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7608789 |
Component arrangement provided with a carrier substrate
A component arrangement includes a carrier substrate having at least one component arranged thereon. The carrier substrate contains at least one layer of glass film and an intermediate layer, which...
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RE40947 |
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin...
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7599193 |
Tape circuit substrate with reduced size of base film
A tape circuit substrate includes a base film with first wiring and second wiring disposed on the base film. The first wiring extends into a chip mount portion through a first side and bends within...
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7598609 |
Structure of polymer-matrix conductive film and method for fabricating the same
A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel...
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7595453 |
Surface mount package
A surface mount package is provided that includes a first metal layer and a second metal layer configured to be electrically connected to the first metal layer. The surface mount package further...
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7592551 |
Wired circuit board assembly sheet
A wired circuit board assembly sheet having a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for...
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7589398 |
Embedded metal features structure
A method and structure for creating embedded metal features includes embedded trace substrates wherein bias and signal traces are embedded in a first surface of the embedded trace substrate and...
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7589282 |
Wiring board and a semiconductor device using the same
A wiring board includes a core composite layer having first and second core boards and an optical transmission portion; first electrodes disposed on one part of the core composite layer, being...
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7586046 |
Wired circuit board
The invention provides a wired circuit board that can prevent deterioration of a conductive pattern and short-circuiting of the conductive pattern. The wired circuit board is presented herein in...
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7582833 |
Transparent substrate provided with electroconductive strips
The present invention relates to a method of manufacturing electrically conducting tracks on a transparent substrate, by screen printing with an electrically conducting paste, and to the...
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7576288 |
Circuit board, multi-layer wiring boards, method of producing circuit boards and method of producing multilayer wiring boards
A multilayer flexible wiring board including (1) plural single-sided wiring boards each having a wiring pattern on one side of the corresponding substrate and two-layer conductor posts projecting...
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7576287 |
Lot traceable printed circuit board
A lot traceable printed circuit board (PCB) includes a substrate having thereon a patterned circuit layer and a working zone carrying production information related to the PCB itself. The working...
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7572500 |
Method of manufacturing circuit-forming board and material of circuit-forming board
A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and...
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7571540 |
Production method of suspension board with circuit
A method of producing a suspension board with circuit, wherein after an insulating base layer is formed on a metal supporting board, a conductive pattern including a ground wiring pattern and a...
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7560650 |
Substrate structure and method for manufacturing the same
A substrate structure is disclosed. The substrate structure includes a core substrate, an interconnection portion and a solder mask; herein the core substrate includes a top surface and a bottom...
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7557303 |
Electronic component connection support structures including air as a dielectric
Electronic component supporting mediums includes dielectric support material having voids adapted to include the use of air as a dielectric, which is commonly used in printed circuit boards and...
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7557302 |
Printed circuit board with electrostatic discharge damage prevention
A printed circuit board for preventing electrostatic discharge damage includes several electronic components thereon. The printed circuit board defines a number of through holes therein. The...
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7551455 |
Package structure
A package structure including a first carrier, a second carrier, at least a first electronic component and at least a second electronic component is provided. The second carrier is electrically...
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7551452 |
Printed circuit board
In an outer lead portion, outer lead wirings are provided on one surface of a base insulating layer and a plurality of metal substrates are provided on the opposite surface thereof. The plurality...
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7548432 |
Embedded capacitor structure
An embedded capacitor structure comprising a main body; at least one embedded capacitor, having a first electrode, a dielectric layer, and a second electrode, formed in the main body; and at least...
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7542302 |
Minimizing thickness of deadfronted display assemblies
An apparatus is provided and includes a label layer, disposed in a user visible interface of a front bezel, in which an icon is etched, a multi-layer printed circuit board (PCB), abutting a rear...
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7540082 |
Method for manufacturing printed wiring board
A printed wiring board having a through hole conductor formed on the surface of a through hole formed in a copper-clad laminate board, and on the surface of the copper-clad laminate board 1 in...
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7538413 |
Semiconductor components having through interconnects
A semiconductor component includes a semiconductor substrate having a substrate contact on a circuit side thereof in electrical communication with an integrated circuit, and a through interconnect...
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7538278 |
Printed circuit board for preventing increase of thermal expansion
A printed circuit board (PCB) for a display preventing increase of thermal expansion. The PCB comprises a plurality of bonding regions and at least one opening. The bonding regions are disposed on...
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7535727 |
Light source module
A light source module includes a circuit board on which a predetermined conductive pattern is formed, a semiconductor light emitting element mounted on the circuit board, and a plurality of power...
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7535095 |
Printed wiring board and method for producing the same
The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in fracture toughness, dielectric constant, adhesion and processability, among...
