device thereon and a plurality of lines for connecting the LSI device and external terminals. At least two of the plurality of lines, in which...
|
|
|
6235994 |
Thermal/electrical break for printed circuit boards
A multi-layer printed circuit board including at least one layer of an electrically conducting material and at least one layer of an electrically insulating material. At least one through hole...
|
|
|
6235996 |
Interconnection structure and process module assembly and rework
An interconnection structure and methods for making and detaching the same are presented for column and ball grid array (CGA and BGA) structures by using a transient solder paste on the electronic...
|