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6407930 |
Structure of printed circuit board with stacked daughter board
A structure of a printed circuit board with stacked daughter board. The structure has a motherboard and at least a daughter board. The motherboard has a first signal layer, a second signal layer, a...
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6407345 |
Printed circuit board and method of production thereof
A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58 b, 58 c and 58 d, and a wiring pattern 58 is...
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6403894 |
Printed wiring board with insect repellant
A printed wiring board to suppresses invasion and occupation of insects having sensory nerves such as cockroaches and ants. Accordingly, it prevents malfunctioning of electronic appliances due to...
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6403891 |
Metallization removal under the laser mark area for substrates
A printed circuit board which has an ink block and a first conductive layer that are attached to a solder mask. A first dielectric layer is attached to the first conductive layer. Indicia is formed...
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6403882 |
Protective cover plate for flip chip assembly backside
A chip package includes a die having an active surface and an inactive surface. An adhesive is formed on the inactive surface where the adhesive has a low Young's modulus of elasticity. The low...
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6403895 |
Wiring substance and semiconductor
A semiconductor device includes a wiring substrate which includes a wiring pattern provided per each wiring with a land covering an external terminal mounting perforation for mounting an external...
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6403893 |
Circuit board and a method for making the same
A method for making a multi-layer electronic circuit board 136 having electroplated apertures 96, 98 which may be selectively and electrically isolated from an electrically grounded member 46 ...
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6399895 |
Component hybridizing system allowing for defective planarity
System of components for hybridization including a first component ( 410 ) with a first set of hybridization studs ( 414 ), and at least a second component ( 412 ) with second hybridization studs (...
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6399897 |
Multi-layer wiring substrate
A multi-layer wiring substrate includes a main substrate and a plurality of insulating films stacked on the main substrate. The plurality of insulating films have wiring patterns formed on wiring...
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6399891 |
Multilayer boards
A multilayer board free from breakage at connecting parts due to thermal fatigue is provided. A multilayer board 1 of the present invention comprises alternating polyimide films 11-16 and...
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6399898 |
Technique for coupling signals between circuit boards
A technique for coupling a signal between a first circuit board and a second circuit board. In one embodiment, the first circuit board has a first signal conductor formed therein, and the second...
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6399889 |
Head interconnect circuit with alignment finger
A head interconnect circuit for connecting transducer elements of a data head to drive circuitry including an alignment finger on a lead tip for aligning leads relative to connectors or solder pads...
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6399899 |
Suspension board with circuit
To provide a suspension board with circuit that enables its terminals to be bonded to the other terminals with sufficient strength with simple structure, to ensure sufficient bonding reliability,...
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6396000 |
Printed circuit board and method for reducing radio frequency interference emissions from conductive traces on a printed circuit board
A printed circuit board includes a first helical conductive trace and a second helical conductive trace. The first helical conductive trace extends generally along a longitudinal axis of a layer of...
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6396001 |
Printed circuit board and method of making the same
A printed circuit board includes a rectangular, insulating substrate and a conductive land formed on the substrate. The land is arranged near a selected one of the longitudinal edges of the...
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6392162 |
Double-sided flexible jumper assembly and method of manufacture
A flexible asymmetrical jumper assembly is used to electrically join to circuit boards together where the geometry requires that the jumper be bent, often in a tight loop, so that the pads which...
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6392161 |
Mounting substrate
A mounting substrate includes: a base substrate having a usable substrate region used as part of a product and an unusable substrate region to be discarded, the base substrate being subjected to...
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6392148 |
Wire harness joint
The present invention provides a wire harness joint including a wiring circuit assembly and an insulation film or insulation films applied to the wiring circuit assembly, either on one or both...
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6392174 |
Printed circuit board with fixed contacts of switch formed thereon and switch using same
It is an object of the present invention to provide a printed circuit board with no likelihood of scattering of a powdery material from inner walls of mounting holes formed in the printed circuit...
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6392160 |
Backplane for radio frequency signals
A multi-layer backplane for processing radio frequency (RF) and other signals has alternating layers of conductive traces for RF signals and other types of signals, and ground plane layers of...
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6392159 |
Embedded structure for engineering change and repair of circuit boards
A circuit board structure is described for facilitating engineering changes for a multichip module mounted on the circuit board. The structure includes a first layer of a conductive material...
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6392163 |
Controlled-shaped solder reservoirs for increasing the volume of solder bumps
A controlled-shaped solder reservoir provides additional solder to a bump in the step for increasing the volume of solder forming the solder bump. The controlled shaped reservoirs can be shaped and...
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6388202 |
Multi layer printed circuit board
A high density multi-layer printed circuit board ( 100 ) is formed by building additional dielectric and metallization layers over a central core ( 110 ) of conventional PCB laminate construction....
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6388200 |
Electronic interconnection medium having offset electrical mesh plane
An electrical interconnection medium is provided having first and second overlying interconnection layers. Each interconnection layer includes parallel conductors, and the conductors of the first...
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6388890 |
Technique for reducing the number of layers in a multilayer circuit board
A technique for reducing the number of layers in a multilayer circuit board is disclosed. In one embodiment, the technique is realized by forming a first plurality of electrically conductive vias...
