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7402894 |
Integrated circuit carrier
The present invention relates to an integrated circuit carrier. The integrated circuit carrier includes a receiving plate to which an integrated circuit can be mounted and a plurality of electrical...
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7402755 |
Circuit board with quality-indicator mark and method for indicating quality of the circuit board
A circuit board with a quality-indicator mark and a method for indicating quality of the circuit board. The circuit board includes a plurality of circuit board units. A plating bus is formed around...
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7400512 |
Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor
A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing...
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7397672 |
Flip chip mounting substrate
The present invention provides a flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line...
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7397001 |
Multi-strand substrate for ball-grid array assemblies and method
A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board ( 11 ) having a plurality of BGA substrates ( 12 ) arranged in N rows ( 14 ) and...
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7397000 |
Wiring board and semiconductor package using the same
A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 μm and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or...
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7390973 |
Memory module and signal line arrangement method thereof
The pesent invention discloses a memory module and a signal line arrangement method thereof. The memory module includes memory chips mounted on both sidees in a mirror form; and a printed circuit...
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7389012 |
Electro-optical module comprising flexible connection cable and method of making the same
An electro-optical module comprising flexible connection cable and aligning capabilities is disclosed. Electro-optical devices may be soldered on a transparent substrate such as glass or a...
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7385792 |
Electronic control apparatus
An electronic control apparatus includes an exclusive power source line for a charge pump circuit which is discriminated from a common power source line. The exclusive power source line is...
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7382946 |
Electro-optical module comprising flexible connection cable and method of making the same
An electro-optical module comprising flexible connection cable and aligning capabilities is disclosed. Electro-optical devices may be soldered on a transparent substrate such as glass or a...
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7381905 |
Structure for fixing an electronic device to a substrate
A structure is disclosed for fixing an electronic device having a heat-releasing plate to a substrate. The structure includes a substrate, a land portion which is formed on a front face of the...
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7381904 |
Disk drive printed circuit board with component-dedicated alignment line indicators including inner and outer line segments
A printed circuit board on which multiple component-dedicated alignment line indicators including parallel lines may be used to facilitate the evaluation and segregation process during the...
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7379306 |
Multilayer substrate including components therein
Components having different heights are installed in a multilayer substrate using a metal core layer formed by bonding a plurality of metal layers. The metal core layer includes through-holes and a...
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7378601 |
Signal transmission structure and circuit substrate thereof
A signal transmission structure is provided. The structure mainly comprises at least a conductive via, at least a via land and a conductive wall. One end of the conductive via is connected to the...
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7378597 |
Multilayer printed circuit board
A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20 . Due to this, it is...
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7375971 |
Memory module with an electronic printed circuit board and a plurality of semiconductor chips of the same type
In a first embodiment, the invention provides a memory module having an electronic printed circuit board and a plurality of semiconductor chips of the same type that are mounted on at least one...
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7375290 |
Printed circuit board via with radio frequency absorber
A printed circuit board with vias that reduce or eliminate radio frequency interference and method of forming the same. The printed circuit board includes non-conductive layers, conductive-layers...
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7375288 |
Apparatuses and methods for improving ball-grid-array solder joint reliability
In some embodiments, apparatuses and methods for improving ball-grid-array solder joint reliability in printed circuit boards. Such apparatuses may comprise, in an exemplary embodiment, a stiffened...
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7375287 |
Assembly for accommodating the power electronics and control electronics of an electric motor
An arrangement to receive and accommodate the power and control electronics of an electric motor comprises a first circuit board mounted with control electronic components, a second circuit board...
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7375022 |
Method of manufacturing wiring board
A method of manufacturing a wiring board is disclosed. The wiring board has: a capacitor, having multiple electrode layers which oppose each other with a dielectric layer in between, that is...
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7370410 |
Method of manufacturing a device, device, non-contact type card medium, and electronic equipment
Wirings 2 B 1 are formed by application of heat treatment after an ink jet system is used to discharge a conductive liquid L onto a provisional substrate 5 having a predetermined repellent...
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7368666 |
Surface-mounting type electronic circuit unit without detachment of solder
A surface-mounting type electronic circuit unit includes pedestal bases. The pedestal bases are attached to first lands provided on the bottom surface of an insulating substrate and are made of...
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7365274 |
Electronic circuit board
A board for high frequency device includes a plurality of electrode terminals connected to an electronic component or another electronic circuit board by flowable conducting material such as...
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7365273 |
Thermal management of surface-mount circuit devices
A circuit board assembly having a laminate construction of multiple layers, such as a LTCC ceramic substrate, with conductor lines between adjacent pairs of layers. A heat sink is bonded to a first...
