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7616452 |
Flex circuit constructions for high capacity circuit module systems and methods
Provided circuit modules employ flexible circuitry populated with integrated circuitry (ICs). The flex circuitry is disposed about a rigid substrate. Contacts distributed along the flexible...
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7615706 |
Layout of a printed circuit board
A layout of a printed circuit board adaptive to be bonded to an integrated circuit device is introduced here. The layout includes a first metal layer, disposed in a first insulation layer and a...
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7615705 |
Enhanced-reliability printed circuit board for tight-pitch components
A printed circuit board is fabricated so contacts for tight-pitch components are at an angle with respect to the bundles of glass fibers in the epoxy-glass printed circuit board such that adjacent...
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7612295 |
Printed wiring board and method for manufacturing the same
In a printed wiring board, an odd number (n) of conductive layers ( 11 - 13 ) and insulating layers ( 21 - 23 ) are alternately laminated upon another. The first conductive layer ( 11 ) is...
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7612294 |
Electrical component having a flat mounting surface
An electrical component includes a base object made of two insulating objects with curved external surfaces, and external electrodes. Each of the external electrodes is disposed adjacent to one of...
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7608789 |
Component arrangement provided with a carrier substrate
A component arrangement includes a carrier substrate having at least one component arranged thereon. The carrier substrate contains at least one layer of glass film and an intermediate layer, which...
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7608787 |
Semiconductor memory device and USB memory device using the same
A USB terminal having a conductor layer to be an input/output terminal of a USB connector is formed on a first principle surface of a circuit board. A memory element is mounted on a second...
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7603769 |
Method of coupling a surface mount device
Methods of coupling a surface mount device with a substrate such as a printed circuit, for example, are disclosed. A method, according to one aspect, may include coupling a holder with a substrate...
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7599192 |
Layered structure with printed elements
The present invention incorporates electronic components into an electronic core structure that may be readily hot laminated by existing processes. The structure may include multiple desired...
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7598459 |
Electronic board, method of manufacturing the same, and electronic device
An electronic board includes: a substrate on which is formed an electronic circuit having a connection terminal; a stress-relaxation layer formed on the substrate; rearrangement wiring for the...
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7595453 |
Surface mount package
A surface mount package is provided that includes a first metal layer and a second metal layer configured to be electrically connected to the first metal layer. The surface mount package further...
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7594318 |
Multilayer circuit board with embedded components and method of manufacture
A multilayer substrate assembly ( 80 ) includes at least one embedded component ( 52 ) within a plurality of stacked pre-processed substrates. Each pre-processed substrate can have a core...
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7589283 |
Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling system
A method of making a circuitized substrate designed to substantially eliminate impedance disruptions during passage of signals through signal lines of the substrate's circuitry. The produced...
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7586758 |
Integrated circuit stacking system
The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The present invention can be used to advantage with packages of a variety of...
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7586754 |
Printed wiring board and process for manufacturing the same
The printed wiring board includes: a conductive wiring which is formed on a surface of a board and has a plurality of solder lands, to which components to be mounted are electrically connected by...
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7586198 |
Innerlayer panels and printed wiring boards with embedded fiducials
Innerlayer panels are provided with high density fiducials during manufacture. The fiducials can be identified using X-rays without etching away portions of the innerlayer panel to expose the...
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7583512 |
Printed circuit board including embedded passive component
Disclosed is a PCB including an embedded passive component and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one...
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7583511 |
Semiconductor die package with internal bypass capacitors
Embodiments of the present invention provide a computer system that reduces voltage noise for a processor chip. The computer system includes a package which is configured to be sandwiched between...
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7582834 |
Printed circuit board having reduced mounting height
A printed circuit board including an opening for receiving a semiconductor package having a plurality of external connections which protrude externally from side surfaces of the semiconductor...
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7579554 |
Heat sink arrangement for electrical apparatus
A printed circuit board ( 120 ) includes an insulating substrate ( 120 a ) on which conductive films ( 120 b ) are formed. Semiconductor devices ( 8 ) disposed external to the printed circuit board...
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7579553 |
Front-and-back electrically conductive substrate
A front-and-back electrically conductive substrate includes a plurality of posts composed of a material that can be anisotropically etched and having an electrically conductive portion that has at...
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7573725 |
Optimizing power delivery and signal routing in printed circuit board design
A system, method and apparatus for providing a printed circuit board having optimized power delivery planes and signal routing regions are disclosed. In one aspect, the present disclosure teaches a...
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7571540 |
Production method of suspension board with circuit
A method of producing a suspension board with circuit, wherein after an insulating base layer is formed on a metal supporting board, a conductive pattern including a ground wiring pattern and a...
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7563990 |
Electronic product, a body and a method of manufacturing
The electronic product comprises a body with a three-dimensional shape that is derived from the product. The body is provided with a pattern of conductors including contact pads and at least one...
