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7312404 |
Conductive contamination reliability solution for assembling substrates
A method and apparatus to eliminate conductive contamination reliability problems for assembled substrates, such as electrical arcing in power semiconductor leads. One embodiment of the invention...
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7312402 |
Method and apparatus for providing improved loop inductance of decoupling capacitors
A method and apparatus that provides improved loop inductance of decoupling capacitors. Vias are moved close to the pads and close to each other. Instead of placing power and ground vias on...
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7309838 |
Multi-layered circuit board assembly with improved thermal dissipation
A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature...
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7307221 |
Fabrication method and structure of PCB assembly, and tool for assembly thereof
A fabrication method and structure for a PCBA, and tool for assembly of the structure. The structure includes a circuit board, at least one first solder joint, a plurality of second solder joints,...
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7306466 |
Electrical printed circuit board
The invention relates to an electrical printed circuit board serving for electrical contact-connection of an integrated circuit. The printed circuit board has a dielectric forming the printed...
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7305509 |
Method and apparatus for zero stub serial termination capacitor of resistor mounting option in an information handling system
A method of implementing zero stub serial termination component mounting in an information handling system includes providing a first and second serial terminator option. The first serial...
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7304248 |
Multi-layer printed circuit board and method for manufacturing the same
A multi-layer printed circuit board includes: a resin substrate including a plurality of laminated thermoplastic resin films; a thin film resistor embedded in the resin substrate; and an electrode...
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7304247 |
Circuit board with at least one electronic component
A circuit board having, between the circuit board and a component arranged thereon, an electrical and mechanical connection of high mechanical-load-bearing ability. The circuit board includes at...
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7301102 |
Elevated track for support of signal lines on a printed circuit board assembly
A printed circuit board assembly utilizing an elevated track to support signal lines between components is disclosed. The track rests on a plurality of vertical supports, placed amid the...
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7301228 |
Semiconductor device, method for manufacturing same and thin plate interconnect line member
The present invention provides a low-profile and light-weight semiconductor device having improved product reliability and higher frequency performance. A multi-layer interconnect line structure is...
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7301103 |
Printed-wiring board, printed-circuit board and electronic apparatus
A printed-wiring board having a multiplayer structure including a plurality of insulating layers and a plurality of conducting layers includes a signal pattern provided in at least one of outermost...
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7301097 |
Printed-circuit board and electronic device
A printed-circuit board includes a shield pattern layer that is stacked on a surface layer with respect to at least one wiring pattern layer that includes a wide-pattern area having a wiring width...
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7301106 |
Image forming apparatus and electronic apparatus
In a laser beam printer, an elastic conductive member is disposed between a rotating axis of a transfer roller and a land portion of a power supply circuit board and the transfer roller is...
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7297876 |
Circuit board and method of manufacturing the same
Apply heat to thermoplastic resin film, which is eventually to become an insulating resin layer, and press the film against a mold for forming grooves on a surface of the film. Next, press-fit an...
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7295445 |
Holder for surface mount device during reflow
Methods and apparatus to couple a device, such as, for example, a surface mount device, with a substrate, such as, for example, a printed circuit, are disclosed. An apparatus, according to one...
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7292148 |
Method of variable position strap mounting for RFID transponder
A method of coupling an RFID chip to an antenna includes the steps of, iteratively until a test criterion is met, positioning an RFID chip relative to an antenna and testing the RFID chip and...
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7292450 |
High density surface mount part array layout and assembly technique
A printed wiring assembly comprising, a printed wiring board, a ball grid array coupled to the printed wiring board, and a high density surface mount part array disposed on the printed wiring board.
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7287321 |
Multi-layer board manufacturing method
Two types of resin films are prepared for manufacturing a multi-layer board containing a chip component. A fist type has a via hole for the chip component to be inserted into, while a second type...
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7288725 |
Wired circuit board
A wired circuit board prevents a sealing resin filled in an electronic component mounting portion from overflowing and spreading to a different area other than the electronic component mounting...
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7288729 |
Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same
A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided...
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7286366 |
Multilayer circuit board with embedded components and method of manufacture
A multilayer substrate assembly ( 80 ) includes at least one embedded component ( 52 ) within a plurality of stacked pre-processed substrates. Each pre-processed substrate can have a core...
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7286372 |
Transceiver module with PCB having embedded traces for EMI control
A PCB is provided that is suitable for use in applications where EMI control is of interest. The PCB includes circuitry that communicates with an edge connector having edge traces located on its...
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7285727 |
Flexible wiring boards for double-side connection
A flexible wiring board for double side connection is capable of improving the reliability of connection to circuit boards and a manufacturing process thereof. The flexible wiring board for...
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7284317 |
Method of producing printed circuit board with embedded resistor
Disclosed is a method of producing a printed circuit board (PCB) with an embedded resistor, in which a resistor with a desired shape and volume is precisely formed using a resistor paste so that...
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7283373 |
Electronic device
An electronic device comprises an IC provided with an array of pads a preselected number of which define inspection pads of the IC. A substrate has inspection patterns and is mounted on the IC so...
