Match Document Document Title
9040839 Wiring body connection structure  
A wiring body connection structure includes a first wiring body and a second wiring body, the first wiring body having a first base material made of an elastomer and a first wiring containing an...
9042108 Display device  
In a display device (100), a row of protruding electrodes (115) and a row of protruding electrodes (116) are formed on the connecting surface of a terminal section (112), the row of the protruding...
9041892 Tape substrate for chip on film structure of liquid crystal panel  
The present invention discloses a tape substrate for chip on film structure of a liquid crystal panel. The tape substrate is provided with plural package units of chip on film structures arranged...
9040837 Wiring board and method for manufacturing the same  
A wiring board includes a first multilayer wiring board having first conductive layers and having a surface, a second multilayer wiring board having second conductive layers and positioned such...
9042114 Electronic component  
An electronic component includes an interposer, and a multilayer ceramic capacitor. The interposer includes a substrate including front and back surfaces that are parallel or substantially...
9040840 Multilayer ceramic electronic component and mounting board therefor  
There is provided a multilayer ceramic electronic component comprising a ceramic body having a hexahedral shape, including dielectric layers, and satisfying T/W>1.0 when a length of the ceramic...
9035194 Circuit board with integrated passive devices  
Embodiments of the present disclosure are directed towards a circuit board having integrated passive devices such as inductors, capacitors, resistors and associated techniques and configurations....
9036364 Circuit board with signal layers of different dimensions to communicate signals of different frequencies  
Electronic devices to output signals at different frequencies are mounted to a circuit board that has a group of layers, where the group of layers include reference plane layers and signal layers...
9035193 Connecting member of electrical circuit  
A connecting member such as a terminal base is used in connection with a printed circuit board unit in which circuit elements such as a power module are mounted on a printed circuit board. The...
9029708 Printed circuit board and method of manufacturing the same  
A base insulating layer is formed on a suspension body. Read wiring patterns, write wiring patterns and a ground pattern are formed in parallel on the base insulating layer. A first cover...
9030836 Apparatus capable of selectively using different types of connectors  
An apparatus capable of selectively applying different types of connectors to a substrate is disclosed. The memory apparatus includes a substrate having a controller. First and second connector...
9027238 Multilayered printed circuit board and method for manufacturing the same  
A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a...
9024446 Element mounting substrate and semiconductor module  
Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic, and metal-core printed circuit boards adopted to improve the heat-radiation characteristic had...
9024206 Multilayered ceramic capacitor and board for mounting the same  
There is provided a multilayered ceramic capacitor including a ceramic body including a plurality of dielectric layers and having first and second main surfaces, first and second side surfaces,...
9024203 Embedded printed circuit board and method for manufacturing same  
A method for manufacturing an embedded printed circuit board includes the following steps. First, a circuit substrate is provided. The circuit substrate includes a base, a first wiring layer, and...
9024205 Advanced device assembly structures and methods  
A microelectronic assembly includes a first substrate having a surface and a first conductive element and a second substrate having a surface and a second conductive element. The assembly further...
9024204 Aresistive device with flexible substrate and method for manufacturing the same  
A resistive device includes a resistive layer, a flexible substrate arranged on the resistive layer, and an electrode layer. The electrode layer includes two electrode sections arranged below the...
9018537 Surface-mountable electronic device  
A surface-mountable electronic device free of leads has a plurality of solderable connection surfaces at its lower side, with at least one of the connection surfaces having a rectangular portion....
9018538 Wiring substrate having columnar protruding part  
A method of making a wiring substrate includes forming a first metal layer on a surface of a support member, the first metal layer having at least one columnar through hole that exposes the...
9013894 Printed circuit board and method for manufacturing the same  
A printed circuit board includes: a substrate; a land that is disposed on a surface of the substrate, and includes a central portion and a plurality of extended portions, the central portion...
9012264 Integrated circuit package including embedded thin-film battery  
An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated...
9012787 Electronic system for wave soldering  
An electronic board includes conducting traces having an upper surface at least partially sunken with respect to a gluing surface of the board. A surface mount technology electronic device for...
9013882 High-frequency module  
A high-frequency module has a multilayer board formed by laminating a plurality of sheets made of a thermoplastic resin material and subjecting the laminated sheets to thermocompression bonding,...
9006583 LCD module and liquid crystal display device  
A liquid crystal display module is disclosed and it includes a first printed circuit board, a second printed circuit board interconnected by a flat flexible cable, and a timing controller...
9006585 Device for surface mounting and capacitor element  
There is provided a device (1) for surface mounting that has a substrate (10) and a capacitor element loaded on a loading-side surface of the substrate and is integrally molded including the...
9006584 High voltage polymer dielectric capacitor isolation device  
An electronic isolation device is formed on a monolithic substrate and includes a plurality of passive isolation components. The isolation components are formed in three metal levels. The first...
