Matches 1 - 50 out of 1489 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
7411134 Hybrid ground grid for printed circuit board  
Electrical mounting boards and methods for their fabrication and use are disclosed herein. In particular, such mounting boards embodiments utilize hybrid ground lines interconnected through a...
7409205 Virtual radio  
A portable electronic device such as a mobile station 22 has a broadcast radio receiver 60 and an internal storage 50 for storing media files 74, 76, 78, 80 . When a received broadcast radio...
7405947 Backplane with power plane having a digital ground structure in signal regions  
For electrical backplanes and the like, a power plane adaptation to improve the propagation of high-speed signals through clearances in an embedded power plane is disclosed. In exemplary...
7405365 Wiring substrate and method for manufacturing the same  
A wiring substrate of the present invention includes a short ring (SR) formed along a periphery of the substrate, an independent line pattern (e.g., a gate terminal) that is coplanar with and...
7405363 Connecting sheet  
A first high speed transmission line board ( 1 ) having a stripline structure is composed of a first elastomer sheet ( 1 A) that has a fixed dielectric constant, plural first elastomer strips ( 1...
7402757 Method, system, and apparatus for reducing transition capacitance  
A printed circuit board (PCB) is provided. The PCB includes a signal layer, a first reference plane defined adjacent to a first side of the signal layer, and a via passing through the signal layer...
7394028 Flexible circuit substrate for flip-chip-on-flex applications  
A circuit substrate for attachment to an integrated circuit chip comprises an electrical trace, a mounting pad and a dielectric layer. The mounting pad has a first surface, one or more sidewalls...
7393580 Layered board and electronic apparatus having the layered board  
A layered board is disclosed which can avoid the occurrence of cracks in a core layer due to shearing stress caused by a difference in coefficient of thermal expansion between the core layer and a...
7390973 Memory module and signal line arrangement method thereof  
The pesent invention discloses a memory module and a signal line arrangement method thereof. The memory module includes memory chips mounted on both sidees in a mirror form; and a printed circuit...
7388157 Printed wiring board  
A printed wiring board is made of first and second substrates superimposed on each other. The first and second substrates respectively include a core layer made of resin containing carbon fibers....
7385829 Assembly retention latch having concave release structure  
In one non-limiting aspect thereof this invention provides a structure having a generally planar quadrilateral shape that includes a bottom portion defining a mounting section; a vertical wall...
7385144 Method and apparatus for electrically connecting printed circuit boards or other panels  
A method and apparatus is provided for forming a printed circuit board or other panel in which an array of vias are arranged in a desired connection grid within one or more layers of the board and...
7382629 Circuit substrate and method of manufacturing plated through slot thereon  
A circuit substrate and a method of manufacturing a slot-shaped plated through slot thereon are provided. The circuit substrate has a linear slot. A slot-shaped plated through hole with a multiple...
7381901 Hinge board and method for producing the same  
A hinge board having a hinge bending part and a rigid part includes: not less than two flexible wiring boards including a polyimide sheet layer, a conductor layer having a circuit formed on both...
7378602 Multilayer core board and manufacturing method thereof  
A multilayer core board 10 includes tapered first via hole conductors 51 extending from the outer surface of a first insulating layer 24 to conductive portions 42 a of a power source layer ...
7378599 Printed circuit board, radio wave receiving converter, and antenna device  
A printed circuit board has a substrate formed of an insulator, a strip line provided on a front surface of the substrate, and a ground metal layer provided on a rear surface of the substrate. An...
7378596 Rigid-flex wiring board  
A flex-rigid wiring board has an insulative adhesive interposed between portions, lapping over each other, of the rigid and flexible substrates; and the interconnecting electrode pads on the rigid...
7377034 Method for flexible circuits  
A flexible printed circuit improves data transfer rates by disposing ground wires in a ground plane proximate to signal wires disposed in a signal channel plane. One or more ground wires is...
7377032 Process for producing a printed wiring board for mounting electronic components  
A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4...
7375983 Circuit board for reducing crosstalk of signals  
A circuit board includes a first group of layers located close to a top side of the circuit board, and a second group of layers located close to an underside of the circuit board. Signals which are...
7375289 Multi-layer printed wiring board including an alignment mark as an index for a position of via holes  
A multi-layer printed wiring board includes a board covered with a conductor layer, an interlayer insulating resin layer, an etched metal film on the interlayer insulating resin layer, and a via...
7375288 Apparatuses and methods for improving ball-grid-array solder joint reliability  
In some embodiments, apparatuses and methods for improving ball-grid-array solder joint reliability in printed circuit boards. Such apparatuses may comprise, in an exemplary embodiment, a stiffened...
7375286 Printed circuit board and manufacturing method thereof  
A plurality of wiring patterns in a stripe form are formed to be parallel to one another on one surface of a base insulating layer. The wiring patterns each have a layered structure including a...
7374811 Probe pad structure in a ceramic space transformer  
A method for manufacturing a ceramic device is provided. The ceramic device comprises a ceramic layer. A polyimide layer is on the ceramic layer. The polyimide layer has disposed therein a...
