|
Match
|
Document |
Document Title |
|
|
7675756 |
Thin film-capacitor-embedded printed circuit board and method of manufacturing the same
Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same. Specifically, the present invention relates to a printed circuit board...
|
|
|
7671282 |
Structure of a circuit board for improving the performance of routing traces
A structure of a circuit board for improving the performance of routing traces is described as eliminating the resonant effects from the inner layers in a circuit board. For eliminating the stray...
|
|
|
7667142 |
Lightweight circuit board with conductive constraining cores
Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal...
|
|
|
7658001 |
Electrical connector for disk drive suspension assembly and method of non-contact solder attachment of same
A method for electrically connecting disk drive suspension assembly elements including positioning a first component having a first terminal with an edge adjacent to a second component having a...
|
|
|
7649145 |
Compliant spring contact structures
Photolithography patterned spring contacts are disclosed. The spring contacts may be fabricated using thin film processing techniques. A substrate, such as a silicon wafer or a carrier substrate is...
|
|
|
7635815 |
Lightweight circuit board with conductive constraining cores
Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal...
|
|
|
7633016 |
Coupling structure between circuit board and frame member
A coupling structure between a circuit board and a frame member according to the present invention includes: the frame member made of a metal material; and the circuit board set in the frame member...
|
|
|
7626829 |
Multilayer printed wiring board and manufacturing method of the multilayer printed wiring board
This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can...
|
|
|
7626125 |
Wiring, display device and method of manufacturing the same
The present invention provides a wiring, a display device, and a method of manufacturing the same. A first metal diffusion-preventing layer is formed on a substrate or on a circuit element formed...
|
|
|
7589398 |
Embedded metal features structure
A method and structure for creating embedded metal features includes embedded trace substrates wherein bias and signal traces are embedded in a first surface of the embedded trace substrate and...
|
|
|
7573725 |
Optimizing power delivery and signal routing in printed circuit board design
A system, method and apparatus for providing a printed circuit board having optimized power delivery planes and signal routing regions are disclosed. In one aspect, the present disclosure teaches a...
|
|
|
7535095 |
Printed wiring board and method for producing the same
The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in fracture toughness, dielectric constant, adhesion and processability, among...
|
|
|
7531754 |
Flexible substrate having interlaminar junctions, and process for producing the same
A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded...
|
|
|
7525816 |
Wiring board and wiring board connecting apparatus
The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern...
|
|
|
7515435 |
Multi-functional composite substrate structure
A multi-functional composite substrate structure is provided. The first substrate with high dielectric constant and the second substrate with low dielectric constant and low loss tangent are...
|
|
|
7515434 |
Technique for enhancing circuit density and performance
A technique for enhancing circuit density and performance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for enhancing circuit density and...
|
|
|
7514637 |
Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board
The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in...
|
|
|
7511965 |
Circuit board device and manufacturing method thereof
In a circuit board device having an electronic component mounted on an electrode land on a board by reflow soldering, voids that adversely affect the solder joint in various ways are prevented from...
|
|
|
7501582 |
Electrical device and method for making same
A multilayer electrical device, such as a printed circuit board, having a tooth structure including a metal layer set in a dielectric. The device includes a base; a conductive layer adjacent to the...
|
|
|
7495177 |
Printed wiring board, its manufacturing method, and circuit device
A printed wiring board manufacturing process comprises forming a conductive metal layer on at least one surface of an insulating film with a sputtered metal layer in between, selectively etching...
|
|
|
7488895 |
Method for manufacturing component built-in module, and component built-in module
A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating...
|
|
|
7470865 |
Multilayer printed wiring board and a process of producing same
A multilayer printed wiring board which permits the formation of fine wiring patterns, thereby increasing the density of wiring patterns. Using photosensitive glass having a coefficient of thermal...
|
|
|
7459055 |
Bonding structure with buffer layer and method of forming the same
A bonding structure with a buffer layer, and a method of forming the same are provided. The bonding structure comprises a first substrate with metal pads thereon, a protection layer covered on the...
|
|
|
7388157 |
Printed wiring board
A printed wiring board is made of first and second substrates superimposed on each other. The first and second substrates respectively include a core layer made of resin containing carbon fibers....
|
|
|
7377032 |
Process for producing a printed wiring board for mounting electronic components
A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4...
|
|
|
7350292 |
Method for affecting impedance of an electrical apparatus
A method for affecting an impedance of a portion of an electrical circuit loop in an electrical circuit apparatus includes providing an electrical circuit apparatus having at least a portion of an...
|
|
|
7348493 |
Metal-ceramic circuit board
A metal-ceramic circuit board is characterized by being constituted by bonding directly on a base plate of aluminum or aluminum alloy at least one of ceramic substrate boards having a conductive...
|
|
|
7342181 |
Maximizing capacitance per unit area while minimizing signal transmission delay in PCB
A printed circuit board (PCB) is provided that maximizes compensation capacitance per unit area of the PCB while minimizing signal transmission delays in the PCB. The PCB includes a first section...
