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7616452 Flex circuit constructions for high capacity circuit module systems and methods  
Provided circuit modules employ flexible circuitry populated with integrated circuitry (ICs). The flex circuitry is disposed about a rigid substrate. Contacts distributed along the flexible...
7615706 Layout of a printed circuit board  
A layout of a printed circuit board adaptive to be bonded to an integrated circuit device is introduced here. The layout includes a first metal layer, disposed in a first insulation layer and a...
7615705 Enhanced-reliability printed circuit board for tight-pitch components  
A printed circuit board is fabricated so contacts for tight-pitch components are at an angle with respect to the bundles of glass fibers in the epoxy-glass printed circuit board such that adjacent...
7612295 Printed wiring board and method for manufacturing the same  
In a printed wiring board, an odd number (n) of conductive layers ( 11 - 13 ) and insulating layers ( 21 - 23 ) are alternately laminated upon another. The first conductive layer ( 11 ) is...
7612294 Electrical component having a flat mounting surface  
An electrical component includes a base object made of two insulating objects with curved external surfaces, and external electrodes. Each of the external electrodes is disposed adjacent to one of...
7608789 Component arrangement provided with a carrier substrate  
A component arrangement includes a carrier substrate having at least one component arranged thereon. The carrier substrate contains at least one layer of glass film and an intermediate layer, which...
7608787 Semiconductor memory device and USB memory device using the same  
A USB terminal having a conductor layer to be an input/output terminal of a USB connector is formed on a first principle surface of a circuit board. A memory element is mounted on a second...
7603769 Method of coupling a surface mount device  
Methods of coupling a surface mount device with a substrate such as a printed circuit, for example, are disclosed. A method, according to one aspect, may include coupling a holder with a substrate...
7599192 Layered structure with printed elements  
The present invention incorporates electronic components into an electronic core structure that may be readily hot laminated by existing processes. The structure may include multiple desired...
7598459 Electronic board, method of manufacturing the same, and electronic device  
An electronic board includes: a substrate on which is formed an electronic circuit having a connection terminal; a stress-relaxation layer formed on the substrate; rearrangement wiring for the...
7595453 Surface mount package  
A surface mount package is provided that includes a first metal layer and a second metal layer configured to be electrically connected to the first metal layer. The surface mount package further...
7594318 Multilayer circuit board with embedded components and method of manufacture  
A multilayer substrate assembly ( 80 ) includes at least one embedded component ( 52 ) within a plurality of stacked pre-processed substrates. Each pre-processed substrate can have a core...
7589283 Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling system  
A method of making a circuitized substrate designed to substantially eliminate impedance disruptions during passage of signals through signal lines of the substrate's circuitry. The produced...
7586758 Integrated circuit stacking system  
The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The present invention can be used to advantage with packages of a variety of...
7586754 Printed wiring board and process for manufacturing the same  
The printed wiring board includes: a conductive wiring which is formed on a surface of a board and has a plurality of solder lands, to which components to be mounted are electrically connected by...
7586198 Innerlayer panels and printed wiring boards with embedded fiducials  
Innerlayer panels are provided with high density fiducials during manufacture. The fiducials can be identified using X-rays without etching away portions of the innerlayer panel to expose the...
7583512 Printed circuit board including embedded passive component  
Disclosed is a PCB including an embedded passive component and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one...
7583511 Semiconductor die package with internal bypass capacitors  
Embodiments of the present invention provide a computer system that reduces voltage noise for a processor chip. The computer system includes a package which is configured to be sandwiched between...
7582834 Printed circuit board having reduced mounting height  
A printed circuit board including an opening for receiving a semiconductor package having a plurality of external connections which protrude externally from side surfaces of the semiconductor...
7579554 Heat sink arrangement for electrical apparatus  
A printed circuit board ( 120 ) includes an insulating substrate ( 120 a ) on which conductive films ( 120 b ) are formed. Semiconductor devices ( 8 ) disposed external to the printed circuit board...
7579553 Front-and-back electrically conductive substrate  
A front-and-back electrically conductive substrate includes a plurality of posts composed of a material that can be anisotropically etched and having an electrically conductive portion that has at...
7573725 Optimizing power delivery and signal routing in printed circuit board design  
A system, method and apparatus for providing a printed circuit board having optimized power delivery planes and signal routing regions are disclosed. In one aspect, the present disclosure teaches a...
7571540 Production method of suspension board with circuit  
A method of producing a suspension board with circuit, wherein after an insulating base layer is formed on a metal supporting board, a conductive pattern including a ground wiring pattern and a...
7563990 Electronic product, a body and a method of manufacturing  
The electronic product comprises a body with a three-dimensional shape that is derived from the product. The body is provided with a pattern of conductors including contact pads and at least one...
