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6627822 |
Electronic assembly with separate power and signal connections
A electronic assembly is disclosed and claimed. The electronic assembly includes a first substrate and a second substrate. A plurality of power connections are coupled between the first substrate...
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6624362 |
Electronically detectable resonance label, in particular RFID label
An electronically detectable resonance label, in particular an RFID label, includes a substrate made of plastic foil and conductive surfaces on the front and rear of the substrate. Some of the...
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6621010 |
Multilayer integrated substrate and manufacturing method for multilayer ceramic element
A multilayer integrated substrate includes breaking grooves arranged in a grid pattern so as to section the main surface of the substrate into a plurality of blocks, and also includes...
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6617680 |
Chip carrier, semiconductor package and fabricating method thereof
A chip carrier, a semiconductor package and a fabricating method thereof are proposed, in which on one side of the chip carrier finally removed from an engaged surface of a mold in a de-molding...
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6617519 |
Flexible printed circuit board and manufacturing method
A flexible printed circuit board including a component mount section, which an electronic component is mounted on, and a cable section, which connects to the component mount section; circuit...
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6617529 |
Circuit board and electronic equipment using the same
In a circuit board having lands 2 each of which has a through hole 4 through which a lead of an electrical part is inserted, the lead 3 and the land 2 being mounted in the circuit board by...
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6617510 |
Stress relief bend useful in an integrated circuit redistribution patch
A metallic or an electrical trace having a terminus and a stress relief bend formed in the trace adjacent the terminus. The electrical trace may have a portion carried by a flexible substrate to...
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6618266 |
Method for high-density, low-via-count, decoupling capacitor placement
A capacitor mounting method and resulting printed circuit board that increases the mounting density of both vias and decoupling capacitors is presented. Vias are shared between capacitors mounted...
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6617518 |
Enhanced flex cable
A flex cable has a number of conductive wirings for electrically coupling electrical leads of an electrical component to a wiring board. The flex cable has a conductive tab for electrically...
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6617525 |
Molded stiffener for flexible circuit molding
A molded flexible circuit assembly and method of forming a molded flexible circuit assembly which use a molded stiffener, and do not require any additional type of stiffener, are described. A...
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6617523 |
Assembly and method for retaining circuit board assembly components
A fastener assembly and method are provided to engage a component to a circuit board assembly having a circuit board and a retainer positioned adjacent the circuit board. The fastener assembly...
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6617522 |
Connector apparatus, and associated method, formed of material exhibiting physical-memory characteristics
A connector, and an associated method, for connecting an electrical circuit component to a substrate, such as a printed circuit board. The connector is formed of one of more pin members formed of...
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6617524 |
Packaged integrated circuit and method therefor
To mitigate mold encapsulant bleeding and solder mask cracking in plastic semiconductor packages, a damming structure constructed from metal traces is formed in-line with the encapsulant perimeter....
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6616864 |
Z-axis electrical contact for microelectronic devices
A Z-axis electrical contact may be formed using a resinous deposit containing conductive particles which may align along surface regions to form an electrical conduction path over the resinous...
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6618272 |
Electric component connecting structure
An electric component connecting structure including a resin case having a first surface and a second surface, at least one metal bus bar fixed on the first surface of the resin case and having at...
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6617521 |
Circuit board and display device using the same and electronic equipment
A circuit board is manufactured by forming an input wiring 420 a , an output wiring 420 b , and dummy wiring layer 422 in an IC chip mounting area on a base film 410 having insulation and...
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6613979 |
Electrical circuit suspension system
A device and method wherein electrical components are mechanically suspended and electrically interconnected in an insulative elastomeric body, such as silicone, thereby eliminating the need for a...
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6614663 |
Reducing impedance of power supplying system in a circuit board by connecting two points in one of a power supply pattern and a ground pattern by a resistive member
In a circuit board having a multilayer structure comprising a ground pattern and a power-supply pattern both, for example, by forming a plurality of slits along each side of the ground pattern or...
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6612024 |
Method of mounting a device to a mounting substrate
A semiconductor device with bump electrodes having acutely shaped tips and method of mounting same. The bump electrodes are brought into contact with respective portions of a conductive pattern of...
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6612025 |
Method for creating a connection within a multilayer circuit board assembly
A method for forming connections within a multi-layer electronic circuit board 10 . The method includes forming an aperture within the circuit board and selectively coating the interior surface of...
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6609296 |
Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means
A method of making a circuitized substrate such as a printed circuit board having at least one hole therein which comprises the steps of providing a layer of dielectric, forming at least one (and...
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6611065 |
Connection material
The present invention is a connection material which enables a flexible circuit board to be connected to a bare IC chip without causing a shoulder touch effect. The connection material contains an...
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6608259 |
Ground plane for a semiconductor chip
AC-ground plane is for a semiconductor chip adapted to be mounted on a supporting member in a chip package, wherein said ground plane comprises at least one first capacitor plate provided within...
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6608757 |
Method for making a printed wiring board
Via holes are formed in an electrically conductive power plane. Photo-imageable dielectric (PID) material is applied to one side of the power plane filling the via holes. The power plane side with...
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6606793 |
Printed circuit board comprising embedded capacitor and method of same
A method for forming an embedded low profile capacitor in a multilayer printed circuit board. The method entails providing a first metal plate on a dielectric substrate. A dielectric layer of a...
