|
Match
|
Document |
Document Title |
|
|
7622184 |
Multilevel interconnection board and method of fabricating the same
A stack of 50 layers of a first pitch-base carbon fiber sheet is formed, two sets of stack each having two second pitch-base carbon fiber sheets stacked therein are fabricated. At this time, the...
|
|
|
7615705 |
Enhanced-reliability printed circuit board for tight-pitch components
A printed circuit board is fabricated so contacts for tight-pitch components are at an angle with respect to the bundles of glass fibers in the epoxy-glass printed circuit board such that adjacent...
|
|
|
7615704 |
Multiple digital printing techniques for fabricating printed circuits
Methods of fabricating a printed circuit and printed circuits, including a method comprising: (a) depositing a conductive material to form a first conductive pathway upon a substrate; (b)...
|
|
|
7615277 |
Formation method of metal layer on resin layer, printed wiring board, and production method thereof
A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface...
|
|
|
7601419 |
Printed circuit board and method of manufacturing the same
Disclosed are a printed circuit board and a method of manufacturing the same, in which a fluorine resin coating layer is formed on a resin substrate, and then a copper layer is formed using a dry...
|
|
|
7596863 |
Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein
A method of making a printed circuit board in which at least three substrates are aligned and bonded together (e.g., using lamination). Two of the substrates have openings formed therein, with each...
|
|
|
7586047 |
Method for manufacturing patterned porous molded product or nonwoven fabric, and electric circuit component
An object of the present invention is to provide a method for manufacturing a porous material in which complicated and fine through portions, recessed portions, and the like have been patterned. It...
|
|
|
7573725 |
Optimizing power delivery and signal routing in printed circuit board design
A system, method and apparatus for providing a printed circuit board having optimized power delivery planes and signal routing regions are disclosed. In one aspect, the present disclosure teaches a...
|
|
|
7572503 |
Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same
Directed to an insulating resin composition which comprises (A) a novolak epoxy resin having a biphenyl structure, (B) carboxylic acid-modified acrylonitrile butadiene rubber particles, (C) a...
|
|
|
7571540 |
Production method of suspension board with circuit
A method of producing a suspension board with circuit, wherein after an insulating base layer is formed on a metal supporting board, a conductive pattern including a ground wiring pattern and a...
|
|
|
7566834 |
Wiring board and semiconductor package using the same
A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 μm and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or...
|
|
|
7549724 |
Printhead assembly with multi-layered support structure
A printhead assembly includes a printhead. The printhead includes a carrier which carries an integrated circuit (IC) configured to eject ink. The carrier defines a plurality of ink passages each in...
|
|
|
7547849 |
Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto
A light-activatable polymer composition and polymer composite includes a polymer binder selected from epoxy resins, silica filled epoxy, bismaleimide resins, bismaleimide triazines, fluoropolymers,...
|
|
|
7531754 |
Flexible substrate having interlaminar junctions, and process for producing the same
A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded...
|
|
|
7531752 |
Flexible substrate and electronic device
A flexible substrate inserted in a hinge electrically connects circuit substrates, which are housed in a first casing and a second casing, respectively, to each other. The substrate has a power...
|
|
|
7515435 |
Multi-functional composite substrate structure
A multi-functional composite substrate structure is provided. The first substrate with high dielectric constant and the second substrate with low dielectric constant and low loss tangent are...
|
|
|
7514781 |
Circuit substrate and manufacturing method thereof
A circuit substrate includes a plurality of dielectric members and a plurality of wiring patterns. The plurality of wiring patterns are stacked on one another through the plurality of dielectric...
|
|
|
7510759 |
Electronic part and manufacturing method thereof
An electronic component includes conductive pattern ( 2 ) on insulating substrate ( 1 ), a metal film formed by a plating method on a surface of conductive pattern ( 2 ), and metal oxide layer ( 3...
|
|
|
7504148 |
Printed circuit board structure and manufacturing method thereof
This invention discloses a manufacturing method and a structure for printed circuit boards. The printed circuit boards are often used for supporting electronic components in circuit and conducting...
|
|
|
7495177 |
Printed wiring board, its manufacturing method, and circuit device
A printed wiring board manufacturing process comprises forming a conductive metal layer on at least one surface of an insulating film with a sputtered metal layer in between, selectively etching...
|
|
|
7492326 |
Biodegradable radio frequency identification cards
A biodegradable RFID card includes a multiple-layer laminate with each layer being formed of a biodegradable material composition of a blend of between about 30-70% PLA and about 30-70% by weight...
|
|
|
7488897 |
Hybrid multilayer substrate and method for manufacturing the same
A hybrid multilayer substrate includes a cavity in a laminate structure formed of a resin portion and a ceramic multilayer substrate, the resin portion has a protrusion portion, the ceramic...
|
|
|
7488895 |
Method for manufacturing component built-in module, and component built-in module
A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating...