7558077 Electronic device  
An electronic device which enables easily providing a mounting orientation recognition mark thereon while being provided with, on a end surface thereof, input/output terminals surrounded by a...
7557451 Electro-optical device and electronic apparatus  
An electro-optical device includes a substrate that holds an electro-optical material; and a flexible substrate that is connected to the substrate. The flexible substrate has a first connecting...
7554040 Printed circuit board and soldering method and apparatus  
A printed circuit board suitable for dip soldering of component leads in through holes using lead free solder. The printed circuit board includes a plurality of via holes arranged around each...
7554039 Electronic device  
In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a...
7550842 Integrated circuit assembly  
In an integrated circuit assembly, know good die (KGD) are assembled on a substrate. Interconnect elements electrically connect pads on a die attached to the substrate to traces or other electrical...
7548432 Embedded capacitor structure  
An embedded capacitor structure comprising a main body; at least one embedded capacitor, having a first electrode, a dielectric layer, and a second electrode, formed in the main body; and at least...
7547850 Semiconductor device assemblies with compliant spring contact structures  
Photolithography patterned spring contacts are disclosed. The spring contacts may be fabricated using thin film processing techniques. A substrate, such as a silicon wafer or a carrier substrate is...
7544899 Printed circuit board  
In a printed circuit board on which a first conductor pattern, a second conductor pattern of smaller area than the first conductor pattern and electronic components are mounted, a gap between a...
7544897 Connecting substrate, connecting structure. connection method and electronic apparatus  
A connecting substrate includes a first conductive member; an insulating layer; and a second conductive member, the first conductive member and the second conductive member facing each other via...
7542302 Minimizing thickness of deadfronted display assemblies  
An apparatus is provided and includes a label layer, disposed in a user visible interface of a front bezel, in which an icon is etched, a multi-layer printed circuit board (PCB), abutting a rear...
7537668 Method of fabricating high density printed circuit board  
A method of fabricating a high density printed circuit board by applying a strippable adhesive layer on a reinforced substrate (rigid substrate or carrier film) used as a base substrate, forming a...
7535724 Printed wiring board and a method of manufacturing the same  
This patent specification describes a printed wiring board which includes an insulating board, a wiring pattern, and a resistor pattern. The wiring pattern includes a metallic material and is...
7534966 Edge connection structure for printed circuit boards  
A printed circuit board (PCB) edge connection structure formed by a first PCB having one or more electronic components and printed circuitry provided thereon and a second PCB, having one or more...
7531755 Trimming of embedded structures  
The idea of the invention is to form a cavity in a multilayer substrate at the point of the structure to be trimmed. This enables the embedding of tolerance critical components inside substrates,...
7529093 Circuit device  
A first insulating layer is formed on the front surface of a circuit board, and a second insulating layer on the back surface. A conductive pattern is formed on the surface of the first insulating...
7528327 Inspection method and semiconductor device  
It is an object to provide an inspection method to enable simple and easy inspection of the electrical connecting state between a connecting terminal of a semiconductor integrated circuit over a...
7525817 Wiring layout of auxiliary wiring package and printed circuit wiring board  
A printed circuit board wiring system including a printed wiring circuit board having a plurality of conductive layers, at least one electronic part mounted on one side of the circuit board and...
7525816 Wiring board and wiring board connecting apparatus  
The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern...
7525812 Chip carrier and fabrication method  
A substrate having a ground plane, a first side, and a second side is provided. A via that electrically connects the first side to the second side is formed. A printed wire is formed on the first...
7523547 Method for attaching a flexible structure to a device and a device having a flexible structure  
Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached...
7522405 High current electrical switch and method  
A method and system are disclosed for a high current electrical switch. The switch may be suitable for switching, rectifying or blocking direct current in the range of one to a thousand amperes per...
7521779 Roughened printed circuit board  
A multi-layer structure including a base insulating layer and a thin metal film layer (seed layer) is prepared. A plating resist layer is formed to have a prescribed pattern on the upper surface of...
7515435 Multi-functional composite substrate structure  
A multi-functional composite substrate structure is provided. The first substrate with high dielectric constant and the second substrate with low dielectric constant and low loss tangent are...
7515434 Technique for enhancing circuit density and performance  
A technique for enhancing circuit density and performance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for enhancing circuit density and...
7514770 Stack structure of carrier board embedded with semiconductor components and method for fabricating the same  
A stack structure of a carrier board embedded with semiconductor components and a method for fabricating the same are proposed. The stack structure includes first and second carrier boards having a...
7511965 Circuit board device and manufacturing method thereof  
In a circuit board device having an electronic component mounted on an electrode land on a board by reflow soldering, voids that adversely affect the solder joint in various ways are prevented from...