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7531755 |
Trimming of embedded structures
The idea of the invention is to form a cavity in a multilayer substrate at the point of the structure to be trimmed. This enables the embedding of tolerance critical components inside substrates,...
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7528327 |
Inspection method and semiconductor device
It is an object to provide an inspection method to enable simple and easy inspection of the electrical connecting state between a connecting terminal of a semiconductor integrated circuit over a...
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7529093 |
Circuit device
A first insulating layer is formed on the front surface of a circuit board, and a second insulating layer on the back surface. A conductive pattern is formed on the surface of the first insulating...
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7525812 |
Chip carrier and fabrication method
A substrate having a ground plane, a first side, and a second side is provided. A via that electrically connects the first side to the second side is formed. A printed wire is formed on the first...
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7523547 |
Method for attaching a flexible structure to a device and a device having a flexible structure
Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached...
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7525816 |
Wiring board and wiring board connecting apparatus
The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern...
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7525817 |
Wiring layout of auxiliary wiring package and printed circuit wiring board
A printed circuit board wiring system including a printed wiring circuit board having a plurality of conductive layers, at least one electronic part mounted on one side of the circuit board and...
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7522405 |
High current electrical switch and method
A method and system are disclosed for a high current electrical switch. The switch may be suitable for switching, rectifying or blocking direct current in the range of one to a thousand amperes per...
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7521779 |
Roughened printed circuit board
A multi-layer structure including a base insulating layer and a thin metal film layer (seed layer) is prepared. A plating resist layer is formed to have a prescribed pattern on the upper surface of...
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7515435 |
Multi-functional composite substrate structure
A multi-functional composite substrate structure is provided. The first substrate with high dielectric constant and the second substrate with low dielectric constant and low loss tangent are...
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7515434 |
Technique for enhancing circuit density and performance
A technique for enhancing circuit density and performance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for enhancing circuit density and...
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7514770 |
Stack structure of carrier board embedded with semiconductor components and method for fabricating the same
A stack structure of a carrier board embedded with semiconductor components and a method for fabricating the same are proposed. The stack structure includes first and second carrier boards having a...
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7511965 |
Circuit board device and manufacturing method thereof
In a circuit board device having an electronic component mounted on an electrode land on a board by reflow soldering, voids that adversely affect the solder joint in various ways are prevented from...
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7507913 |
Multilayer printed wiring board
A package substrate free of malfunction or error even with an IC chip in a high frequency range, particularly an IC chip with a frequency exceeding 3 GHz, is provided. A conductor layer 34 P on a...
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7508062 |
Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs
The present invention is directed to a method of fabricating an integrated circuit package having decoupling capacitors using a package design conceived for use without decoupling capacitors. The...
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7507915 |
Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same
A stack structure of carrier boards embedded with semiconductor components and a method for fabricating the same are proposed. A first carrier board and a second carrier board, each of which having...
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7507914 |
Micro-castellated interposer
A miniature PWB with features that incorporate the required circuitry changes and component footprints, which has been enhanced with micro-castellations such as those found on ceramic surface mount...
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7505281 |
Multilayer wiring board for an electronic device
A multilayer wiring board includes a first insulating film and a first patterned metal wiring film extending along a first major surface thereof, and a second insulating film a second patterned...
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7501585 |
Semiconductor device support element with fluid-tight boundary
A support element and a semiconductor component including the support element, where the support element having at least one surface with a subregion for receiving a semiconductor device and at...
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7498522 |
Multilayer printed circuit board and manufacturing method thereof
A printed circuit board includes a product portion and a backing plate. Upper and lower surfaces of the backing plate are coated with solder masks with different material characteristics.
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7495930 |
Circuit board structure for high density processing of analog and digital signals
A circuit board which has a high speed digital circuit in close proximity to a sensitive analog structure has a grounded, conductive band interposed between them and a ground plane with two...
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7495179 |
Components with posts and pads
A packaged microelectronic element includes connection component incorporating a dielectric layer ( 22 ) carrying traces ( 58 ) remote from an outer surface ( 26 ), posts ( 48 ) extending from the...
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7493690 |
Method of attaching electronic components to printed circuit board and attachment structure thereof
In a method of attaching an electronic component to a printed circuit board by a plurality of screws that are inserted into corresponding through holes cut in the board from a surface of the board...
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7495929 |
Reference layer openings
A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein.
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7495178 |
Suspension board with circuit
A suspension board with circuit has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and including a terminal...
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7491894 |
Hybrid integrated circuit device
A hybrid integrated circuit device of the present invention includes: a circuit board having a front surface subjected to an insulation process; a conductive pattern formed on the front surface of...
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7491893 |
Mounting substrate and mounting method of electronic part
A mounting substrate includes a land connected to an electrode of an electronic part by a melt-capable connection member; and a connection member flow-generation part configured to generate a flow...
