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7402894 Integrated circuit carrier  
The present invention relates to an integrated circuit carrier. The integrated circuit carrier includes a receiving plate to which an integrated circuit can be mounted and a plurality of electrical...
7402755 Circuit board with quality-indicator mark and method for indicating quality of the circuit board  
A circuit board with a quality-indicator mark and a method for indicating quality of the circuit board. The circuit board includes a plurality of circuit board units. A plating bus is formed around...
7400512 Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor  
A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing...
7397672 Flip chip mounting substrate  
The present invention provides a flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line...
7397001 Multi-strand substrate for ball-grid array assemblies and method  
A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board ( 11 ) having a plurality of BGA substrates ( 12 ) arranged in N rows ( 14 ) and...
7397000 Wiring board and semiconductor package using the same  
A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 μm and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or...
7390973 Memory module and signal line arrangement method thereof  
The pesent invention discloses a memory module and a signal line arrangement method thereof. The memory module includes memory chips mounted on both sidees in a mirror form; and a printed circuit...
7389012 Electro-optical module comprising flexible connection cable and method of making the same  
An electro-optical module comprising flexible connection cable and aligning capabilities is disclosed. Electro-optical devices may be soldered on a transparent substrate such as glass or a...
7385792 Electronic control apparatus  
An electronic control apparatus includes an exclusive power source line for a charge pump circuit which is discriminated from a common power source line. The exclusive power source line is...
7382946 Electro-optical module comprising flexible connection cable and method of making the same  
An electro-optical module comprising flexible connection cable and aligning capabilities is disclosed. Electro-optical devices may be soldered on a transparent substrate such as glass or a...
7381905 Structure for fixing an electronic device to a substrate  
A structure is disclosed for fixing an electronic device having a heat-releasing plate to a substrate. The structure includes a substrate, a land portion which is formed on a front face of the...
7381904 Disk drive printed circuit board with component-dedicated alignment line indicators including inner and outer line segments  
A printed circuit board on which multiple component-dedicated alignment line indicators including parallel lines may be used to facilitate the evaluation and segregation process during the...
7379306 Multilayer substrate including components therein  
Components having different heights are installed in a multilayer substrate using a metal core layer formed by bonding a plurality of metal layers. The metal core layer includes through-holes and a...
7378601 Signal transmission structure and circuit substrate thereof  
A signal transmission structure is provided. The structure mainly comprises at least a conductive via, at least a via land and a conductive wall. One end of the conductive via is connected to the...
7378597 Multilayer printed circuit board  
A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20 . Due to this, it is...
7375971 Memory module with an electronic printed circuit board and a plurality of semiconductor chips of the same type  
In a first embodiment, the invention provides a memory module having an electronic printed circuit board and a plurality of semiconductor chips of the same type that are mounted on at least one...
7375290 Printed circuit board via with radio frequency absorber  
A printed circuit board with vias that reduce or eliminate radio frequency interference and method of forming the same. The printed circuit board includes non-conductive layers, conductive-layers...
7375288 Apparatuses and methods for improving ball-grid-array solder joint reliability  
In some embodiments, apparatuses and methods for improving ball-grid-array solder joint reliability in printed circuit boards. Such apparatuses may comprise, in an exemplary embodiment, a stiffened...
7375287 Assembly for accommodating the power electronics and control electronics of an electric motor  
An arrangement to receive and accommodate the power and control electronics of an electric motor comprises a first circuit board mounted with control electronic components, a second circuit board...
7375022 Method of manufacturing wiring board  
A method of manufacturing a wiring board is disclosed. The wiring board has: a capacitor, having multiple electrode layers which oppose each other with a dielectric layer in between, that is...
7370410 Method of manufacturing a device, device, non-contact type card medium, and electronic equipment  
Wirings 2 B 1 are formed by application of heat treatment after an ink jet system is used to discharge a conductive liquid L onto a provisional substrate 5 having a predetermined repellent...
7368666 Surface-mounting type electronic circuit unit without detachment of solder  
A surface-mounting type electronic circuit unit includes pedestal bases. The pedestal bases are attached to first lands provided on the bottom surface of an insulating substrate and are made of...
7365274 Electronic circuit board  
A board for high frequency device includes a plurality of electrode terminals connected to an electronic component or another electronic circuit board by flowable conducting material such as...
7365273 Thermal management of surface-mount circuit devices  
A circuit board assembly having a laminate construction of multiple layers, such as a LTCC ceramic substrate, with conductor lines between adjacent pairs of layers. A heat sink is bonded to a first...