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7558077 |
Electronic device
An electronic device which enables easily providing a mounting orientation recognition mark thereon while being provided with, on a end surface thereof, input/output terminals surrounded by a...
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7557451 |
Electro-optical device and electronic apparatus
An electro-optical device includes a substrate that holds an electro-optical material; and a flexible substrate that is connected to the substrate. The flexible substrate has a first connecting...
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7554040 |
Printed circuit board and soldering method and apparatus
A printed circuit board suitable for dip soldering of component leads in through holes using lead free solder. The printed circuit board includes a plurality of via holes arranged around each...
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7554039 |
Electronic device
In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a...
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7550842 |
Integrated circuit assembly
In an integrated circuit assembly, know good die (KGD) are assembled on a substrate. Interconnect elements electrically connect pads on a die attached to the substrate to traces or other electrical...
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7548432 |
Embedded capacitor structure
An embedded capacitor structure comprising a main body; at least one embedded capacitor, having a first electrode, a dielectric layer, and a second electrode, formed in the main body; and at least...
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7547850 |
Semiconductor device assemblies with compliant spring contact structures
Photolithography patterned spring contacts are disclosed. The spring contacts may be fabricated using thin film processing techniques. A substrate, such as a silicon wafer or a carrier substrate is...
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7544899 |
Printed circuit board
In a printed circuit board on which a first conductor pattern, a second conductor pattern of smaller area than the first conductor pattern and electronic components are mounted, a gap between a...
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7544897 |
Connecting substrate, connecting structure. connection method and electronic apparatus
A connecting substrate includes a first conductive member; an insulating layer; and a second conductive member, the first conductive member and the second conductive member facing each other via...
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7542302 |
Minimizing thickness of deadfronted display assemblies
An apparatus is provided and includes a label layer, disposed in a user visible interface of a front bezel, in which an icon is etched, a multi-layer printed circuit board (PCB), abutting a rear...
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7537668 |
Method of fabricating high density printed circuit board
A method of fabricating a high density printed circuit board by applying a strippable adhesive layer on a reinforced substrate (rigid substrate or carrier film) used as a base substrate, forming a...
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7535724 |
Printed wiring board and a method of manufacturing the same
This patent specification describes a printed wiring board which includes an insulating board, a wiring pattern, and a resistor pattern. The wiring pattern includes a metallic material and is...
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7534966 |
Edge connection structure for printed circuit boards
A printed circuit board (PCB) edge connection structure formed by a first PCB having one or more electronic components and printed circuitry provided thereon and a second PCB, having one or more...
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7531755 |
Trimming of embedded structures
The idea of the invention is to form a cavity in a multilayer substrate at the point of the structure to be trimmed. This enables the embedding of tolerance critical components inside substrates,...
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7529093 |
Circuit device
A first insulating layer is formed on the front surface of a circuit board, and a second insulating layer on the back surface. A conductive pattern is formed on the surface of the first insulating...
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7528327 |
Inspection method and semiconductor device
It is an object to provide an inspection method to enable simple and easy inspection of the electrical connecting state between a connecting terminal of a semiconductor integrated circuit over a...
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7525817 |
Wiring layout of auxiliary wiring package and printed circuit wiring board
A printed circuit board wiring system including a printed wiring circuit board having a plurality of conductive layers, at least one electronic part mounted on one side of the circuit board and...
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7525816 |
Wiring board and wiring board connecting apparatus
The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern...
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7525812 |
Chip carrier and fabrication method
A substrate having a ground plane, a first side, and a second side is provided. A via that electrically connects the first side to the second side is formed. A printed wire is formed on the first...
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7523547 |
Method for attaching a flexible structure to a device and a device having a flexible structure
Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached...
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7522405 |
High current electrical switch and method
A method and system are disclosed for a high current electrical switch. The switch may be suitable for switching, rectifying or blocking direct current in the range of one to a thousand amperes per...
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7521779 |
Roughened printed circuit board
A multi-layer structure including a base insulating layer and a thin metal film layer (seed layer) is prepared. A plating resist layer is formed to have a prescribed pattern on the upper surface of...
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7515435 |
Multi-functional composite substrate structure
A multi-functional composite substrate structure is provided. The first substrate with high dielectric constant and the second substrate with low dielectric constant and low loss tangent are...
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7515434 |
Technique for enhancing circuit density and performance
A technique for enhancing circuit density and performance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for enhancing circuit density and...
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7514770 |
Stack structure of carrier board embedded with semiconductor components and method for fabricating the same
A stack structure of a carrier board embedded with semiconductor components and a method for fabricating the same are proposed. The stack structure includes first and second carrier boards having a...
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7511965 |
Circuit board device and manufacturing method thereof
In a circuit board device having an electronic component mounted on an electrode land on a board by reflow soldering, voids that adversely affect the solder joint in various ways are prevented from...
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