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6515865 |
Cylindrical battery clip for key fobs
An improved and low cost electrical connection for use in circuit boards for key fobs incorporates a plurality of generally cylindrical pin members which are symmetric about a central axis. The use...
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6512680 |
Semiconductor package
In a semiconductor package which contains an IC element therein and effects the inputting and outputting of a signal to the IC element through a plurality of pads, a group of signals is...
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6512185 |
Printed-wiring board
The invention provides a printed-wiring board that is capable of preventing the lift-off phenomenon without changing the related process for fabricating related printed-wiring boards. A...
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6512184 |
Anisotropically electroconductive connection body and method for forming it
An anisotropically electroconductive connection body, in which two elements, each having electrodes on a confronting face, are connected with each other. The connection body is made up of a...
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6512183 |
Electronic component mounted member and repair method thereof
An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic...
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6512182 |
Wiring circuit board and method for producing same
The invention relates to a wiring circuit board including an electronic device disposed in a hole of the wiring circuit board; a resin filling the hole such that the electronic device is embedded...
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6509531 |
Monolithic ceramic electronic component, method for manufacturing the same, and electronic device
A monolithic electronic component includes a composite body having a plurality of stacked ceramic layers. The ceramic layers include interconnecting conductors provided in each of the ceramic...
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6509530 |
Via intersect pad for electronic components and methods of manufacture
To mount electronic components on a printed circuit board (PCB), the electrical contacts of the components are coupled to PCB bonding pads that are intersected by via pads. To minimize various...
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6509529 |
Isolated flip chip of BGA to minimize interconnect stress due to thermal mismatch
A wiring substrate with reduced thermal expansion stress. A wiring substrate, such as a laminated PWB, thin film circuit, lead frame, or chip carrier accepts an integrated circuit, such as a die, a...
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6506982 |
Multi-layer wiring substrate and manufacturing method thereof
A multi-layer wiring substrate capable of high density packaging, and a method of manufacturing the same, in which a carrier substrate, in which through holes can be easily formed in high density...
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6506980 |
Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing device
A method of manufacturing a tape carrier comprises: a step of providing a tape carrier having bonding portions formed in rows in the width direction, repeating in the longitudinal direction, and...
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6504108 |
Electrical connector having stand-offs between solder balls thereof
A ball grid array (BGA) socket ( 5 ) includes an insulative member ( 52 ), a number of conductive contacts ( 54 ) attached to the insulative member in an array and a number of solder balls ( 56 )...
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6504107 |
Electro-optic module and method for the production thereof
An assembly unit comprises a printed circuit board ( 10 ) and an optical component ( 54, 56, 58 ), the printed circuit board ( 10 ) being provided with at least one electro-optical component ( 16...
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6504104 |
Flexible wiring for the transformation of a substrate with edge contacts into a ball grid array
The transformation of An IC substrate with edge contacts into a ball grid array is accomplished using a flexible circuit that has terminals arranged planarly on the underside for receiving meltable...
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6501663 |
Three-dimensional interconnect system
A three-dimensional interconnect system is disclosed. The interconnect system electrically connects electrical devices that are disposed on different physical planes. The interconnect system...
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6501662 |
Motor driving inverter
A motor driving inverter comprises a first printed circuit board provided with electronic components, a heat conduction plate made of a metal with high heat conductivity and adhered at one surface...
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6499215 |
Processing of circuit boards with protective, adhesive-less covers on area array bonding sites
A method for processing circuit boards containing area array surface treated bonding sites, such as noble metal terminal pads of a Land Grid Array (LGA) assembly. The circuit board includes a...
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6498308 |
Semiconductor module
A semiconductor module includes a chip formed with an integrated circuit, a first external connecting terminal electrically connected to the integrated circuit, a printed wiring board having a...
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6498307 |
Electronic component package, printing circuit board, and method of inspecting the printed circuit board
A ball grid array (BGA) electronic component package having a configuration which is capable of improving mounting efficiency as well as preventing footprints from breaking away at...
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6497943 |
Surface metal balancing to reduce chip carrier flexing
A surface metal balancing structure for a chip carrier, and an associated method of fabrication, to reduce or eliminate thermally induced chip carrier flexing. A substrate, such as a chip carrier...
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6495773 |
Wire bonded device with ball-shaped bonds
A wire bonding method includes a first bonding process for forming a first ball-shaped part in a wire and bonding the first ball-shaped part to a first connected member; a ball-shaped part forming...
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6495769 |
Wiring board and production method thereof, and semiconductor apparatus
Provided is a wiring board and production method thereof, wherein production of wiring by a full additive method is achieved. This is extremely useful in forming fine copper wiring featuring a high...
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6493234 |
Electronic components mounting structure
According to the present invention, there is provided an electronic components mounting structure constituted by a plurality of electronic components having lead terminals respectively, and...
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6492598 |
Printed circuit board assembly and method for making a printed circuit board assembly
A PCB assembly which allows economical and reliable rework. The PCB assembly contains a soldermask and a trace with a portion of the trace exposed by a soldermask relief. When one needs to rework...
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6487084 |
Printed circuit board comprising an embedded functional element therein
A PCB comprising a substrate, at least one circuit layer and at least one insulating layer, characterized in that the PCB further comprises at least one embedded functional material such as a PTC,...
