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7365273 |
Thermal management of surface-mount circuit devices
A circuit board assembly having a laminate construction of multiple layers, such as a LTCC ceramic substrate, with conductor lines between adjacent pairs of layers. A heat sink is bonded to a first...
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7365274 |
Electronic circuit board
A board for high frequency device includes a plurality of electrode terminals connected to an electronic component or another electronic circuit board by flowable conducting material such as...
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7361845 |
Wiring line for high frequency
Wiring lines for use at a high frequency having reduced resistance and/or inductance are disclosed that may be readily manufactured in a semiconductor integrated circuit. Wiring lines can include...
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7362586 |
Electronic component with shielding case and method of manufacturing the same
Shielding cases each include a pair of opposed first surfaces with catching pieces protruding therefrom and a pair of second surfaces without catching pieces. A motherboard forms substrates each...
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7361847 |
Capacitance laminate and printed circuit board apparatus and method
A method is for fabricating an embedded capacitance printed circuit board assembly ( 400, 1100 ). The embedded capacitance printed circuit board assembly includes two embedded capacitance...
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7361844 |
Power converter package and thermal management
Power conversion apparatus includes a circuit board with power conversion circuitry and a package having an upper portion and a lower portion that respectively enclose circuitry on a top surface...
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7361846 |
High electrical performance semiconductor package
A high electrical performance semiconductor package is proposed. A carrier is provided having a first surface, an opposite second surface, and conductive vias for electrically connecting the first...
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7358446 |
Power distribution system
A power distribution system comprises a flexible power connector, a printed circuit board, a power supply, and a processor mounted on the printed circuit board. The flexible power connector...
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7358445 |
Circuit substrate and apparatus including the circuit substrate
The present invention provides a circuit substrate which has a substrate including a first surface and a second surface opposite to the first surface. A first and a second conductor patterns are...
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7355127 |
Printed wiring board and electronic device using the same
The present invention provides a printed wiring board which has high insulation resistance between wirings and is unlikely to cause failures such as leakages or short circuits, attributable to ion...
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7355126 |
Electronic parts packaging method and electronic parts package
An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component...
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7355863 |
High frequency multilayer integrated circuit
A high frequency multilayer integrated circuit is provided with: a multilayer board including n earth conductor layers (n: integer of two or more than two) and (n-1) dielectric layers each arranged...
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7351916 |
Thin circuit board
A thin circuit board includes a dielectric layer with at least one cavity formed on a surface thereof; a metal pad formed in the cavity; at least one circuit layer formed on another surface of the...
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7351915 |
Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same
A printed circuit board (PCB) having at least one embedded capacitor and a method of fabricating the same is provided. A dielectric layer is formed using a ceramic material having a high...
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7350296 |
Method of fabricating a printed circuit board including an embedded passive component
Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit...
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7352060 |
Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate
A multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring structure is disclosed. The multilayer wiring substrate includes a dielectric layer including a resin...
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7348496 |
Circuit board with organic dielectric layer
Embodiments of the present invention include forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate, using an...
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7348494 |
Signal layer interconnects
Inner layer traces on a multilayer printed wiring board are exposed to enable direct interconnection with another device such as a printed wiring board. The traces may be exposed by removing at...
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7348495 |
Uniform force hydrostatic bolster plate
A method and apparatus to mount a uniform force hydrostatic bolster plate to a substrate. One embodiment of the invention involves a method to assemble a uniform force hydrostatic bolster plate on...
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7348497 |
Mounting structure for electronic components
A mounting structure for electronic components is provided with a circuit board that has a step portion formed at one end portion thereof. The step portion is sandwiched by a lead of the electronic...
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7345246 |
Wiring board and capacitor to be built into wiring board
An intermediate board has a board core formed by a main core body and a sub-core portion. The main core body has a plate-like shape and includes an open sub-core housing portion in which the...
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7345245 |
Robust high density substrate design for thermal cycling reliability
A semiconductor package for a die with improved thermal cycling reliability. A first layer of the package provides ball pads dispersed throughout. A second layer of the package provides signal...
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7342180 |
Flexible printed circuit and liquid crystal display device using same
An exemplary liquid crystal display device ( 200 ) includes a liquid crystal display panel ( 21 ), and a flexible printed circuit ( 2 ) joined to the liquid crystal display panel. The flexible...
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7342179 |
Electronic device and method for producing the same
An electronic device includes a plurality of components, nanoparticles to bond the components, and a receiving layer for holding the nanoparticles, the receiving layer being disposed on at least...
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7340826 |
Method for producing an electronic device connected to a printed circuit board
A configuration and also a method for the configuration in which, the configuration has at least one electronic device with associated contact connections and at least one printed circuit board...