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6388207 |
Electronic assembly with trench structures and methods of manufacture
To accommodate the operational and structural requirements of high performance integrated circuits, an integrated circuit package includes conductive trenches that are formed within a substrate....
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6388205 |
Printed circuit board with shielded circuitry
A PCB board with in-board EMI shielding in which a prescribed electrical circuitry within a PCB is shielded from EMI by fabricating a uniform metal shielding enclosure therearound. The shielded...
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6388206 |
Microcircuit shielded, controlled impedance “Gatling gun”via
A “Gatling gun” via to interconnect circuitry from a first side of a substrate or printed circuit board, to a second side of the substrate or board. The present via structure comprises a center...
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6384345 |
Three dimensional circuit body and method of manufacturing the same
The three-dimensional circuit body of the present invention is obtained by the steps of forming an insulating layer formed on the three-dimensional, that is, corrugated car body frame, discharging...
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6383603 |
Printed wiring board and manufacturing method thereof
A printed wiring board with an increased strength of solder is provided by preventing solder bridge formation and increasing the amount of solder adherent thereto. A land ( 1 ) serving as a...
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6384346 |
Trace layout of a printed circuit board with AGP and PCI slots
A trace layout of a printed circuit board (PCB) is provided with a north bridge, at least a peripheral component interconnect (PCI) slot, and an accelerate graphics port (AGP) slot. The PCB...
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6384341 |
Differential connector footprint for a multi-layer circuit board
A multi-layer circuit board is provided that simultaneously optimizes impedance and interference within the multi-layer circuit board and a controlled impedance connector to which it is attached....
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6381837 |
Method for making an electronic circuit assembly
A method for producing an electronic circuit assembly (e.g., a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from...
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6384344 |
Circuit board for mounting electronic parts
A board for mounting electronic circuit parts includes a first connection terminal group including a plurality of connection terminals densely formed on the top surface of a substrate having...
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6379772 |
Avoiding polymer fill of alignment sites
A substrate comprising at least one optical fiducial hole and a plurality of holes surrounding at least substantially one-half of the at least one optical fiducial hole.
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6378199 |
Multi-layer printed-wiring board process for producing
A multi-layer printed-wiring board including a substrate having a plurality of wiring pattern layers sequentially transferred thereon, each wiring pattern layer containing an electrically...
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6376780 |
Method for strengthening air bridge circuits
A multilayer circuit board having strengthened air bridge crossover structures, and additive and subtractive methods for producing the same, wherein the circuit includes specially designed metallic...
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6376779 |
Printed circuit board having a plurality of spaced apart scrap border support tabs
A printed circuit board having a plurality of spaced apart scrap border support tabs along the perimeter. The board surfaces including the edges are coated with a conductive shielding material,...
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6376778 |
Printed circuit board assembly
A printed circuit board assembly comprises a circuit membrane, a printed circuit board, a cover plate and two screws. The cover plate has an arch-shaped bump formed thereon such that the ribbon...
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6372985 |
Package for electronic components
A package for electronic components includes a base substrate having at least one recess on a side surface thereof, the base substrate having electrodes on an upper surface and a bottom surface...
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6373000 |
Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board
A double-sided circuit board of which a solder conductor is prevented from deformation in a cycling test so as to maintain high connection reliability, comprises an insulating layer 2 made of an...
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6372998 |
Electrical component connecting structure of wiring board
An electrical component connecting structure for an electrical component having a terminal is disclosed. The electrical component connecting structure comprises an insulating plate and a bus bar....
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6369333 |
Flexible connection system
A method and apparatus for a connection system to a substrate is provided. The system includes a substrate having a mounting hole to permit an object to be coupled to the substrate. The substrate...
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6369331 |
Printed circuit board for semiconductor package and method of making same
A printed circuit board comprises an insulator film extending over the front surface of a substrate. The insulator film is designed to bend around the outer periphery of the substrate so as to...
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6369334 |
Printed circuit board with wire adds and component adds having 7-shaped and semicircular terminations
An electronic circuit card and a process of manufacturing the electronic circuit card. The process includes the steps of providing the electronic circuit card with external electrical circuits. A...
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6369330 |
Printed circuit board with pushbutton and air corridors
An improved structure of printed circuit board (PCB) under a pushbutton. The PCB includes a base layer and an insulation membrane, wherein conductive portions and corresponding contact portions are...
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6365842 |
Electrical circuits, circuits, and electrical couplings
The present invention includes electrical interconnections, methods of conducting electricity, and methods of reducing horizontal conductivity within an anisotropic conductive adhesive. In one...
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6366466 |
Multi-layer printed circuit board with signal traces of varying width
A multi-layer printed circuit board that includes a first layer and a second layer that have first and second signal traces, respectively. The first signal trace has a relatively thin section and a...
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6360435 |
Bidirectional interface tool for PWB development
A first printed wiring board (PWB, 102 ) has a first set of parallel printed wires ( 108 ) on one face and a second set of parallel printed wires ( 214 ) on the other face. The second set is...
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6362437 |
Mounting structure of integrated circuit device having high effect of buffering stress and high reliability of connection by solder, and method of mounting the same
A mounting structure of an integrated circuit device includes an integrated circuit device, a mounting board, a first solder bump, and a second solder bump. The integrated circuit device is mounted...
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