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6487083 |
Multilayer circuit board
A technique for improving electrical signal performance in multilayer circuit boards by eliminating the need for electrically conductive vias is disclosed. In one embodiment, the technique is...
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6487082 |
Printed circuit board component packaging
A printed circuit board apparatus, configurations and methods are presented which provide for close spacing between the HUB and multiple processors as well as a common configuration for two or four...
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6486412 |
Wiring board, method for producing same, display device, and electronic device
In a wiring board having a mounting region on which an integrated circuit having a plurality of terminals is mounted, and having a plurality of substrate-side wiring lines to be connected to the...
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6486411 |
Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate
A semiconductor module solder bonding of high reliability in which the heat resisting properties of the circuit substrate and electronic parts are taken into consideration. In order to achieve...
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6486410 |
Flexible printed circuit board with resilient tabs and method of mounting components thereon
The present invention uses the resilient behaviour of a flexible printed circuit board ( 10 ), both to mechanically clamp the components ( 20 ) in a permanent manner and to achieve good electrical...
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6484393 |
Method for wire bonding to flexible substrates
A method of electrically connecting an electronic component to the flexible printed wiring board may comprise the steps of: Providing an air permeable platen having a substantially flat front...
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6483699 |
Baffle system for air cooled computer assembly
An air cooled computer assembly including a printed circuit board assembly or a U sized enclosure. The computer assembly also includes three 120 mm fans positioned at one end of the PCB assembly...
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6483043 |
Chip assembly with integrated power distribution between a wafer interposer and an integrated circuit chip
A chip assembly ( 162 ) with integrated power distribution between an integrated circuit chip ( 164 ) and a section of wafer interposer ( 166 ) is disclosed. The wafer interposer section ( 166 )...
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6483042 |
Substrate for mounting semiconductor integrated circuit device
Test terminals connected to output lead sections are divided into blocks, and in each of the blocks, an outermost pair of the test terminals extends inwards from the output lead sections to oppose...
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6483041 |
Micro soldered connection
The invention is directed to techniques for forming a soldered connection using a pin having a channel. The channel enables the pin to form a secure connection with a via (e.g., by facilitating gas...
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6480394 |
Method for the verification of the polarity, presence, alignment of components and short circuits on a printed circuits board
The invention relates to a method for the verification of the presence and proper orientation of a component on a printed circuit board. The board has a plurality of areas for receiving a component...
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6479763 |
CONDUCTIVE PASTE, CONDUCTIVE STRUCTURE USING THE SAME, ELECTRONIC PART, MODULE, CIRCUIT BOARD, METHOD FOR ELECTRICAL CONNECTION, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC PART
A conductive paste containing: conductive particles; foamable material which foams at the time of heating or decompression; and resin; characterized in that even after foaming of the foamable...
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6479760 |
Printed wiring board for semiconductor plastic package
Provided is a printed wiring board for a chip size scale package, which overcomes the poor adhesion of solder balls to a base material which poor adhesion is caused by a recent decrease in the size...
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6479759 |
Submount, electronic assembly and process for producing the same
Electronic components, in particular opto-electronic components, are conventionally mounted onto a submount, on the surface of which there are located contact areas for the electrical contacting of...
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6479758 |
Wiring board, semiconductor package and semiconductor device
In a wiring board having a plurality of wiring layers, a plurality of signal wiring terminals and a plurality of power supply terminals are arranged on the principal plane of the wiring board, the...
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6479757 |
Method of mounting a plurality of electronic parts on a circuit board
An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer....
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6477060 |
Dual channel bus routing using asymmetric striplines
A printed circuit board utilizes asymmetric striplines to accommodate a large number of transmission lines on a six-layer board. The asymmetric striplines are formed from two signal layers that are...
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6473311 |
Gate area relief strip for a molded I/C package
A method and device for providing a relief area on the surface of a molded I/C package. Specifically, a method of reducing delamination at the gate area of a molded I/C package by disposing an area...
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6472613 |
Low-inductance connector for printed-circuit board
A low-inductance connection between a first component and a second component on a first surface of a first printed-circuit board includes a second conducting path in electrical communication with a...
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6472612 |
Printed circuit board with embedded thermocouple junctions
A first strip and a second strip of metal are embedded on a first layer of a printed circuit board (PCB) to form a junction. The junction has a first strip tail and a second strip tail. The first...
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6472611 |
Conductive pedestal on pad for leadless chip carrier (LCC) standoff
A device and method for insuring the separation between a leadless chip carrier and printed wiring board, comprising aligning and attaching conductive pedestals to contact pads of either member and...
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6472610 |
Support structure for electronic component
A support structure of a piezoelectric vibrator greatly increase a bonding strength between a conductive bonding agent and a mounting substrate. The support structure may be provided in a...
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6472607 |
Electronic circuit board with known flow soldering warp direction
An electronic circuit board comprising a flow soldering surface and a plurality of lands is disclosed. The flow soldering surface has an upstream side, a downstream side, and a warp defining a warp...
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6472598 |
Electromagnetic interference shield device with conductive encapsulant and dam
A package for a device includes a substrate having a common voltage plane and a mounting region. The device is mounted to the mounting region. An electrically conductive dam structure is disposed...
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6469371 |
Non-contact type IC card and process for manufacturing same
A non-contact type IC card includes an insulating film having first and second surfaces. A plane coil is arranged on the first surface of the film. A semiconductor element is arranged on the first...
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