Matches 301 - 350 out of 1832 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
6975516 Component built-in module and method for producing the same  
A component built-in module includes an insulating layer, wirings integrated with both surfaces of the insulating layer, a via connecting the wirings, and one or more components selected from an...
6974915 Printed wiring board interposer sub-assembly and method  
The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a...
6973715 Method of forming a multichip module having chips on two sides  
A method of forming a multichip module in which a thin film structure is formed on a temporary carrier and then an electrically insulating frame is attached to the thin film structure. A...
6972381 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument  
A semiconductor device and a method of manufacturing the semiconductor device includes: a first step of interposing a thermosetting anisotropic conductive material 16 between a substrate 12 and...
6971162 Localized enhancement of multilayer substrate thickness for high Q RF components  
An exemplary system and method for providing differential adjustment of the height of a multilayer substrate in localized areas for improved Q-factor performance of RF devices is disclosed as...
6967290 Circuit board  
A circuit board permits common use of the same circuit board without separately manufacturing the circuit board per providing destinations when similar circuit boards are manufactured for a...
6967282 Flip chip MMIC on board performance using periodic electromagnetic bandgap structures  
A hybrid assembly having improved cross talk characteristics includes a substrate having an upper surface. Conductive paths on the upper surface are provided for conducting high frequency signals....
6965162 Semiconductor chip mounting substrate and semiconductor device using it  
A semiconductor device designed to reduce the warp of a substrate due to curing contraction, etc. of an insulation pattern while forming the insulation pattern on the surface of a substrate so that...
6963034 Multilayer printed board with a double plane spiral interconnection structure  
An inductor device having plural spiral-shaped interconnection structures connected to each other and extending in plural power source layers, the power source layers being in different levels of a...
6963033 Ball grid array attaching means having improved reliability and method of manufacturing same  
An array of solder structures comprising a plurality of radially-curved exterior surfaces, each one enclosing a predetermined-sized cavity that can be used for flexibly joining together at...
6958527 Wiring board having interconnect pattern with land, and semiconductor device, circuit board, and electronic equipment incorporating the same  
A wiring board includes a substrate, and an interconnect pattern which is formed on the substrate and includes a land. A penetration hole, which exposes the substrate, is formed in the land. The...
6956173 Wiring board comprising granular magnetic film  
In order to provide a wiring board comprising a magnetic material effective in suppressing spurious radiation in semiconductor devices and electronic circuits and the like that operate at high...
6956166 Composite electronic component  
A composite electronic component that prevents the electrical connection between a conductive case member of the composite electronic component, which performs physical shielding against a physical...
6954984 Land grid array structure  
A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of...
6954126 Lead-less surface mount reed relay  
A reed relay or reed sensor device that is substantially lead-less and has minimal inductance can be manufactured as an individual unit or as a plurality of units. The reed relay or reed sensor...
6953987 Composite integrated circuit device having restricted heat conduction  
A composite integrated circuit is formed by being molded with a mold resin, including a seat member of a lead frame, a substrate attached on the seat member of the lead frame, a heater element, and...
6953899 Wiring board comprising granular magnetic film  
In order to provide a wiring board comprising a magnetic material effective in suppressing spurious radiation in semiconductor devices and electronic circuits and the like that operate at high...
6952352 Integrated circuit chip package with formable intermediate 3D wiring structure  
A formable wiring structure, an interposer with the formable wiring structure, a multichip module including the interposer and in particular a microprocessor and L2, L3 cache memory mounted on the...
6950315 High frequency module mounting structure in which solder is prevented from peeling  
In a high-frequency module mounting structure according to the present invention, a circuit board includes a reinforcing electrode on the lower surface thereof for increasing a mounting strength of...
6947295 Ball grid array package with an electromagnetic shield connected directly to a printed circuit board  
A ball grid array package includes a chip having a substrate with a bottom surface, a plurality of solder bumps projecting outwardly from the bottom surface of the substrate, and an electromagnetic...
6940168 Enhanced pad design for substrate  
A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of...
6940023 Printed-wiring board and electronic device  
The present invention provides a board ensuring no peel-off of a wall and a land, even if a part is soldered to the board with lead-free solder. The board 10 is comprised of N (N≧3) layer...
6939737 Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board  
An electronic device and coupled flexible circuit board and method of manufacturing. The electronic device is coupled to the flexible circuit board by a plurality of Z-interconnections. The...
6936769 Electronic part mounting substrate, electronic part, and semiconductor device  
An infrared emissive first insulating portion, which radiates heat transferred from a WCSP corresponding to an electronic part to a first conductive portion as infrared radiation with high...
6933449 Selective area solder placement  
A printed circuit board having at least one layer of conductive traces on an external surface has at least one preformed solder element placed on a conductive trace area of the printed circuit...
6930390 Flexible printed wiring boards  
An object of the present invention is to provide a simple process for manufacturing a flexible printed wiring board having fine metal bumps. A resin coating 21 and a resist film 24 are formed...