7362586 Electronic component with shielding case and method of manufacturing the same  
Shielding cases each include a pair of opposed first surfaces with catching pieces protruding therefrom and a pair of second surfaces without catching pieces. A motherboard forms substrates each...
7361847 Capacitance laminate and printed circuit board apparatus and method  
A method is for fabricating an embedded capacitance printed circuit board assembly ( 400, 1100 ). The embedded capacitance printed circuit board assembly includes two embedded capacitance...
7361846 High electrical performance semiconductor package  
A high electrical performance semiconductor package is proposed. A carrier is provided having a first surface, an opposite second surface, and conductive vias for electrically connecting the first...
7361845 Wiring line for high frequency  
Wiring lines for use at a high frequency having reduced resistance and/or inductance are disclosed that may be readily manufactured in a semiconductor integrated circuit. Wiring lines can include...
7361844 Power converter package and thermal management  
Power conversion apparatus includes a circuit board with power conversion circuitry and a package having an upper portion and a lower portion that respectively enclose circuitry on a top surface...
7358446 Power distribution system  
A power distribution system comprises a flexible power connector, a printed circuit board, a power supply, and a processor mounted on the printed circuit board. The flexible power connector...
7358445 Circuit substrate and apparatus including the circuit substrate  
The present invention provides a circuit substrate which has a substrate including a first surface and a second surface opposite to the first surface. A first and a second conductor patterns are...
7355863 High frequency multilayer integrated circuit  
A high frequency multilayer integrated circuit is provided with: a multilayer board including n earth conductor layers (n: integer of two or more than two) and (n-1) dielectric layers each arranged...
7355127 Printed wiring board and electronic device using the same  
The present invention provides a printed wiring board which has high insulation resistance between wirings and is unlikely to cause failures such as leakages or short circuits, attributable to ion...
7355126 Electronic parts packaging method and electronic parts package  
An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component...
7352427 Display device  
A display device which provides reliable connection between a semiconductor device and a printed circuit board includes a display panel, a printed circuit board disposed close to the display panel,...
7352060 Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate  
A multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring structure is disclosed. The multilayer wiring substrate includes a dielectric layer including a resin...
7351916 Thin circuit board  
A thin circuit board includes a dielectric layer with at least one cavity formed on a surface thereof; a metal pad formed in the cavity; at least one circuit layer formed on another surface of the...
7351915 Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same  
A printed circuit board (PCB) having at least one embedded capacitor and a method of fabricating the same is provided. A dielectric layer is formed using a ceramic material having a high...
7350296 Method of fabricating a printed circuit board including an embedded passive component  
Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit...
7348497 Mounting structure for electronic components  
A mounting structure for electronic components is provided with a circuit board that has a step portion formed at one end portion thereof. The step portion is sandwiched by a lead of the electronic...
7348496 Circuit board with organic dielectric layer  
Embodiments of the present invention include forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate, using an...
7348495 Uniform force hydrostatic bolster plate  
A method and apparatus to mount a uniform force hydrostatic bolster plate to a substrate. One embodiment of the invention involves a method to assemble a uniform force hydrostatic bolster plate on...
7348494 Signal layer interconnects  
Inner layer traces on a multilayer printed wiring board are exposed to enable direct interconnection with another device such as a printed wiring board. The traces may be exposed by removing at...
7345246 Wiring board and capacitor to be built into wiring board  
An intermediate board has a board core formed by a main core body and a sub-core portion. The main core body has a plate-like shape and includes an open sub-core housing portion in which the...
7345245 Robust high density substrate design for thermal cycling reliability  
A semiconductor package for a die with improved thermal cycling reliability. A first layer of the package provides ball pads dispersed throughout. A second layer of the package provides signal...
7342802 Multilayer wiring board for an electronic device  
To provide a multilayer wiring board mainly used for an electronic device, in which a bump passing through an interlayer insulating film allows for interlayer connection between plural wiring films...
7342180 Flexible printed circuit and liquid crystal display device using same  
An exemplary liquid crystal display device ( 200 ) includes a liquid crystal display panel ( 21 ), and a flexible printed circuit ( 2 ) joined to the liquid crystal display panel. The flexible...
7342179 Electronic device and method for producing the same  
An electronic device includes a plurality of components, nanoparticles to bond the components, and a receiving layer for holding the nanoparticles, the receiving layer being disposed on at least...
7340826 Method for producing an electronic device connected to a printed circuit board  
A configuration and also a method for the configuration in which, the configuration has at least one electronic device with associated contact connections and at least one printed circuit board...
7339796 Electrical circuit having a multilayer printed circuit board  
An electrical circuit includes a multilayer printed circuit board and a housing which shields against electromagnetic interference. A portion of at least one outer layer of the printed circuit...