7371971 Wired circuit board and producing method thereof  
A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a...
7371970 Rigid-flex circuit board system  
A rigid-flex circuit board system that can be manufactured using less expensive and more reliable rigid circuit board methods and equipment, and can maintain rigidity and dimensional stability...
7368665 Circuit board and a power module employing the same  
A circuit board containing a metal-insulator composite member including an insulator substrate and a metal layer having a pattern, the composite member having an area where the spacing between a...
7365274 Electronic circuit board  
A board for high frequency device includes a plurality of electrode terminals connected to an electronic component or another electronic circuit board by flowable conducting material such as...
7365272 Circuit board with identifiable information and method for fabricating the same  
A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit...
7361843 AC coupling of power plane sections using improved capacitance stitching material  
An information handling system has a printed circuit board with a split power plane having a plurality of sections that may be used for distributing different voltages on a single conductive foil...
7361842 Apparatus and method for an embedded air dielectric for a package and a printed circuit board  
A method, apparatus, and system for a printed circuit board (PCB) and package with an embedded air dielectric includes a conductor formed on a surface of a first core layer, a conductor layer...
7359693 Enclosure and substrate structure for a tuner module  
A tuner module comprising a tuner and a tuner enclosure. The tuner includes a substrate containing filter coils and the tuner enclosure includes at least one partition plate placed between filter...
7358445 Circuit substrate and apparatus including the circuit substrate  
The present invention provides a circuit substrate which has a substrate including a first surface and a second surface opposite to the first surface. A first and a second conductor patterns are...
7356924 Manufacturing process for a power distribution assembly of an electrical system  
A modular multi-component power distribution system is provided having a plurality of modular components which includes a bus-bar-like power distribution assembly (PDA), branching connectors, flex...
7356917 Method for manufacturing multi-layer printed circuit board  
A multi-layer printed circuit board includes an insulation substrate; a surface conductive pattern disposed on a surface of the insulation substrate; and an inner conductive pattern embedded in the...
7355125 Printed circuit board and chip module  
The present invention relates to computer hardware design and in particular to a printed circuit board comprising wiring dedicated to supply electric board components such as integrated circuits...
7355124 Multilayer wiring board and its manufacturing method  
A multilayer wiring board having a plurality of wiring boards in which wiring layers and resin layers in each wiring board are alternately arranged in a laminated formation. In the multilayer...
7351917 Vents with signal image for signal return path  
A method, structure, and method of design relating an electrical structure that includes a metal voltage plane laminated to a dielectric substrate. A determination is made as to where to place an...
7350292 Method for affecting impedance of an electrical apparatus  
A method for affecting an impedance of a portion of an electrical circuit loop in an electrical circuit apparatus includes providing an electrical circuit apparatus having at least a portion of an...
7349225 Multifunctional composite sandwich element with embedded electronics  
A composite sandwich structure with embedded electronics, that in one embodiment includes two multilayered composite facesheet laminates, a central core, embedded electronic components within the...
7348498 Partially voided anti-pads  
A printed circuit board comprises a conductive layer and a via transecting the conductive layer. The printed circuit board comprises a pattern of conductive material having a plurality of voids in...
7348493 Metal-ceramic circuit board  
A metal-ceramic circuit board is characterized by being constituted by bonding directly on a base plate of aluminum or aluminum alloy at least one of ceramic substrate boards having a conductive...
7348080 Low temperature polyimide adhesive compositions and methods relating thereto  
The present invention relates to a polyimide adhesive composition having a polyimide derived from an aromatic dianhydride and a diamine component, where the diamine component is preferably about 50...
7346982 Method of fabricating printed circuit board having thin core layer  
A method is directed towards fabricating a printed circuit board (PCB) having a thin core layer. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is...
7345889 Method and system for reducing radiated energy emissions in computational devices  
A method and system for reducing the release of high frequency electromagnetic energy into the environment is disclosed, wherein local regions of distributed capacitance are embedded within a...
7342802 Multilayer wiring board for an electronic device  
To provide a multilayer wiring board mainly used for an electronic device, in which a bump passing through an interlayer insulating film allows for interlayer connection between plural wiring films...
7342181 Maximizing capacitance per unit area while minimizing signal transmission delay in PCB  
A printed circuit board (PCB) is provided that maximizes compensation capacitance per unit area of the PCB while minimizing signal transmission delays in the PCB. The PCB includes a first section...
7339796 Electrical circuit having a multilayer printed circuit board  
An electrical circuit includes a multilayer printed circuit board and a housing which shields against electromagnetic interference. A portion of at least one outer layer of the printed circuit...
7339118 Printed wiring board and method for manufacturing the same  
In a printed wiring board, an odd number (n) of conductive layers ( 11 - 13 ) and insulating layers ( 21 - 23 ) are alternately laminated upon each other. The first conductive layer ( 11 ) is a...
7335414 Printed circuit board and camera module  
A printed circuit board has a flexible portion where a covering layer is exposed, and a rigid portion provided by forming a resistant layer on a part of the covering layer. To produce a camera...
Matches 1 - 50 out of 1489 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >