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7626124 |
Wiring board
A wiring board has a circuit pattern that includes metal foil attached to an insulating layer, and a built-up circuit pattern disposed on top of the metal foil circuit pattern. The built-up circuit...
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7623349 |
Thermal management apparatus and method for a circuit substrate
The present disclosure relates to thermal management apparatus for a circuit substrate having heat generating components mounted on one or both sides thereof. The apparatus and method includes a...
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7616446 |
Mobile terminal device and method for radiating heat therefrom
In a mobile terminal device, at least one heat conduction layer formed of a member, such as copper, aluminum or carbon, being excellent in heat conductivity is provided inside a circuit board on...
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7607790 |
Backlighting apparatus and manufacturing process
Apparatuses for backlighting and manufacturing processes thereof are disclosed. There is provided a backlight module. The backlight module comprises a double-sided circuit board with thermal...
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7583506 |
Multi operational system apparatus and method
An apparatus may have a multilayered support base having a structural section made up of operating components and a function support section. The function support section may have transmission...
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7583504 |
Cooling assembly
A method and apparatus for cooling an electronic application having at least one heat-generating electronic component mounted on a circuit board. A heat transferring heat sink is attached to the...
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7579554 |
Heat sink arrangement for electrical apparatus
A printed circuit board ( 120 ) includes an insulating substrate ( 120 a ) on which conductive films ( 120 b ) are formed. Semiconductor devices ( 8 ) disposed external to the printed circuit board...
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7573709 |
Grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers
A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material...
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7561430 |
Heat management system for a power switching device
A power switching device is provided that includes a housing, a printed circuit board disposed within the housing, and a plurality of electrical components mounted to the printed circuit board,...
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7561425 |
Encapsulated multi-phase electronics heat-sink
An apparatus and method for cooling electronics is disclosed. An encapsulated inert non-conductive fluid is used to transfer heat directly from an electrical circuit including a die on a substrate...
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7554039 |
Electronic device
In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a...
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7551447 |
Resilient fastener and heat dissipation apparatus incorporating the same
A heat dissipation apparatus includes a retention module ( 10 ), a heat sink ( 20 ) disposed on the retention module, a fastening cover ( 23 ) covering the heat sink, and a plurality of fasteners (...
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7529093 |
Circuit device
A first insulating layer is formed on the front surface of a circuit board, and a second insulating layer on the back surface. A conductive pattern is formed on the surface of the first insulating...
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7529091 |
Power semiconductor module and method for cooling a power semiconductor module
The invention relates to a power semiconductor module comprising a plurality of power semiconductors that are fixed to a first side of a printed circuit board ( 26 ), and a cooling device that acts...
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7522405 |
High current electrical switch and method
A method and system are disclosed for a high current electrical switch. The switch may be suitable for switching, rectifying or blocking direct current in the range of one to a thousand amperes per...
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7518066 |
Conformable interface device for improved electrical joint
An interface device for coupling an electrical device to a metal junction includes a conformable conductor plate having a first side and a second side. The interface device also includes a...
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7515425 |
Electronic device and cooling unit
An electronic device includes: a housing; a substrate that has a first surface and a second surface each mounted with a heat generating component and that is fixed in the housing; a first heat...
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7514636 |
Circuit component module, electronic circuit device, and method for manufacturing the circuit component module
A circuit component module includes a heat-releasing plate, a resin film stacked on a surface of the heat-releasing plate, an electronic component embedded in the first resin film and partially in...
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7511965 |
Circuit board device and manufacturing method thereof
In a circuit board device having an electronic component mounted on an electrode land on a board by reflow soldering, voids that adversely affect the solder joint in various ways are prevented from...
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7508663 |
Computer rack cooling system with variable airflow impedance
A computer system includes a computer rack configured to support a plurality of computer chassis in a computer stack region of the computer rack; a cooling plenum configured to draw air from a back...
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7508066 |
Heat dissipating semiconductor package and fabrication method thereof
A heat dissipating semiconductor package and a fabrication method thereof are provided. A semiconductor chip is mounted on a chip carrier. A heat sink is mounted on the chip, and includes an...
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7505268 |
Electronic device package with an integrated evaporator
The present invention provides an electronic device package that can be fabricated using standard package fabrication technologies while providing a desired level of thermal transfer capability to...
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7502229 |
Heat dissipation system for multiple integrated circuits mounted on a printed circuit board
A system is provided for heat sinking and environmental dissipation of heat generated by one or more ICs mounted to a printed circuit board. The system includes a primary thermally conductive plate...
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7495924 |
Electronic device
An electronic device having a heat radiating body, a metal substrate, a heat generating component, and a non-heat-generating component is disclosed. The metal substrate is fixed to the heat...