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7492326 |
Biodegradable radio frequency identification cards
A biodegradable RFID card includes a multiple-layer laminate with each layer being formed of a biodegradable material composition of a blend of between about 30-70% PLA and about 30-70% by weight...
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7488896 |
Wiring board with semiconductor component
An electronic device comprised of a wiring board with a semiconductor component. The device is unlikely to have any defects, such as cracks to a solder joint portion during a reflow process of a...
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7488895 |
Method for manufacturing component built-in module, and component built-in module
A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating...
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7488898 |
Land structure, printed wiring board, and electronic device
A land part where a connection part of an electronic part is soldered, includes a head end part. The head end part includes an inclination part. The inclination part may be formed by an end side....
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7488897 |
Hybrid multilayer substrate and method for manufacturing the same
A hybrid multilayer substrate includes a cavity in a laminate structure formed of a resin portion and a ceramic multilayer substrate, the resin portion has a protrusion portion, the ceramic...
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7484293 |
Semiconductor package and manufacturing method therefor
A semiconductor package that has a superior high frequency characteristics and that can obtain a large area for an internal wiring pattern is provided. According to the present invention, a...
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7479604 |
Flexible appliance and related method for orthogonal, non-planar interconnections
At least one flexible appliance ( 120 ) and related method ( 300 ) for orthogonal, non-planar interconnections of at least a first electronic interface ( 115 ) disposed on a substrate ( 110 ) to an...
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7477521 |
Isolating stress on a printed circuit board
Printed circuit boards (PCB's) with edge connectors undergo bending stresses whenever the edge connectors are plugged into mating connectors. The bending stresses causes deformation of the printed...
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7473852 |
Printed-circuit board and circuit unit incorporating the circuit board
A printed-circuit board and a circuit unit incorporating the circuit board. The printed-circuit board capable of achieving a suitable contact area of sealing resin includes a metal circuit pattern...
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7473853 |
Circuit device
The present invention provides a circuit device capable of controlling deformation of a circuit device while preventing an insulating layer from peeling from a substrate. The circuit device...
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7470863 |
Microelectronic device with mixed dielectric
A microelectronic device and method of making the microelectronic device is provided. A dielectric substrate having first and second surfaces is provided. A first component, located in the...
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7468490 |
Circuit substrate and electronic apparatus, fabrication process thereof
A circuit substrate comprises a lamination of plural resin insulation films and includes, on a surface and in an interior of the circuit substrate, plural interconnection layers. One of the plural...
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7465882 |
Ceramic substrate grid structure for the creation of virtual coax arrangement
Signal line conductors passing through vertical vias in an insulative substrate for supporting and interconnecting integrated circuit chips are provided with shielding conductors in adjacent vias...
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7465885 |
Circuit carrier and package structure thereof
A circuit carrier is provided. The circuit carrier includes a substrate, a patterned circuit layer, and a solder mask layer. The patterned circuit layer is deposed on a surface of the substrate and...
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7462939 |
Interposer for compliant interfacial coupling
In one aspect, the present invention provides interposers that can mechanically, electrically, and thermally interconnect first and second microelectronic components. An interposer in accordance...
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7462784 |
Heat resistant substrate incorporated circuit wiring board
This invention provides a multilayer printed wiring board which achieves fine pitches. A heat resistant substrate is incorporated in a multilayer printed wiring board and interlayer resin...
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7462783 |
Semiconductor package having a grid array of pin-attached balls
Semiconductor chip ( 1101 ) of a ball grid array device ( 1100 ) is mounted onto tape substrate ( 1102 ) using attach adhesive ( 1103 ). The metal layer on the top surface of substrate ( 1102 )...
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7459055 |
Bonding structure with buffer layer and method of forming the same
A bonding structure with a buffer layer, and a method of forming the same are provided. The bonding structure comprises a first substrate with metal pads thereon, a protection layer covered on the...
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7457132 |
Via stub termination structures and methods for making same
Vias are used in multilayer printed circuit boards to route electrical interconnects between layers. Some via constructions embodiments result in the formation of a via-stub section. Via stub...
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7456364 |
Using a thru-hole via to improve circuit density in a PCB
A printed circuit board includes multiple layers on which electrically conductive traces reside, where at least two of the electrically conductive traces each has a first portion formed on one...
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7453702 |
Printed wiring board
A printed wiring board comprises the insulating layer 11 ( 12 ); at least one resistance element 31 1 ( 31 2 ) comprising a metal as a main component has 0.5 to 5 μm of a roughened surface in...
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7449791 |
Printed circuit boards and method of producing the same
A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film...
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7446262 |
Laminated electronic component and method for producing the same
A laminated electronic component includes a ceramic substrate having a first groove provided on a principal surface thereof and extending to the side surfaces, and a resin sheet. The resin sheet...
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