9000304 Sealing member for piezoelectric resonator device and pieoelectric resonator device  
A sealing member for an electronic component package includes, on another principal surface of a base material constituting the sealing member for the electronic component package, an external...
8997343 Method for manufacturing multilayer printed circuit board  
A method for manufacturing multilayer printed circuit board includes step below. A metal substrate is provide, the metal substrate includes a number of substrate unit. A first insulating layer is...
9000303 Method for preparing a patterned electric circuit  
The invention provides a method for preparing a pattern for an electric circuit comprising the steps of: (a) providing a substrate; (b) providing a pattern of an inhibiting material for an...
9000305 Circuit configuration having a prescribed capacitance, and method and device for the production thereof  
The present invention relates to a circuit arrangement (1) having a prescribed electrical capacitance, comprising a substrate (S) having at least one metallic, electrically conductive conductor...
9000306 Interconnect board and electronic apparatus  
An electronic apparatus (100) has an electronic device (151), a power supply plane (121) and a power supply plane (122) disposed with a gap (123) therebetween, a connection member (152) that...
8988885 Electronic circuit module and method for producing the same  
An electronic circuit module includes a substrate with built-in component, a mount component mounted on the substrate with built-in component, a sealing portion covering the mount component, and a...
8987989 Organic light-emitting display device and input pad thereof  
An organic light-emitting display device includes a plurality of pixels on a substrate, and input pads coupled to the plurality of pixels through wirings, the input pads being connected to a...
8984746 Manufacture of a circuit board containing a component  
A method for the manufacture of a circuit board containing a component and circuit board containing a component. The invention is based on first manufacturing an intermediate product, which...
8982576 Printed wiring board, and method of supplying power and forming wiring for printed wiring board  
Provided is a printed wiring board including a power source, a plurality of LSIs, and a planar power supply wiring for supplying power from the power source to the LSIs. A plurality of partial...
8975535 Many-up wiring substrate, wiring substrate, and electronic device  
In a many-up wiring substrate including a base substrate having dividing grooves formed as part of main surfaces thereof, along boundaries of a plurality of wiring substrate regions, the plurality...
8975534 Flexible base material and flexible electronic device  
The invention provides a flexible base material and a flexible electronic device. The flexible base material includes a flexible substrate having a first surface and a second surface opposite to...
8975529 Interposer and electronic device using the same  
There is provided an interposer which meets the need of improving electrical reliability of an electronic device. An interposer includes a substrate including a penetrating-hole in a thickness...
8975528 Electronic device, wiring substrate, and method for manufacturing electronic device  
Even in an electronic device where electrodes are coupled electrically using a solder, sections to which electrodes of an electronic component are coupled are switched by a method other than...
8975533 Printed wiring board, method of soldering quad flat package IC, and air conditioner  
A printed wiring board has a solder-land group for placing a quad flat package IC, and the solder-land group consists of front solder-land groups and rear solder-land groups. The printed wiring...
8975525 Corles multi-layer circuit substrate with minimized pad capacitance  
A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed...
8975536 Wiring structure, display panel, and display device  
Provided is a wiring structure that can prevent circuit elements from breaking due to static electricity. The disclosed wiring structure includes: a transparent substrate 11; wiring lines 14 that...
8975532 Light-emitting diode arrangement for a high-power light-emitting diode and method for producing a light-emitting diode arrangement  
A light emitting diode arrangement, having at least one high power light emitting diode, the high power light emitting diode being mounted onto a flexible circuit board. A method is also disclosed...
8966748 Method for manufacturing an arrangement with a component on a carrier substrate and a method for manufacturing a semi-finished product  
The invention relates to a method for manufacturing an arrangement with a component on a carrier substrate, wherein the method encompasses the following steps: Manufacturing spacer elements on the...
8966749 Manufacturing method for protection circuit module of secondary battery  
A manufacturing method for a protection circuit module of a secondary battery is disclosed. The method includes mounting a die type circuit device to an FPCB. The mounting of the circuit device...
8971053 Wiring board and method for manufacturing the same  
A wiring board includes a first substrate having a penetrating hole penetrating through the first substrate, a built-up layer formed on a surface of the first substrate and including interlayer...
8969734 Terminal assembly with regions of differing solderability  
An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes a socket...
8963017 Multilayer board  
In a multilayer board, a stacked body includes thermoplastic resin films and low-fluidity resin films with conductive patterns, which are alternately stacked. The stacked body and a resin base...
8964409 Electronic module with EMI protection  
An electronic module with EMI protection is disclosed. The electronic module comprises a component (1) with contact terminals (2) and conducting lines (4) in a first wiring layer (3). There is...
8963016 Printed wiring board and method for manufacturing same  
Disclosed is a printed wiring board offering improved reliability through increased mechanical strength at the bottom of cavity areas for mounting components. A printed wiring board 10 is...