|
|
|
7334323 |
Method of making mutilayered circuitized substrate assembly having sintered paste connections
A method of making a circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder...
|
|
|
7328505 |
Method for manufacturing multilayer circuit board
A multilayer circuit board that has electrodes only on one surface is manufactured as follows. A plurality of conductor layers are formed on a resin film made of thermoplastic resin to form a...
|
|
|
7321097 |
Electronic component comprising an electrically conductive connection consisting of carbon nanotubes and a method for producing the same
The invention provides in a preferred embodiment an electronic component comprising a first conductive layer, a non-conductive layer and a second conductive layer. A hole is etched through the...
|
|
|
7307220 |
Circuit board for cable termination
Various embodiments of an apparatus, circuit board, and method are disclosed for cable termination. In one embodiment, a surface pad is disposed on a surface of the circuit board. A ground...
|
|
|
7301103 |
Printed-wiring board, printed-circuit board and electronic apparatus
A printed-wiring board having a multiplayer structure including a plurality of insulating layers and a plurality of conducting layers includes a signal pattern provided in at least one of outermost...
|
|
|
7282648 |
Capacitor-embedded PCB having blind via hole and method of manufacturing the same
The present invention relates to a capacitor-embedded PCB and a method of manufacturing the same. The capacitor-embedded PCB includes a dielectric layer, a lower electrode layer formed under the...
|
|
|
7281318 |
Method of manufacturing a composite structural member having an integrated electrical circuit
A method of manufacturing a composite structural member with an integrated electrical circuit is provided. The structural member includes a plurality of layers of structural reinforcement material,...
|
|
|
7282647 |
Apparatus for improving coupling across plane discontinuities on circuit boards
The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout,...
|
|
|
7276563 |
Polyphenylene ether oligomer compound, derivatives thereof and use thereof
The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a...
|
|
|
7268303 |
Circuit board, mounting structure of ball grid array, electro-optic device and electronic device
In a circuit board including a pad for mounting a ball grid array and a wiring, a mounting structure of the ball grid array, an electro-optic device, and an electronic device, the circuit board...
|
|
|
7265299 |
Method for reducing voltage drop across metal lines of electroluminescence display devices
A conducting device for a display device is disclosed. It comprises one or more non-conducting base lines formed in predetermined locations on a substrate layer, and one or more conducting line...
|
|
|
7243424 |
Production method for a multilayer ceramic substrate
An object of the invention is to connect different dielectrics electrically to each other in the direction of main surface of a sheet in a multilayer ceramic substrate and to increase the degree of...
|
|
|
7245022 |
Semiconductor module with improved interposer structure and method for forming the same
Under the present invention, a semiconductor chip is electrically connected to a substrate (e.g., organic, ceramic, etc.) by an interposer structure. The interposer structure comprises an...
|
|
|
7227240 |
Semiconductor device with wire bond inductor and method
A semiconductor device ( 10 ) includes a semiconductor die ( 20 ) and an inductor ( 30, 50 ) formed with a bonding wire ( 80 ) attached to a top surface ( 21 ) of the semiconductor die. The bonding...
|
|
|
7186922 |
Circuit board
To provide a circuit board with improved electrical features with respect to a synchronization of signals, a circuit board comprises a dielectric substrate and a trace extending along a surface of...
|
|
|
7183493 |
Electronic assembly having multi-material interconnects
According to one aspect of the invention, an electronic assembly is provided. The electronic assembly includes a first substrate having an integrated circuit formed therein and a second substrate....
|
|
|
7170011 |
System and method for modifying electrical characteristics
System and methods for modifying an electrical parameter of an electrical component are described. The system includes an electrical component disposed on a circuit board and a dielectric material....
|
|
|
7161088 |
System, method and apparatus for optimizing power delivery and signal routing in printed circuit board design
A system, method and apparatus for providing a printed circuit board having optimized power delivery planes and signal routing regions are disclosed. In one aspect, the present disclosure teaches a...
|
|
|
7158383 |
Techniques for fabricating a resistor on a flexible base material
A technique for fabricating a resistor on a flexible substrate. Specifically, at least a portion of a polyimide substrate is activated by exposure to a ion sputter etch techniques. A metal layer is...
|
|
|
7153143 |
Circuit carrier and production thereof
A circuit carrier includes a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is...
|
|
|
7127812 |
Process for producing a multi-layer printed wiring board
A board 20 is provided with a Cu film 30 as a conformal mask, in which are formed a register mark 30 b and an opening 3 a through which a via hole is formed. A camera senses this register...
|
|
|
7129417 |
Method and structures for implementing customizable dielectric printed circuit card traces
A method and structures are provided for implementing customizable dielectric printed circuit card traces. A void is defined near selected signal traces. The void is then filled with a dielectric...
|