|
|
|
7473460 |
Ceramic substrate, electronic apparatus, and method for producing ceramic substrate
A ceramic substrate includes a glass layer partially overlaying a conductor, and the glass layer has satisfactory adhesion to the main body of the ceramic substrate and having satisfactory plating...
|
|
|
7473458 |
Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin...
|
|
|
7470461 |
Printed circuit board and method of manufacturing the same
Provided is a method of manufacturing a printed circuit board. In an embodiment, the method includes forming a prepreg layer via a reel method, forming a conductive film for forming a circuit...
|
|
|
7459640 |
NEXT high frequency improvement using hybrid substrates of two materials with different dielectric constant frequency slopes
A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are...
|
|
|
7446263 |
Multilayer printed circuit board
The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in...
|
|
|
7439451 |
Tape carrier
Only individual piece-like flexible wiring boards produced separately and judged to be non-defective products in an inspection step in advance are mounted at regular intervals on a carrying support...
|
|
|
7425683 |
Flexible wiring base material and process for producing the same
The present invention provides a flexible wiring substrate which does not form anomalous deposition of tin-bismuth alloy plating, through prevention of exfoliation, during the process of plating...
|
|
|
7420129 |
Semiconductor package including a semiconductor device, and method of manufacturing the same
A method and apparatus of manufacturing a semiconductor device and the semiconductor device used in a semiconductor package are disclosed. The semiconductor device may include a main body having...
|
|
|
7385143 |
Thermal bonding structure and manufacture process of flexible printed circuit board
A thermal bonding structure and manufacture process of a flexible printed circuit (FPC) board are disclosed, and the thermal bonding structure includes a laminated structure having a first...
|
|
|
7384683 |
Substrate for flexible printed wiring board and method for manufacturing the same
The present invention provides a substrate for a flexible printed wiring board including an adhesive layer containing an epoxy resin composition, insulating layers respectively stacked on both...
|
|
|
7381903 |
Printed circuit board and inspection method therefor
It is an object of the present invention to provide a printed circuit board and an inspection method therefor capable of electrically inspecting misregistration of a solder resist and a display by...
|
|
|
7378598 |
Printed circuit board substrate and method for constructing same
A printed circuit board (PCB) substrate and method for construction of the same. In one embodiment, a first dielectric material is associated with a first current return layer and a second...
|
|
|
7377032 |
Process for producing a printed wiring board for mounting electronic components
A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4...
|
|
|
7361843 |
AC coupling of power plane sections using improved capacitance stitching material
An information handling system has a printed circuit board with a split power plane having a plurality of sections that may be used for distributing different voltages on a single conductive foil...
|
|
|
7348045 |
Controlled depth etched dielectric film
A dielectric film for use as a substrate for a flexible circuit comprises a polymer selected from the group consisting of liquid crystal polymers and polyimide copolymers including carboxylic ester...
|
|
|
7342183 |
Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same
A circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least...
|
|
|
7342181 |
Maximizing capacitance per unit area while minimizing signal transmission delay in PCB
A printed circuit board (PCB) is provided that maximizes compensation capacitance per unit area of the PCB while minimizing signal transmission delays in the PCB. The PCB includes a first section...
|
|
|
7334324 |
Method of manufacturing multilayer wiring board
A method of manufacturing a, in order to accommodate the words range and to clarify the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating...
|
|
|
7332229 |
Varnish, shaped item, electrical insulating film, laminate, flame retardant slurry and process for producing flame retardant particles and varnish
The invention provides a varnish that contains an insulting resin, a curing agent, a flame retardant, and an organic solvent. The flame retardant comprises flame retardant particles surface treated...
|
|
|
7332212 |
Circuitized substrate with conductive polymer and seed material adhesion layer
A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to...
|
|
|
7329458 |
Wiring member and method of manufacturing the same
Disclosed is a wiring member comprising a sheet-like porous substrate provided with a large number of open-cells which are three-dimensionally branched and opened to a first major surface as well...
|
|
|
7323238 |
Printed circuit board having colored outer layer
In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light...
|
|
|
7312400 |
Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method
A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer 111 ); a conductive layer 112 formed on one surface of said insulating...
|
|
|
7307854 |
Flexible wired circuit board
A flexible wired circuit board having a fine pitch conductor wiring pattern that can be produced with a high yield rate and improved productivity, includes a first and a second flexible wired...
|
|
|
7307853 |
Wired circuit board assembly
There is provided a wired circuit board assembly that prevents breakage of the flexing portion of a wired circuit board supported by a support frame. In a wired circuit board support sheet, a...
|
|
|
7301107 |
Semiconductor device having reduced intra-level and inter-level capacitance
An interconnect structure of a semiconductor device designed for reduced intralevel and interlevel capacitance, and includes a lower metal layer and an upper metal layer and an insulating layer...
|
|
|
7294393 |
Sheet material and wiring board
In a sheet material ( 1 ), a bonding layer ( 2 ) is provided, and then a high-strength layer ( 3 ) is laminated on the bonding layer ( 2 ). The bonding layer ( 2 ) is made of an epoxy resin being a...
|