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7534967 |
Conductor structures including penetrable materials
Conductor structures include a substrate, a first conducting layer that is selectively passivated from growth of unwanted surface layers by the application of a selective passivation layer, and a...
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7531754 |
Flexible substrate having interlaminar junctions, and process for producing the same
A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded...
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7531752 |
Flexible substrate and electronic device
A flexible substrate inserted in a hinge electrically connects circuit substrates, which are housed in a first casing and a second casing, respectively, to each other. The substrate has a power...
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7531751 |
Method and system for an improved package substrate for use with a semiconductor package
Systems and methods for a structure for a package substrate for use in a semiconductor package are disclosed. Package substrates formed according to the systems and methods of the present invention...
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7529101 |
Assembly retention latch having concave release structure
In one non-limiting aspect thereof this invention provides a structure having a generally planar quadrilateral shape that includes a bottom portion defining a mounting section; a vertical wall...
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7528325 |
Key sheet module
A key sheet module comprising a single-sided printed wiring board including a front surface on which a plurality of wiring patterns are provided and a plurality of holes provided at predetermined...
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7523545 |
Methods of manufacturing printed circuit boards with stacked micro vias
Methods of manufacturing printed circuit boards having circuit layers laminated with stacked (or staggered) micro via(s). Aspects of embodiments of the present invention are directed to a method of...
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7518879 |
Universal Serial Bus (USB) memory plug
A universal serial bus (USB) memory is disclosed. The USB memory includes a housing having a plurality of orientated indentations and a plurality of concave props, wherein the plurality of...
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7515435 |
Multi-functional composite substrate structure
A multi-functional composite substrate structure is provided. The first substrate with high dielectric constant and the second substrate with low dielectric constant and low loss tangent are...
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7514781 |
Circuit substrate and manufacturing method thereof
A circuit substrate includes a plurality of dielectric members and a plurality of wiring patterns. The plurality of wiring patterns are stacked on one another through the plurality of dielectric...
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7511962 |
Flexible printed circuit board
A flexible printed circuit board includes a flexible base, a working trace region, and at least one reinforcement trace. The working trace region and the at least one reinforcement trace are formed...
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7511232 |
Substrate for mounting electronic part and electronic part
The present invention is characterized by a structure having a substrate 1, and metallization layers 2 formed on the substrate 1, on which a Sn solder film 3 and an Ag film 4 are formed....
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7511228 |
Printed circuit board
A printed circuit board including a substrate, a plurality of traces on the substrate and a solder mask over the conductive traces. Apertures in the mask expose a plurality of connective pads on...
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7510759 |
Electronic part and manufacturing method thereof
An electronic component includes conductive pattern ( 2 ) on insulating substrate ( 1 ), a metal film formed by a plating method on a surface of conductive pattern ( 2 ), and metal oxide layer ( 3...
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7508681 |
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics
In the preferred embodiment, there is disclosed a printed circuit board having a surface providing a mating interface to which is electrically connected an electrical connector having signal...
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7505285 |
Main board for backplane buses
A motherboard for backplane buses is provided that reduces noise due to entry of external signals into signal wiring which interconnects modules, or noise due to any external signals entering a...
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7505281 |
Multilayer wiring board for an electronic device
A multilayer wiring board includes a first insulating film and a first patterned metal wiring film extending along a first major surface thereof, and a second insulating film a second patterned...
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7504843 |
Probe unit substrate
A ceramic substrate has, on its surface, a multilayer wiring division, on which micro cantilever type probes are fixed. The multilayer wiring division has the first conductor layer, which includes...
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7504315 |
Method of transporting semiconductor device and method of manufacturing semiconductor device
To prevent semiconductor chips from adhering to the trays during transport, a method is employed which transports semiconductor chips in the following state. When trays provided with a plurality of...
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7501583 |
Low noise multilayer printed circuit board
A low noise multilayer printed circuit board includes at least one ground layer and at least one power layer. The at least one ground layer is divided into a first area and a second area. The first...
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7501582 |
Electrical device and method for making same
A multilayer electrical device, such as a printed circuit board, having a tooth structure including a metal layer set in a dielectric. The device includes a base; a conductive layer adjacent to the...
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7498522 |
Multilayer printed circuit board and manufacturing method thereof
A printed circuit board includes a product portion and a backing plate. Upper and lower surfaces of the backing plate are coated with solder masks with different material characteristics.
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7498521 |
Method and apparatus for marking a printed circuit board
A method and apparatus include providing a printed circuit board (PCB) having at least one light permeable layer, at least one non-light permeable layer having at least one void therethrough that...
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7495929 |
Reference layer openings
A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein.
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