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7362586 |
Electronic component with shielding case and method of manufacturing the same
Shielding cases each include a pair of opposed first surfaces with catching pieces protruding therefrom and a pair of second surfaces without catching pieces. A motherboard forms substrates each...
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7361847 |
Capacitance laminate and printed circuit board apparatus and method
A method is for fabricating an embedded capacitance printed circuit board assembly ( 400, 1100 ). The embedded capacitance printed circuit board assembly includes two embedded capacitance...
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7361846 |
High electrical performance semiconductor package
A high electrical performance semiconductor package is proposed. A carrier is provided having a first surface, an opposite second surface, and conductive vias for electrically connecting the first...
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7361845 |
Wiring line for high frequency
Wiring lines for use at a high frequency having reduced resistance and/or inductance are disclosed that may be readily manufactured in a semiconductor integrated circuit. Wiring lines can include...
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7361844 |
Power converter package and thermal management
Power conversion apparatus includes a circuit board with power conversion circuitry and a package having an upper portion and a lower portion that respectively enclose circuitry on a top surface...
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7358446 |
Power distribution system
A power distribution system comprises a flexible power connector, a printed circuit board, a power supply, and a processor mounted on the printed circuit board. The flexible power connector...
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7358445 |
Circuit substrate and apparatus including the circuit substrate
The present invention provides a circuit substrate which has a substrate including a first surface and a second surface opposite to the first surface. A first and a second conductor patterns are...
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7355863 |
High frequency multilayer integrated circuit
A high frequency multilayer integrated circuit is provided with: a multilayer board including n earth conductor layers (n: integer of two or more than two) and (n-1) dielectric layers each arranged...
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7355127 |
Printed wiring board and electronic device using the same
The present invention provides a printed wiring board which has high insulation resistance between wirings and is unlikely to cause failures such as leakages or short circuits, attributable to ion...
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7355126 |
Electronic parts packaging method and electronic parts package
An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component...
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7352427 |
Display device
A display device which provides reliable connection between a semiconductor device and a printed circuit board includes a display panel, a printed circuit board disposed close to the display panel,...
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7352060 |
Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate
A multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring structure is disclosed. The multilayer wiring substrate includes a dielectric layer including a resin...
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7351916 |
Thin circuit board
A thin circuit board includes a dielectric layer with at least one cavity formed on a surface thereof; a metal pad formed in the cavity; at least one circuit layer formed on another surface of the...
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7351915 |
Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same
A printed circuit board (PCB) having at least one embedded capacitor and a method of fabricating the same is provided. A dielectric layer is formed using a ceramic material having a high...
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7350296 |
Method of fabricating a printed circuit board including an embedded passive component
Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit...
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7348497 |
Mounting structure for electronic components
A mounting structure for electronic components is provided with a circuit board that has a step portion formed at one end portion thereof. The step portion is sandwiched by a lead of the electronic...
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7348496 |
Circuit board with organic dielectric layer
Embodiments of the present invention include forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate, using an...
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7348495 |
Uniform force hydrostatic bolster plate
A method and apparatus to mount a uniform force hydrostatic bolster plate to a substrate. One embodiment of the invention involves a method to assemble a uniform force hydrostatic bolster plate on...
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7348494 |
Signal layer interconnects
Inner layer traces on a multilayer printed wiring board are exposed to enable direct interconnection with another device such as a printed wiring board. The traces may be exposed by removing at...
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7345246 |
Wiring board and capacitor to be built into wiring board
An intermediate board has a board core formed by a main core body and a sub-core portion. The main core body has a plate-like shape and includes an open sub-core housing portion in which the...
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7345245 |
Robust high density substrate design for thermal cycling reliability
A semiconductor package for a die with improved thermal cycling reliability. A first layer of the package provides ball pads dispersed throughout. A second layer of the package provides signal...
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7342802 |
Multilayer wiring board for an electronic device
To provide a multilayer wiring board mainly used for an electronic device, in which a bump passing through an interlayer insulating film allows for interlayer connection between plural wiring films...
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7342180 |
Flexible printed circuit and liquid crystal display device using same
An exemplary liquid crystal display device ( 200 ) includes a liquid crystal display panel ( 21 ), and a flexible printed circuit ( 2 ) joined to the liquid crystal display panel. The flexible...
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7342179 |
Electronic device and method for producing the same
An electronic device includes a plurality of components, nanoparticles to bond the components, and a receiving layer for holding the nanoparticles, the receiving layer being disposed on at least...
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7340826 |
Method for producing an electronic device connected to a printed circuit board
A configuration and also a method for the configuration in which, the configuration has at least one electronic device with associated contact connections and at least one printed circuit board...
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7339796 |
Electrical circuit having a multilayer printed circuit board
An electrical circuit includes a multilayer printed circuit board and a housing which shields against electromagnetic interference. A portion of at least one outer layer of the printed circuit...
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