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7495919 |
Heat sink assembly having a locking device assembly
A heat sink assembly comprises a heat sink ( 20 ) and a locking device assembly ( 30 ) for mounting the heat sink to an electronic component ( 44 ) of a printed circuit board ( 40 ). A channel ( 25...
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7477519 |
Electronic component package including heat spreading member
A heat spreading member is received on a predetermined surface of an electronic component. The heat spreading member extends larger than the predetermined surface. A contact piece is contacted with...
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7474534 |
Methods and apparatuses for thermal dissipation
A method and apparatus for providing thermal dissipation from a PC card is disclosed. For one embodiment of the invention, an extension portion, having a heat sink implemented thereon, is provided...
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7474530 |
High-load even pressure heatsink loading for low-profile blade computer applications
An apparatus for dissipating heat in a computer system includes a heat sink, at least one fastener which secures the heat sink to at least one first support member, and at least one cup. The first...
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RE40618 |
Integrated cooling system
Systems and methods are described for integrated cooling system. A method includes: circulating a liquid inside a flexible multi-layer tape; and transporting heat between a heat source that is...
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7471515 |
Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment
An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from...
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7467457 |
Method of coupling a device to a mating part
A coupling between a device and a mating part includes an elastic material and perhaps a tensioner coupled to the elastic material. The elastic material is wrapped around at least part of the...
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7463489 |
Power inverter
The object of the invention is a power inverter, the bottom of the housing ( 1 ) of the power inverter being configured to be stepped, cooling bodies ( 10, 11 ) being disposed on the exterior face...
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7443678 |
Flexible circuit board with heat sink
A novel flexible circuit board with heat dissipation ability is provided. The flexible circuit board includes a heat sink and a heat spreader having at least one circuit substrate mounted thereon....
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7440278 |
Water-cooling heat dissipator
A water-cooling heat dissipator mounted on an electronic heat-generating element includes a water-cooling head member and at least one heat pipe. The water-cooling head member includes a first...
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7434308 |
Cooling of substrate using interposer channels
A structure, and method of forming and cooling the structure. The structure may include a substrate (e.g., a semiconductor chip) having N continuous substrate channels and an interposer having N...
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7420126 |
Circuit board and circuit apparatus using the same
A circuit board and a circuit apparatus using the same are provided, which have an improved heat radiation capability near through holes piercing through its metal substrate so as to address a...
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7400506 |
Method and apparatus for cooling a memory device
A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat...
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7397666 |
Wedge lock
Various apparatus and methods are disclosed wherein a wedge member and a support engage one another to lock a first structure and a second structure to one another along an axis.
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7397664 |
Heatspreader for single-device and multi-device modules
A heatsink includes a heatsink base, an elastomeric base, multiple slider pins and an alignment frame coupled to the heatsink base. The elastomeric base includes multiple holes, the elastomeric...
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7388752 |
Series-connected heat dissipater coupled by heat pipe
A series-connected heat dissipater coupled by heat-pipe used for the interface cards of a computer system. Wherein, a plurality of additional auxiliary dissipaters are provided onto the insertion...
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7382618 |
Heat dissipating apparatus for computer add-on cards
A heat dissipating apparatus for dissipating heat generated by a VGA card includes a heat sink and a retention assembly. The heat sink includes a base located on the add-on card, a plurality of...
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7375963 |
System and method for cooling a module
Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first...
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7368825 |
Power semiconductor device
The present invention is directed to a power semiconductor device in which a control circuit controls a power switching element, comprising: a semiconductor substrate having a front surface and a...
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7365972 |
Electronic device with dual heat dissipating structures
An electronic device with dual heat dissipating structures use in an electronic system is disclosed. The electronic device comprises the circuit board having the first and second heat producing...
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7362576 |
Radio frequency module
In a compact radio frequency module, a first chip forms a heater element and a second chip forms a device whose operating characteristics vary with temperature change or whose maximum operating...
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7361844 |
Power converter package and thermal management
Power conversion apparatus includes a circuit board with power conversion circuitry and a package having an upper portion and a lower portion that respectively enclose circuitry on a top surface...
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7361842 |
Apparatus and method for an embedded air dielectric for a package and a printed circuit board
A method, apparatus, and system for a printed circuit board (PCB) and package with an embedded air dielectric includes a conductor formed on a surface of a first core layer, a conductor layer...
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7359199 |
Portable electronic apparatus
In a portable electronic device having two circuit boards having a heat generating electronic device, a frame arranged at a position pinched between the circuit boards, a first heat radiating plate...
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7355858 |
Heat sink for surface-mounted semiconductor devices and mounting method
A heat sink for surface-mounted semiconductor devices is provided on a superordinate circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally...
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7355854 |
Apparatus for improved grounding of flange mount field effect transistors to printed wiring boards
An apparatus for improved grounding and heat transfer between flange mount field effect transistors and printed wiring boards is provided comprising a cut-out formed in the printed wiring board,...
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