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7282648 |
Capacitor-embedded PCB having blind via hole and method of manufacturing the same
The present invention relates to a capacitor-embedded PCB and a method of manufacturing the same. The capacitor-embedded PCB includes a dielectric layer, a lower electrode layer formed under the...
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7282796 |
Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts
An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows...
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7281318 |
Method of manufacturing a composite structural member having an integrated electrical circuit
A method of manufacturing a composite structural member with an integrated electrical circuit is provided. The structural member includes a plurality of layers of structural reinforcement material,...
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7279771 |
Wiring board mounting a capacitor
In a capacitor-mounted wiring board, a plurality of wiring layers each patterned in a required shape are stacked with insulating layers interposed therebetween and are connected to each other via...
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7279642 |
Component with ultra-high frequency connections in a substrate
The present invention relates to contacting technology for signal connections in the substrate of an extremely high frequency module, in particular a microwave or millimeter wave module. The...
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7280370 |
Electronic package and circuit board having segmented contact pads
An electronic package has a circuit board including a substrate electrical circuitry including circuit traces and first and second contacts for connecting to surface mount device(s). The first and...
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7277298 |
Multi-terminal device and printed wiring board
According to the invention, even when high-speed differential signal pins are arranged on the inner side of a BGA, they can be wired on a printed wiring board at a low cost. In a multi-terminal...
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7276840 |
Structure with a plurality of substrates, its manufacturing method and crystal oscillator with the structure
The structure provided with a plurality of substrates of the present invention is provided with a plurality of substrates each provided with chip-shaped circuit devices connected by poles also used...
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7274105 |
Thermal conductive electronics substrate and assembly
An electronics assembly is provided including a circuit board substrate having a top surface and a bottom surface and a plurality of thermal conductive vias extending from the top surface to the...
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7273987 |
Flexible interconnect structures for electrical devices and light sources incorporating the same
A flexible interconnect structure allows for rapid dissipation of heat generated from an electrical device that includes light-emitting elements, such as light-emitting diodes (“LEDs”) and/or...
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7273988 |
Wiring board, and electronic device with an electronic part mounted on a wiring board, as well as method of mounting an electronic part on a wiring board
An electronic device is mounted on a wiring board, which includes: a substrate having through holes, and lands extending on surfaces of the substrate and adjacent to openings of the through holes....
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7271347 |
Wired circuit board
A wired circuit board is provided having excellent heat radiation characteristics, including when the semiconductor device is mounted on the wired circuit board by the flip chip mounting method. An...
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7271348 |
Providing decoupling capacitors in a circuit board
A circuit board includes first and second reference plane layers. A first decoupling capacitor is mounted to a surface of the first reference plane layer, and a second decoupling capacitor is...
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7268303 |
Circuit board, mounting structure of ball grid array, electro-optic device and electronic device
In a circuit board including a pad for mounting a ball grid array and a wiring, a mounting structure of the ball grid array, an electro-optic device, and an electronic device, the circuit board...
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7269028 |
Trace-pad interface for improved signal quality
A method of routing or laying out signal traces on printed wire or circuit board in order to improve signal transmission quality. The method includes routing a given signal trace such that it is...
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7266882 |
Method of manufacturing a miniaturized three- dimensional electric component
Manufacturing of miniaturized three-dimensional electric components are presented, as well as components manufactured by the methods. The manufacturing methods comprise micro-replication of at...
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7265994 |
Underfill film for printed wiring assemblies
A self supported underfill film ( 18 ) adhesively bonds surface mount integrated circuit packages ( 14 ) to a printed circuit board ( 10 ). The printed circuit board has conductive traces ( 12 )...
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7259335 |
Solder-bearing wafer for use in soldering operations
A solder-bearing wafer is provided for use in a soldering operation. The solder-bearing wafer is designed to provide a solder material which is used in a soldering operation for electrically...
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7259334 |
Multi-layer printed circuit with low noise
A multi-layer printed circuit board having a low noise characteristic, the multi-layer printed circuit board includes at least one circuit layer; at least one isolation line for dividing the at...
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7250576 |
Chip package having chip extension and method
A chip package including a chip extension for containing thermal interface material (TIM) and improves chip cooling, and a related method, are disclosed. In particular, the chip package includes a...
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7248138 |
Multi-layer printed circuit board inductor winding with added metal foil layers
The present invention provides an electromagnetic component formed from adjacent conducting layers of a multi-layer PCB and two additional conducting layers in contact with the PCB. The inventive...
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7247800 |
Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder
A module circuit board for a semiconductor device by a solder reflow process includes a plurality of pads on which the semiconductor device to be mounted, a plurality of terminals formed on a side...
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7245022 |
Semiconductor module with improved interposer structure and method for forming the same
Under the present invention, a semiconductor chip is electrically connected to a substrate (e.g., organic, ceramic, etc.) by an interposer structure. The interposer structure comprises an...
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7243410 |
Method for manufacturing a probe card
A method for manufacturing a probe card includes a first contact formation step of forming a first contact on a first surface of a first sacrificial substrate, a second contact formation step of...
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7240429 |
Manufacturing method for a printed circuit board
A conductor pattern is formed on a resin film which is made of a thermoplastic resin. Each single-sided conductor pattern film has via-holes filled with an electrically conductive paste. A printed...
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