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6509529 |
Isolated flip chip of BGA to minimize interconnect stress due to thermal mismatch
A wiring substrate with reduced thermal expansion stress. A wiring substrate, such as a laminated PWB, thin film circuit, lead frame, or chip carrier accepts an integrated circuit, such as a die, a...
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6506980 |
Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing device
A method of manufacturing a tape carrier comprises: a step of providing a tape carrier having bonding portions formed in rows in the width direction, repeating in the longitudinal direction, and...
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6506982 |
Multi-layer wiring substrate and manufacturing method thereof
A multi-layer wiring substrate capable of high density packaging, and a method of manufacturing the same, in which a carrier substrate, in which through holes can be easily formed in high density...
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6504108 |
Electrical connector having stand-offs between solder balls thereof
A ball grid array (BGA) socket ( 5 ) includes an insulative member ( 52 ), a number of conductive contacts ( 54 ) attached to the insulative member in an array and a number of solder balls ( 56 )...
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6504107 |
Electro-optic module and method for the production thereof
An assembly unit comprises a printed circuit board ( 10 ) and an optical component ( 54, 56, 58 ), the printed circuit board ( 10 ) being provided with at least one electro-optical component ( 16...
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6504104 |
Flexible wiring for the transformation of a substrate with edge contacts into a ball grid array
The transformation of An IC substrate with edge contacts into a ball grid array is accomplished using a flexible circuit that has terminals arranged planarly on the underside for receiving meltable...
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6501663 |
Three-dimensional interconnect system
A three-dimensional interconnect system is disclosed. The interconnect system electrically connects electrical devices that are disposed on different physical planes. The interconnect system...
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6501662 |
Motor driving inverter
A motor driving inverter comprises a first printed circuit board provided with electronic components, a heat conduction plate made of a metal with high heat conductivity and adhered at one surface...
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6499215 |
Processing of circuit boards with protective, adhesive-less covers on area array bonding sites
A method for processing circuit boards containing area array surface treated bonding sites, such as noble metal terminal pads of a Land Grid Array (LGA) assembly. The circuit board includes a...
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6498308 |
Semiconductor module
A semiconductor module includes a chip formed with an integrated circuit, a first external connecting terminal electrically connected to the integrated circuit, a printed wiring board having a...
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6498307 |
Electronic component package, printing circuit board, and method of inspecting the printed circuit board
A ball grid array (BGA) electronic component package having a configuration which is capable of improving mounting efficiency as well as preventing footprints from breaking away at...
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6497943 |
Surface metal balancing to reduce chip carrier flexing
A surface metal balancing structure for a chip carrier, and an associated method of fabrication, to reduce or eliminate thermally induced chip carrier flexing. A substrate, such as a chip carrier...
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6495773 |
Wire bonded device with ball-shaped bonds
A wire bonding method includes a first bonding process for forming a first ball-shaped part in a wire and bonding the first ball-shaped part to a first connected member; a ball-shaped part forming...
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6495769 |
Wiring board and production method thereof, and semiconductor apparatus
Provided is a wiring board and production method thereof, wherein production of wiring by a full additive method is achieved. This is extremely useful in forming fine copper wiring featuring a high...
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6493234 |
Electronic components mounting structure
According to the present invention, there is provided an electronic components mounting structure constituted by a plurality of electronic components having lead terminals respectively, and...
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6487084 |
Printed circuit board comprising an embedded functional element therein
A PCB comprising a substrate, at least one circuit layer and at least one insulating layer, characterized in that the PCB further comprises at least one embedded functional material such as a PTC,...
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6486410 |
Flexible printed circuit board with resilient tabs and method of mounting components thereon
The present invention uses the resilient behaviour of a flexible printed circuit board ( 10 ), both to mechanically clamp the components ( 20 ) in a permanent manner and to achieve good electrical...
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6484393 |
Method for wire bonding to flexible substrates
A method of electrically connecting an electronic component to the flexible printed wiring board may comprise the steps of: Providing an air permeable platen having a substantially flat front...
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6486411 |
Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate
A semiconductor module solder bonding of high reliability in which the heat resisting properties of the circuit substrate and electronic parts are taken into consideration. In order to achieve...
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6487082 |
Printed circuit board component packaging
A printed circuit board apparatus, configurations and methods are presented which provide for close spacing between the HUB and multiple processors as well as a common configuration for two or four...
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6486412 |
Wiring board, method for producing same, display device, and electronic device
In a wiring board having a mounting region on which an integrated circuit having a plurality of terminals is mounted, and having a plurality of substrate-side wiring lines to be connected to the...
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6483042 |
Substrate for mounting semiconductor integrated circuit device
Test terminals connected to output lead sections are divided into blocks, and in each of the blocks, an outermost pair of the test terminals extends inwards from the output lead sections to oppose...
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6483699 |
Baffle system for air cooled computer assembly
An air cooled computer assembly including a printed circuit board assembly or a U sized enclosure. The computer assembly also includes three 120 mm fans positioned at one end of the PCB assembly...
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6483043 |
Chip assembly with integrated power distribution between a wafer interposer and an integrated circuit chip
A chip assembly ( 162 ) with integrated power distribution between an integrated circuit chip ( 164 ) and a section of wafer interposer ( 166 ) is disclosed. The wafer interposer section ( 166 )...