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7339796 |
Electrical circuit having a multilayer printed circuit board
An electrical circuit includes a multilayer printed circuit board and a housing which shields against electromagnetic interference. A portion of at least one outer layer of the printed circuit...
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7339118 |
Printed wiring board and method for manufacturing the same
In a printed wiring board, an odd number (n) of conductive layers ( 11 - 13 ) and insulating layers ( 21 - 23 ) are alternately laminated upon each other. The first conductive layer ( 11 ) is a...
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7339260 |
Wiring board providing impedance matching
A wiring board comprising: a plate core having a first main surface and a second main surface; conductor layers including a conductor line; dielectric layers laminated alternately with said...
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7336499 |
Flexible printed wiring board
An object of the present invention is to provide a flexible printed wiring board which relaxes stress concentration in the flexible printed wiring board during production steps, thereby preventing...
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7335571 |
Method of making a semiconductor device having an opening in a solder mask
A method for a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one...
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7331106 |
Underfill method
A process for selectively depositing a filled underfill material onto a die surface without covering solder bumps present on the die. The process entails microjetting a polymer matrix material, a...
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7329816 |
Electronic package with optimized lamination process
An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the...
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7327583 |
Routing power and ground vias in a substrate
A method for routing vias in a multilayer substrate is disclosed. One embodiment of a method may comprise providing a multilayer substrate with an internal bond surface having a plurality of...
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7326858 |
Printed circuit board with embedded capacitors and manufacturing method thereof
Disclosed is a printed circuit board which is advantageous in terms of high capacitance by embedding capacitors comprising polymer capacitor pastes with high-dielectric constant coated on an inner...
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7326857 |
Method and structure for creating printed circuit boards with stepped thickness
A method and structure are provided for creating printed circuit boards with stepped thickness. A non-laminating breakaway material layer is selectively placed between layers of the printed circuit...
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7326859 |
Printed circuit boards having pads for solder balls and methods for the implementation thereof
A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a...
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7323642 |
Thin printed circuit board for manufacturing chip scale package
Provided is a thin printed circuit board (PCB) for manufacturing a chip scale package (CSP). The thin printed circuit board includes a plurality of unit printed circuit boards, each of which is...
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7321099 |
Component mounting substrate and structure
To provide a component mounting substrate and a component mounting structure which absorb stresses caused by impact or by the difference in the thermal extension coefficient between substrate and...
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7321098 |
Laminate ceramic circuit board and process therefor
A circuit board assembly that makes use of a low-temperature co-fired ceramic (LTCC) substrate, and a process for producing the assembly. The substrate contains at least first and second regions...
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7321496 |
Flexible substrate, multilayer flexible substrate and process for producing the same
A flexible substrate comprises: a film; an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; a...
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7317250 |
High density memory card assembly
A high density memory card assembly having application for USB drive storage, flash and ROM memory cards, and similar memory card formats. A cavity is formed through a rigid laminate substrate....
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7317165 |
Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate
An intermediate substrate comprising: an intermediate substrate body containing an insulating material, and having a first face to be mounted with an semiconductor element and a second face...
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7315454 |
Semiconductor memory module
A semiconductor memory module includes an electronic printed circuit board with a contact strip and a plurality of semiconductor memory chips of identical type that are mounted on at least one...
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7314378 |
Printed circuit board, method of manufacturing a printed circuit board and electronic apparatus
According to one embodiment, a printed circuit board has a wiring board having through holes, a through-hole mount device having a lead, and a surface mount device. The lead is soldered in the...
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7312403 |
Circuit component mounting device
A circuit component mounting device includes a resin substrate, vias, a circuit component composed of a main body and electrode portions, a solder, and an insulative sealing resin that covers the...
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7312401 |
Flexible printed wiring board
A flexible printed wiring board includes a first conductor layer in the element mounting part adjacent to the top surface of the wiring board; a second conductor layer in the element mounting part...
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7312404 |
Conductive contamination reliability solution for assembling substrates
A method and apparatus to eliminate conductive contamination reliability problems for assembled substrates, such as electrical arcing in power semiconductor leads. One embodiment of the invention...
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7312402 |
Method and apparatus for providing improved loop inductance of decoupling capacitors
A method and apparatus that provides improved loop inductance of decoupling capacitors. Vias are moved close to the pads and close to each other. Instead of placing power and ground vias on...
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7309838 |
Multi-layered circuit board assembly with improved thermal dissipation
A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature...
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7307221 |
Fabrication method and structure of PCB assembly, and tool for assembly thereof
A fabrication method and structure for a PCBA, and tool for assembly of the structure. The structure includes a circuit board, at least one first solder joint, a plurality of second solder joints,...
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