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6452808 |
Electronics module having power components, and a method of manufacture
A power electronics module has a metal substrate, a printed circuit card carried on one of the faces of the substrate, and components, at least some of which are power components, mounted on the...
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6452113 |
Apparatus for providing power to a microprocessor with integrated thermal and EMI management
A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference...
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6452114 |
Plug-in circuit board with reduced insertion force
A plug-in circuit board assembly requires reduced insertion force during connection to a plurality of shorting contacts in a socket or receptacle. The connector portion of the circuit board...
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6451509 |
Composite laminate circuit structure and method of forming the same
A method forming a composite laminate structure includes providing first and second circuit board element each having circuitry on at least one face thereof and plated through holes. A voltage...
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6452115 |
Circuit pattern for multi-layer circuit board for mounting electronic parts
A multi-layer circuit board for mounting an electronic part such as a semiconductor chip having as many pins as 40×40 pins arranged as an array on the side of the mounting surface or a...
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6448504 |
Printed circuit board and semiconductor package using the same
A printed circuit board with a reinforcing pattern. The printed circuit board includes lands formed in a wiring pattern at positions corresponding to formation positions of external connection...
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6448507 |
Solder mask for controlling resin bleed
Damage to and short circuiting of bond fingers on a substrate due to die-attach resin bleed is prevented, thereby increasing yield and improving reliability. Embodiments include forming a trough in...
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6448506 |
Semiconductor package and circuit board for making the package
Disclosed herein are semiconductor packages and stacks thereof. An example package includes an insulative substrate having a first surface, first apertures, a second aperture, and circuit traces on...
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6448508 |
Electrical component with a flexible strip of connecting conductors
An electrical component is provided with a flexible strip ( 10 ) of connection conductors ( 11-16 ), which comprises two conductors ( 11, 16 ) for testing continuity, which are connected by the...
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6448640 |
Ball array layout in chip assembly
The present invention relates to chip assembly with a ball array capacitance minimizing layout that includes a ball array disposed upon a substrate with trace routing laid out between each ball pad...
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6444923 |
Method of connecting printed wiring boards with each other, and printed circuit board
At one end of a printed wiring board, there is formed a narrow-pitched electrode pattern and engagement patterns made of the same material as that of the electrode pattern. At one end of an FPC...
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6444922 |
Zero cross-talk signal line design
In printed wiring boards, crosstalk can occur by the electrical coupling between nearby signal lines in a given layer. This source of noise degrades signal quality and is a major limiting factor in...
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6444925 |
Press-fit pin connection checking method and system
A press-fit pin connection checking method using a first printed circuit board having a plurality of through holes in which a plurality of press-fit pins of a first press-fit connector are adapted...
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6443743 |
Method for reducing via resistance in small high aspect ratio holes filled using aluminum extrusion
A method of forming an electrical interconnect through a via to electrically couple two electrically conductive layers and the device. There are provided a pair of electrically conductive layers...
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6444919 |
Thin film wiring scheme utilizing inter-chip site surface wiring
A thin film wiring scheme on a substrate. The thin film wiring scheme includes a plurality of chip connection pads at each of a first and second chip site on the substrate, a plurality of...
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6442832 |
Method for coupling a circuit board to a transmission line that includes a heat sensitive dielectric
A preferred method for coupling a transmission line to a circuit board includes the steps of: providing a circuit board with a first side and an opposing second side; dispensing solder upon the...
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6441316 |
Printed-circuit board and a semiconductor module, and a manufacturing process of the semiconductor module
A printed-circuit board of the present invention, comprises a circuit substrate 1 ; a plurality of patterned wires 3 formed on a surface of said circuit substrate 1 ; a plurality of lands 2 ,...
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6438829 |
Methods for fabricating and using a plurality of electrical contact devices
Each of a pair of composite structures includes at least one tubular member that is at least partially conductive and defines an electrical port. Each tubular member is electrically connected at a...
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6441314 |
Multilayered substrate for semiconductor device
A substrate of multilayered structure having a plurality of sets of an insulation layer and a wiring line layer, and having one face for mounting a semiconductor element thereon and the other face...
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6441320 |
Electrically conductive projections having conductive coverings
An electrically conductive apparatus includes, a) an electrically non-conducting substrate, the substrate having a base surface and an adjacent elevated surface, the elevated surface being spaced...
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6442041 |
MCM—MLC technology
Disclosed is a multilayer electronics packaging structure, especially for use in a multi chip module. By forming an overlap of signal conductors by the respective mesh conductors, an improved...
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6441318 |
Compensation adjustable printed circuit board
A printed circuit board which is easily compensation adjustable. The PCB has compensator traces which are directly above and parallel to each other. Each of the layers of the PCB contains...
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6437253 |
Terminal structure to which an electronic component is to be bonded
Connection terminals are provided on the upper surface of a film substrate. Each terminal comprises an electrodeconnecting part and a circular reinforcing part connected to the distal end of the...
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6437991 |
Radioelectronic unit
The invention relates to electronics and can be used in construction of electronic units performing the reception and processing of signals of the satellite radio navigation systems (SRNS). The...