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6479758 |
Wiring board, semiconductor package and semiconductor device
In a wiring board having a plurality of wiring layers, a plurality of signal wiring terminals and a plurality of power supply terminals are arranged on the principal plane of the wiring board, the...
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6480394 |
Method for the verification of the polarity, presence, alignment of components and short circuits on a printed circuits board
The invention relates to a method for the verification of the presence and proper orientation of a component on a printed circuit board. The board has a plurality of areas for receiving a component...
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6479763 |
CONDUCTIVE PASTE, CONDUCTIVE STRUCTURE USING THE SAME, ELECTRONIC PART, MODULE, CIRCUIT BOARD, METHOD FOR ELECTRICAL CONNECTION, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC PART
A conductive paste containing: conductive particles; foamable material which foams at the time of heating or decompression; and resin; characterized in that even after foaming of the foamable...
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6479757 |
Method of mounting a plurality of electronic parts on a circuit board
An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer....
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6479759 |
Submount, electronic assembly and process for producing the same
Electronic components, in particular opto-electronic components, are conventionally mounted onto a submount, on the surface of which there are located contact areas for the electrical contacting of...
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6479760 |
Printed wiring board for semiconductor plastic package
Provided is a printed wiring board for a chip size scale package, which overcomes the poor adhesion of solder balls to a base material which poor adhesion is caused by a recent decrease in the size...
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6477060 |
Dual channel bus routing using asymmetric striplines
A printed circuit board utilizes asymmetric striplines to accommodate a large number of transmission lines on a six-layer board. The asymmetric striplines are formed from two signal layers that are...
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6472598 |
Electromagnetic interference shield device with conductive encapsulant and dam
A package for a device includes a substrate having a common voltage plane and a mounting region. The device is mounted to the mounting region. An electrically conductive dam structure is disposed...
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6472613 |
Low-inductance connector for printed-circuit board
A low-inductance connection between a first component and a second component on a first surface of a first printed-circuit board includes a second conducting path in electrical communication with a...
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6472612 |
Printed circuit board with embedded thermocouple junctions
A first strip and a second strip of metal are embedded on a first layer of a printed circuit board (PCB) to form a junction. The junction has a first strip tail and a second strip tail. The first...
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6472610 |
Support structure for electronic component
A support structure of a piezoelectric vibrator greatly increase a bonding strength between a conductive bonding agent and a mounting substrate. The support structure may be provided in a...
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6472607 |
Electronic circuit board with known flow soldering warp direction
An electronic circuit board comprising a flow soldering surface and a plurality of lands is disclosed. The flow soldering surface has an upstream side, a downstream side, and a warp defining a warp...
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6469258 |
Circuit board for semiconductor package
A circuit board for semiconductor package is designed to provide a complete grounding with corresponding equipment in the manufacture of the semiconductor package based on a circuit board, thereby...
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6469257 |
Integrated circuit packages
An integrated circuit package is mounted on a socket pedestal. External terminals such as ball electrodes may be provided in an array on a mounting surface. Recessed sections can also be provided...
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6465746 |
Oscillator attachment structure preventing interference by beat signal
An oscillator attachment structure which prevents interference by a beat signal caused by mixture of a reference oscillation signal from a PLL circuit and an oscillation signal from an oscillator....
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6465745 |
Micro-BGA beam lead connection
A semiconductor package is provided including a die bearing a plurality of bonding pads and a substrate connected to the die by a connecting agent, the substrate including a plurality of conductive...
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6465747 |
Microelectronic assemblies having solder-wettable pads and conductive elements
A microelectronic assembly includes a component having one or more conductive pads, with each conductive pad having a plurality of solder-wettable strips extending outwardly away from a center, the...
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6466451 |
Electric connection box
A MOSFET 150 composed of a bare tip is surface mounted on a bus bar 141 disposed on the surface of an insulated plate 140 , and the MOSFET 150 is circuit connected to a bus bar substrate 14...
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6462282 |
Circuit board for mounting bare chip
A circuit board for mounting a bare chip in the form of a flip chip. A metallic foil for protecting circuits in a state insulated therefrom is arranged in an area where the bare chip is located.
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6462283 |
Semiconductor package with central circuit pattern
A printed wired board is provided, in which an area for extracting lines for plating of the printed wired board is made small and at the same time the number of the extracting lines for plating...
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6459048 |
Surface-mount electronic component
A surface-mount electronic component includes a terminal electrode film that is formed by various film-forming processes on the surface of a main unit of the surface-mount electronic component. A...
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6459593 |
Electronic circuit board
A technique for increasing electronic component density on circuit boards is disclosed. In one embodiment, the technique is realized as an improved electronic circuit board for enabling the...
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6459039 |
Method and apparatus to manufacture an electronic package with direct wiring pattern
An electronic package assembly for electrical interconnection between two electronic modules having differing conductive array parameters is disclosed. The electronic package assembly includes two...
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6455786 |
Wiring board and manufacturing method thereof and semiconductor device
A wiring board and electrode of a semiconductor element are connected with each other by the method of wire bonding, and problems arising from the thermal stress generated in the process of...
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6455785 |
Bump connection with stacked metal balls
A bump connection is formed by stacking at least two metallic balls of different kinds of metals on a conductor of an electronic component such as a semiconductor device. The bump connection is...
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6452808 |
Electronics module having power components, and a method of manufacture
A power electronics module has a metal substrate, a printed circuit card carried on one of the faces of the substrate, and components, at least some of which are power components, mounted on the...
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