6930256 Integrated circuit substrate having laser-embedded conductive patterns and method therefor  
An integrated circuit substrate having laser-embedded conductive patterns provides a high-density mounting and interconnect structure for integrated circuits. Conductive patterns within channels on...
6928726 Circuit board with embedded components and method of manufacture  
A substrate assembly ( 10 ) and method of making same has at least one embedded component ( 25 ) in a via ( 24 ) of a substrate core ( 22 ) and includes a first adhesive layer ( 20 ) coupled to the...
6927347 Printed circuit board having through-hole protected by barrier and method of manufacturing the same  
A through-hole formed in a printed circuit board is prevented from being contaminated with water-resistant liquid coated on circuit elements. To prevent the water-resistant liquid from flowing into...
6927346 Surface mount technology to via-in-pad interconnections  
Apparatus and methods for interconnecting a SMT component interconnect to a via-in-pad (VIP) interconnect. A first reflowable material is deposited on the VIP bond pad. A sphere having a higher...
6925708 Method of shielding a printed circuit electronics card mounted on a metal substrate  
A method of manufacturing proposes an assembly including a printed-circuit electronics card mounted on a metal substrate, as well as a metal screening cover electrically connected to the substrate....
6925701 Method of making a series of resonant frequency tags  
A method of making a resonant frequency tag which resonates at a predetermined frequency. The method involves providing a first conductive pattern having an inductive element and a first land and a...
6924440 Printed wiring board, apparatus for electrically connecting an electronic element and a substrate, and method for manufacturing a printed wiring board  
An apparatus for electrically connecting an electronic element and a base includes an electrode region and a terminal region proximate the electrode region. A conductive paste is deposited on at...
6924439 Signal conducting applique and method for use with printed circuit board  
The invention herein pertains to improved methods and apparatus for electrically coupling components within a digital data system without the use of ribbon cables and other wires. The disclosed...
6921868 Trimming of embedded structures  
A cavity is formed in a multilayer substrate at the point of the structure to be trimmed. This enables the embedding of tolerance critical components inside substrates, such as printed circuit...
6921867 Stress release feature for PWBs  
An element, such as a PWB or PCB is provided with elongated lower-stiffness areas, which provide the element with areas of a lower deformation during deformation of the element, such as during a...
6919515 Stress accommodation in electronic device interconnect technology for millimeter contact locations  
The providing of an array interface of conductive joint members for use in forming interconnections between mating surfaces such as a pad on a surface mount electronic device and contacts on a...
6916994 Conformal sealing film  
Flatwire assembly having a number of conductive elements or traces position on the substrate of the flatwire. In order to protect the conductive element from environmental hazards such as moisture...
6914326 Solder ball landpad design to improve laminate performance  
A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary...
6914198 Electrical device allowing for increased device densities  
Disclosed is a device comprising a circuit having an active side and a non-active side, a package enclosing the active side of the circuit and not enclosing a portion of the non-active side of the...
6913952 Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages  
The invention encompasses methods of preparing interposers for utilization in semiconductor packages. The invention includes a method in which an interposer substrate having a surface and a...
6910894 Hands on instruction manual  
A manual for teaching and/or demonstrating the assembly and/or operation of a transmittable energy circuit, wherein the manual has a base hinged to a plurality of pages for folding the pages over...
6909056 Compliant electrical contact assembly  
A compliant electrical contact assembly for temporarily interfacing two electrical devices. The assembly includes a contact with a closed coil with opposed contact points and an axis that is angled...
6909055 Electrical device allowing for increased device densities  
A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be...
6909054 Multilayer printed wiring board and method for producing multilayer printed wiring board  
A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20 . Due to this, it is...
6909053 Circuit substrate connecting structure, liquid crystal display device having the connecting structure and mounting method of liquid crystal display device  
In connecting a connecting substrate 4 to a flexible substrate 5 connected to a terminal portion of one of substrates constituting a liquid crystal display panel through an anisotropic...
6903278 Arrangements to provide mechanical stiffening elements to a thin-core or coreless substrate  
In substrate packaging and mounting, such as for a flip chip mounted on a thin-core or coreless substrate, a high degree of rigidness and support is imparted to the substrate, to overcome...
6900544 Integrated circuit package and printed circuit board arrangement  
An integrated circuit package device ( 100, 200, 300 ) has a plurality of contact points including an inner portion of contact points ( 120 ) and an outer portion of contact points ( 110 ). The...
6900394 Electroless copper plating machine, and multi-layer printed wiring board  
A method is provided for removing plating blocking ions, such as anions, in pairs with copper ions and oxidant ions of a copper ion reducing agent from an electroless copper plating solution and...
6900393 Solder-bearing wafer for use in soldering operations  
A solder bearing—bearing wafer ( 100 ) is provided which is used to connect a first electronic device to a second electronic device. The wafer includes a substrate body having a first surface and...
Matches 301 - 350 out of 1832 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >