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Match Document Document Title
9078364 Electroconductive sheet and touch panel  
The present invention provides an electroconductive sheet and a touch panel which do not impair visibility in a vicinity of an electrode terminal in a sensing region. In an electroconductive sheet...
9040834 ***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Electroconductive sheet and touch panel
 
The present invention provides an electroconductive sheet and a touch panel which do not impair visibility in a vicinity of an electrode terminal in a sensing region. In an electroconductive sheet...
9040833 Capacitive transparent conductive film and preparation method thereof  
A capacitive transparent conductive film comprises: a transparent substrate, comprises a first surface and a second surface which is opposite to the first surface; a light-shield layer, formed at...
9005744 Conductive micro-wire structure  
A conductive micro-wire structure includes a substrate. A plurality of spaced-apart electrically connected micro-wires is formed on or in the substrate forming the conductive micro-wire structure....
8975525 Corles multi-layer circuit substrate with minimized pad capacitance  
A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed...
8975526 Touch panel  
The present disclosure provides a touch panel, including at least a plurality of first electrode axes, a plurality of second electrode blocks. Each first electrode axis and corresponding second...
8895862 Substrate structure  
A substrate structure for carrying plural heat generating elements is provided. The substrate structure includes a board, a patterned metal layer and plural heat dissipating channels. The board...
8664533 Substrate having transparent conductive layer, method for producing same, transparent conductive film laminate for touch panel, and touch panel  
A substrate having a transparent conductive layer has a transparent conductive pattern that is not easily visually recognizable by a naked human eye on a transparent substrate and can be formed by...
8507802 Ultra-low current printed circuit board  
Provided is printed circuit board for minimizing dielectric losses experienced by a low-current portion of an electric circuit. The printed circuit board includes a first substrate supporting an...
8484836 Flexible network  
An integrated circuit connector is extendable for a variety of applications. In connection with various embodiments, an electrical connector has first and second ends connected to respective...
8471152 Microstructure and microstructure manufacture method  
A microstructure comprises a laminate structure having a first conductor, a second conductor, and an intervening insulator located between the first and the second conductors. The first conductor...
8445789 Cable having ESD dissipative adhesive electrically connecting leads thereof  
A cable in one embodiment comprises a plurality of leads; and an electrostatically dissipative adhesive operatively electrically coupling the leads together, the adhesive comprising a mixture of...
8389870 Coreless multi-layer circuit substrate with minimized pad capacitance  
A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed...
8274181 Structure for transmission in power supply  
A structure for transmission in a power supply, particularly to a power structure for transmission for bearing large DC current, wherein the power supply includes a power input port for connecting...
8264841 Heat sink and laser diode  
The present invention is directed to improve reliability by preventing deterioration in the structure of an inner wall of a water channel caused by galvanic corrosion. A heat sink in which a water...
8258407 Wiring board and method of preventing high voltage damage  
A wiring board is provided to protect an electronic device from static electricity and lightning surge without reducing packaging density. A wiring board is provided with a first wiring pattern...
8168288 Multilayer ceramic substrate and method for manufacturing the same  
In a multilayer ceramic substrate manufactured by a non-shrinking process, a bonding strength of an external conductive film formed on a primary surface of the multilayer ceramic substrate is...
8067697 Flexible printed circuit board for light emitting diode backlight unit and method of fabricating the same  
A flexible printed circuit board (PCB) for a light emitting diode backlight unit includes a flexible base film; a plurality of metal lines on a first surface of the flexible base film; a cover...
7952033 Microstructure and microstructure manufacture method  
A microstructure comprises a laminate structure having a first conductor, a second conductor, and an intervening insulator located between the first and the second conductors. The first conductor...
7936568 Capacitor built-in substrate and method of manufacturing the same and electronic component device  
A capacitor built-in substrate of the present invention includes; a base resin layer; a plurality of capacitors arranged side by side in a lateral direction in a state that the capacitors are...
7778040 Printed circuit board assembly  
A printed circuit board assembly includes: a substrate; a main signal line formed on the substrate to transmit a signal; an SMD mounted on the substrate; a pad interposed between the SMD and the...
7755910 Capacitor built-in interposer and method of manufacturing the same and electronic component device  
A capacitor built-in interposer of the present invention, includes a base resin layer, a capacitor first electrode provided to pass through the base resin layer and having projection portions...
7692930 Low profile DIMM board  
A primary memory board is disclosed. The primary memory board comprises a printed circuit board (PCB) having a front side and a back side, a plurality of DIMM surface mount connectors, and at...
7638714 Structure and manufacturing method of substrate board  
A method for manufacturing a substrate board with high efficiency of heat conduction and electrical isolation is disclosed. The method comprises the steps of: providing a substrate layer with an...
7488895 Method for manufacturing component built-in module, and component built-in module  
A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical...
7427716 Microvia structure and fabrication  
A system may include a first microvia pad, a second microvia pad having a projection extending in a direction toward the first microvia pad, and a microvia electrically coupled to the first...