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6434016 |
Apparatus for interconnecting multiple devices on a circuit board
A method and apparatus interconnecting multiple devices on a circuit board. One disclosed circuit board has a first attach region on a first surface for coupling a first set of pins from a first...
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6433287 |
Connection structure
There is provided a connection structure in which concentration of current in a connection portion of wirings, or of an element and a wiring is prevented. Three slits are formed in each of a first...
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6429387 |
Electronic component and mounting method and device therefor
An electronic component, such as a BGA component, and a method of positioning with respect to a mounting head the component. The BGA component is positioned through positional detection of a...
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6429383 |
Apparatus and method for improving circuit board solder
A circuit board includes electrical interconnect mounting pads for mounting electronic devices thereto. Some of the electrical interconnect mounting pads include a plated through hole which...
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6429388 |
High density column grid array connections and method thereof
The present invention relates generally to a new semiconductor chip carrier connections, where the chip carrier and the second level assembly are made by a surface mount technology. More...
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6429389 |
Via-in-pad apparatus and methods
The electrical contacts of an integrated circuit are coupled to printed circuit board (PCB) bonding pads that include vias. A method for fabricating an electronic assembly utilizes at least one...
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6429381 |
High density interconnect multichip module stack and fabrication method
A method for fabricating a substrate package for a high density interconnect multichip module stack comprises: providing a substrate having holes extending therethrough and having a bottom surface...
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6429390 |
Structure and method for forming the same of a printed wiring board having built-in inspection aids
A wiring board for mounting an electrical device, which has an array of connectors thereon arranged in a grid pattern, wherein the connectors have at least two levels of criticality of connection...
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6426466 |
Peripheral power board structure
A printed wiring board structure having peripheral power input. A printed wiring board having internal conductive layers, wherein each internal conductive layer contains a plurality of tabs...
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6426468 |
Circuit board
The circuit board of the present invention makes the length of the conductor patterns shorter and improves the electric performance for the high speed signal processing. The circuit board of the...
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6426467 |
Film carrier with adjacent electrical sorting pads
A film carrier tape includes: an insulating film; a plurality of lead terminals that are each disposed on the insulating film and provided with an end connected to a semiconductor chip; and...
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6423908 |
Substrate for use in forming electronic package
A substrate for use in forming an electronic package. The substrate is characterized by having adapted mark directly formed within bonding pads or a metal paddle. The bonding pads are adapted for...
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6423906 |
Surface mount package for long lead devices
Via holes are plated through the substrate of a surface mount package. The leads of an electronic device is inserted in the plated-through via holes. The bottom of the plated through metal is...
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6423909 |
Circuit board construction for differential bus distribution
A circuit board including differential bus traces on or buried within both sides of the board, interconnecting electronic devices such as disk drives, processors, and connectors for external...
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6420663 |
One layer spider interconnect
An integrated circuit device, including a substrate and a signal source disposed on the substrate. The signal. source is adapted to supply a pair of signals to a first plulrality of customers...
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6420662 |
Wiring board
A power source (ground) line, which would have been formed with a broad conducting path is divided into multiple fine-line interconnections. A short-circuiting joint is formed to connect between...
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6417462 |
Low cost and high speed 3-load printed wiring board bus topology
A multi layer printed circuit board with a 3-load topology is disclosed. First, second, and third integrated circuit (IC) printed wiring board packages having first, second, and third sets of...
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6416849 |
Method and structure to reduce low force pin pull failures in ceramic substrates
The surface metallurgy of a green sheet may be controlled during processing to provide an increased resistance to low strength structural failure of the metal-ceramic interface under an...
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6414249 |
Reduction of the probability of interlevel oxide failures by minimization of lead overlap area through bus width reduction
A field emission display apparatus has an emitter plate 2 having a plurality of column conductors 9 intersecting a plurality of row conductors 6 , and electron emitters 5 at the intersection...
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6414250 |
Hermetic multi-layered circuit assemblies and method of manufacture
Thin film, multi-layered components wherein the layers are hermetically sealed with a re-flowed conductive sealant (e.g. Pb/Sn solder). The sealant is applied to an endless ground conductor at the...
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6411506 |
High density web server chassis system and method
A web server chassis having a plurality of web server processing cards coupled with a midplane is provided. A first network interface card may also be coupled with the midplane. The midplane may...
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6407460 |
Multilayer circuit board
The present invention provides a multilayer circuit board for mounting thereon a semiconductor chip or other electronic elements having electrode terminals or other connection terminals which are...
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6407340 |
Electric conductor with a surface structure in the form of flanges and etched grooves
An electronics device comprising a carrier, such as a printed circuit board, a substrate or a chip, and an electric conductor on a surface of the carrier. The surface of the conductor ( 2 ) facing...
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6407343 |
Multilayer wiring board
A wiring layer on which X-directional signal lines 20 to 22 are arranged is formed on a multilayer board. Rectangular power-source conductive patterns 10 c are arranged each in which via...
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6407930 |
Structure of printed circuit board with stacked daughter board
A structure of a printed circuit board with stacked daughter board. The structure has a motherboard and at least a daughter board. The motherboard has a first signal layer, a second signal layer, a...
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6407345 |
Printed circuit board and method of production thereof
A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58 b, 58 c and 58 d, and a wiring pattern 58 is...
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