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6606250 |
Circuit board having a stable L-shaped antenna
A circuit board includes an antenna having an extension extended from one end and secured to the circuit board and having a free end. A supporting member may be secured on the circuit board and...
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6603201 |
Electronic substrate
A package substrate having sides, which is formed of multiple non electrically conductive layers laminated together. Each of the multiple non electrically conductive layers is formed of a first...
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6593535 |
Direct inner layer interconnect for a high speed printed circuit board
A multi-layer printed circuit board includes a non-conductive via which intersects a conductive trace on an inner layer of the board and is adapted to receive a conductive element configured to...
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6590165 |
Printed wiring board having throughole and annular lands
In the production of a printed wiring board comprising innerlayer conductor circuits 161, 131 arranged among insulating layers 101˜103 and blind via-holes 141, 142 formed from an outermost...
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6586684 |
Circuit housing clamp and method of manufacture therefor
An electronic assembly includes one or more conductive clamps ( 302, 304, FIG. 3), which are used to supply current to an integrated circuit (IC) package ( 308 ). The conductive clamps are...
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6586843 |
Integrated circuit device with covalently bonded connection structure
A method and apparatus provides increased operative life for flip-chip devices that are produced from an integrated circuit formed with electrically conductive bumps bonded to a printed circuit...
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6583990 |
Flexible circuit board and connect structure thereof
A flexible first circuit member ( 10 ) includes conductors ( 11 ) wired thereto. The conductors ( 11 ) include a first conductor group ( 12 ). The first circuit member defines an opening ( 14 )...
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6583365 |
Conductive pads layout for BGA packaging structure
A conductive pad layout is implemented on a substrate for BGA packaging structure. The substrate has a top trace surface on which is attached a chip, and a bottom trace surface. The top trace...
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6582616 |
Method for preparing ball grid array board
Disclosed are a method for preparing a high performance BGA board containing a plurality of printed circuit boards in which a conductor circuit, a bonding pad electrically connected to a...
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6577490 |
Wiring board
A wiring board simplifying connection of electronic parts mounted on a principal face side of the wiring board and chip capacitors mounted on a reverse face side thereof in such a manner that the...
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6573459 |
Graded metallic leads for connection to microelectronic elements
Flexible leads for making electrical connection in microelectronic components includes two metallic layers. The structural or core layer of the lead is formed having a hardness greater than the...
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6573458 |
Printed circuit board
A printed circuit board includes a number of ball-shaped terminals provided on one main surface of the board. Each of the ball-shaped terminals includes a metallic ball brazed on a pad provided on...
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6570774 |
Capacitor module for use in inverter, inverter, and capacitor module
The present invention provides a small-sized capacitor module for use in an inverter, which is capable of suppressing the occurrence of unwanted inductance components in an electric connection path...
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6564986 |
Method and assembly for testing solder joint fractures between integrated circuit package and printed circuit board
A method and assembly for testing multiple IC packages for solder joint fractures that occur in response to thermal cycling. A test PCB is fabricated with contact pads arranged to match a BGA IC...
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6566611 |
Anti-tombstoning structures and methods of manufacture
A substrate, such as a printed circuit board (PCB), has pairs of pads to which terminals of electronic components, such as capacitors, can be mounted. The pads have perimeters, for example, in the...
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6566610 |
Stacking multiple devices using direct soldering
In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to...
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6561410 |
Low cost and high speed 3 load printed wiring board bus topology
A multi layer printed circuit board with a 3-load topology is disclosed. First, second, and third integrated circuit (IC) printed wiring board packages having first, second, and third sets of...
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6563056 |
Insulation barrier on a printed circuit board
A printed circuit board (PCB) assembly provided with an insulation transformer, which acts as an insulation barrier between two electrical systems. The printed circuit board (PCB) assembly has at...
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6563214 |
Electronic component and method of manufacturing the same
An electronic component having a substrate on which one or more grooves are formed on its opposing side faces; electrodes formed on the groove and top and bottom faces of the substrate at a portion...
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6563058 |
Multilayered circuit board and method for producing the same
A multilayered circuit board is constructed such that holes penetrating through second and third dielectric layers, interposed between a pair of electrodes for constructing a capacitor, are filled...
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6562643 |
Packaging types of light-emitting diode
A LED packaging process is to place LED chips at predetermined positions on the printed circuit board substrate, followed by drilling holes to penetrate the substrate, followed by passing the...
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6559390 |
Solder connect assembly and method of connecting a semiconductor package and a printed wiring board
A solder connecter assembly having a printed wiring board, an electrode formed on the printed wiring board, a semiconductor package, a pad formed on the semiconductor package, a resist formed on...
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6560122 |
Chip package with molded underfill
An integrated circuit chip package according to the present invention includes an integrated circuit chip that is mounted on a substrate by a reflow process and by a plurality of solder bumps. At...
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6559388 |
Strain relief for substrates having a low coefficient of thermal expansion
An electrical structure, and associated method of fabrication, for reducing thermally induced strain in a soldered interface, such as a solder ball or a solder column, between a chip carrier (or...
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6555757 |
Pin solder jointed to a resin substrate, made having a predetermined hardness and dimensions
A pin standing resin substrate 311 comprises a resin substrate 313 and many pins 301 soldered (HD) to a pin-pad 317 A, the resin substrate comprising such as a resin and having a pin-pad ...
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