7324350 MEMS RF switch module including a vertical via  
An apparatus and method to provide a micro-electromechanical systems (MEMS) radio frequency (RF) switch module with a vertical via. The MEMS RF switch module includes a MEMS die coupled to a cap...
7149095 Stacked microelectronic assemblies  
A stacked microelectronic assembly includes a plurality of microelectronic subassemblies. Each subassembly includes a substrate having at least one site, a plurality of first contacts and a...
7057116 Selective reference plane bridge(s) on folded package  
An apparatus including a substrate having dimensions suitable as a support circuit for at least one integrated circuit, the substrate comprising a laterally extending plication region defining...
6729023 Method for making a multi-layer circuit board assembly having air bridges supported by polymeric material  
A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having selectively...
6662440 Z-axis electrical contact for microelectric devices  
A Z-axis electrical contact may be formed using a resinous deposit containing conductive particles which may align along surface regions to form an electrical conduction path over the resinous...
6652342 Wiring board and gas discharge type display apparatus using the same  
A gas discharge type display apparatus includes a front substrate having a plurality of first electrodes and a back substrate having a plurality of second electrodes and at least ones of the first...
6617682 Structure for reducing die corner and edge stresses in microelectronic packages  
A microelectronic die is aligned with a package substrate and attached to it using solder balls. A specially shaped heat spreader, preferably with a coefficient of thermal expansion (CTE) similar...
6551711 Curable episulfide systems having enhanced adhesion to metal  
A metal-polymer composite comprises a metal and substrate layer disposed on the metal, wherein the substrate layer is formed from a curable thermosetting resin system comprising a curing agent and...
6479755 Printed circuit board and pad apparatus having a solder deposit  
A printed circuit board and a pad apparatus having a solder deposit formed on the pad apparatus by using a mask having a slit are provided. The slit has the same shape as the solder deposit. The...
6467076 Method and apparatus for submicron IC design  
The present invention beneficially provides an improved method and apparatus for designing submicron integrated circuits. A tag identifier is provided to an integrated circuit (IC) design. The tag...
6356451 Multi-layered substrate, method for manufacturing the multi-layered substrate and electric apparatus  
Conductive layers have at least a portion of a conductive member arranged in a nonlinear or polygonal configuration and having a greater layout area and an insulating layer is alternately stacked...
6331678 Reduction of blistering and delamination of high-temperature devices with metal film  
A device with a multi-layered micro-component electrical connector. The multi-layer micro-component electrical connector includes a dielectric layer, a micro-mesh of a first electrical conductor...
6207903 Via transitions for use as micromachined circuit interconnects  
Structures and methods that provide for via transitions between opposite sides of a high resistivity silicon micro-machined membrane substrate. The via transitions provide ground-signal-ground...
6129559 Microconnector and method of manufacturing the same  
A microconnector provides a practically sufficient strength, and has an arrangement in which structures of electrode members and guiding members can be designed at least somewhat independently of...
6125044 Suppressing EMI with PCB mounted ferrite attenuator  
A printed circuit board (PCB) assembly includes a PCB having and a ferrite attenuator. The PCB includes input/output signal paths for carrying signals to and from the PCB, power paths for...
6121552 Microfabricated high aspect ratio device with an electrical isolation trench  
A microfabricated device having a high vertical aspect ratio and electrical isolation between a structure region and a circuit region. The device may be fabricated on a single substrate and may...
6097609 Direct BGA socket  
An electronic packaging assembly is disclosed. An electronic component is disposed on a socketing substrate utilizing a ball grid array or land grid array. The socketing substrate contains a...
6060665 Grooved paths for printed wiring board with obstructions  
A printed wiring board employing a grooved path conductive lead configuration. The printed wiring board is formed on a substrate having a surface area. Grooved paths having side walls are formed...
5982249 Reduced crosstalk microstrip transmission-line  
A reduced crosstalk microstrip transmission-line has a plurality of microstrips sandwiched between a lower base dielectric layer of flexible circuit material and an upper coverlay with higher...
5517756 Method of making substrate member having electrical lines and apertured insulating film  
In a substrate member (e.g., circuit board), a plurality of openings (15) are formed in an insulating film (14) which covers electric lines (12) formed on a substrate 11, with pad constructing...
5502431 Integrated circuit device  
An integrated circuit device includes a first insulation layer formed on a substrate; a second insulation layer formed above the first insulation layer; a thin-film resistor formed on the second...
5498905 Layered features for co-fired module integration  
A unitized multilayer circuit structure that includes a plurality of planar dielectric insulating layers stacked in laminar fashion to form a substrate having sides formed by edges of the...
5477612 Method of making high density conductive networks  
A supported conductive network (SCN), which can be flexible or rigid, can have self-aligning conductors which connect with corresponding conductors of other networks. The conductive network can be...
5412537 Electrical connector including variably spaced connector contacts  
An electrical connector includes a housing and a row of connector contacts coupled to the housing. The row of connector contacts has a predetermined center-to-center spacing between adjacent...

Matches 1 - 50 out of 156 1 2 3 4 >