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7615704 |
Multiple digital printing techniques for fabricating printed circuits
Methods of fabricating a printed circuit and printed circuits, including a method comprising: (a) depositing a conductive material to form a first conductive pathway upon a substrate; (b)...
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7595452 |
Circuit board and method for its production
The invention relates to a circuit board and a method for its production. The highly flexible circuit board includes electrically non-conductive threads and electrically conductive threads. These...
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7592551 |
Wired circuit board assembly sheet
A wired circuit board assembly sheet having a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for...
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7587815 |
Resin-coated metal plate and method of drilling printed wiring board using the metal plate
A resin-coated metal plate used as a protective plate in drilling a printed wiring board has a metal plate and a resin film including a thermoplastic resin coated on at least one surface of the...
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7577001 |
Support structure of electronic device and hard disk drive comprising the same
A hard disk drive (HDD) includes a disk, a spindle motor assembly for rotating the disk, an arm assembly for reading data from and/or reproducing data onto the disk, integrated circuits (ICs) for...
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7576287 |
Lot traceable printed circuit board
A lot traceable printed circuit board (PCB) includes a substrate having thereon a patterned circuit layer and a working zone carrying production information related to the PCB itself. The working...
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7571540 |
Production method of suspension board with circuit
A method of producing a suspension board with circuit, wherein after an insulating base layer is formed on a metal supporting board, a conductive pattern including a ground wiring pattern and a...
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7566834 |
Wiring board and semiconductor package using the same
A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 μm and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or...
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7550678 |
Plasma display module
In a plasma display module, a flexible substrate is strengthened and a mounting structure for alleviating stresses is provided, thereby preventing the metal fatigue of wirings. In a PDP (Plasma...
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7547974 |
Wiring substrate with improvement in tensile strength of traces
A wiring substrate with tensile-strength enhanced traces primarily comprises a core layer, a plurality of connecting pads, a plurality of traces, and a solder resist where the connecting pads and...
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7547213 |
Memory modules and methods for manufacturing memory modules
Memory modules and methods for manufacturing memory modules are disclosed herein. In one embodiment, a memory module includes a substrate, a microelectronic device carried by the substrate, and a...
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7546003 |
Suspension board with circuit and producing method thereof
A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an...
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7534967 |
Conductor structures including penetrable materials
Conductor structures include a substrate, a first conducting layer that is selectively passivated from growth of unwanted surface layers by the application of a selective passivation layer, and a...
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7531754 |
Flexible substrate having interlaminar junctions, and process for producing the same
A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded...
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7531751 |
Method and system for an improved package substrate for use with a semiconductor package
Systems and methods for a structure for a package substrate for use in a semiconductor package are disclosed. Package substrates formed according to the systems and methods of the present invention...
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7529101 |
Assembly retention latch having concave release structure
In one non-limiting aspect thereof this invention provides a structure having a generally planar quadrilateral shape that includes a bottom portion defining a mounting section; a vertical wall...
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7525816 |
Wiring board and wiring board connecting apparatus
The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern...
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7525190 |
Printed wiring board with wiring pattern having narrow width portion
A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58 b, 58 c and 58 d , and a wiring pattern 58 is...
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7515435 |
Multi-functional composite substrate structure
A multi-functional composite substrate structure is provided. The first substrate with high dielectric constant and the second substrate with low dielectric constant and low loss tangent are...
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7514781 |
Circuit substrate and manufacturing method thereof
A circuit substrate includes a plurality of dielectric members and a plurality of wiring patterns. The plurality of wiring patterns are stacked on one another through the plurality of dielectric...
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7504589 |
Method and apparatus for manufacturing and probing printed circuit board test access point structures
A test access point structure for accessing test points of a printed circuit board and method of fabrication thereof is presented. Each test access point structure is conductively connected to a...
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7498520 |
Semiconductor multilayer wiring board and method of forming the same
A silica-based interlayer insulating layer having a low dielectric constant is formed with SOG material on a substrate, in which a wiring-layer forming space is then formed. If necessary, a UV ray...
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7495930 |
Circuit board structure for high density processing of analog and digital signals
A circuit board which has a high speed digital circuit in close proximity to a sensitive analog structure has a grounded, conductive band interposed between them and a ground plane with two...
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7492605 |
Power plane to reduce voltage difference between connector power pins
A power plane including a supply power pin receptacle, a first connector power pin receptacle, and a second power pin receptacle, where a first electrical resistance between the supply power pin...
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7483277 |
Method and apparatus for inspecting component mounting accuracy
A component is mounted in a component mounting position on a component mounting-side surface of an inspection-use board which is formed from a light transmitting material and which has a reflecting...
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7477521 |
Isolating stress on a printed circuit board
Printed circuit boards (PCB's) with edge connectors undergo bending stresses whenever the edge connectors are plugged into mating connectors. The bending stresses causes deformation of the printed...
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7476811 |
Semiconductor device and manufacturing method therefor
A semiconductor device includes: a semiconductor element; a circuit substrate having a cavity at a center thereof; a heat radiating member having the semiconductor element bonded at a central...
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7474540 |
Silicon carrier including an integrated heater for die rework and wafer probe
A silicon carrier package includes a multi-layer member having at least a first layer and a second layer. A first electronic component includes a plurality of connector members that establish a...
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7474539 |
Inductor
A component having an inductor to at least partially compensate for a capacitance in a circuit of the component, is described herein.
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7470342 |
Structure and method for laminating and fixing thin plate parts and method for fabricating ink-jet printer head
Plates having a predetermined pattern are provided in each frame, side by side, at certain intervals along the longitudinal direction of the frame. A plurality of positioning holes, into which pins...
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7465883 |
Plate-reinforced wiring circuit board
The object of the present invention is to provide a plate-reinforced wiring circuit board in which the tearing occurring upon flexing can be sufficiently prevented. The present invention relates to...
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7459202 |
Printed circuit board
A sequentially laminated printed circuit board having highly reliable vias can be fabricated by pattern plating flanges or via lands on a copper foil, laminating the foil to a prepreg so that the...
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7459201 |
Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit board
The present invention sufficiently secures conductor component content ratio in wiring formed on a multilayer circuit board and increases reliability by fabricating the multilayer circuit board by...
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7457130 |
Packaging for plasma display module
Packaging for a display module which is easy to install due to a simple structure, and protects the front, sides and back of the display module securely. The packaging includes a protective plate...
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7442091 |
Back-to-back PCB double-sided USB connector
A double-sided USB connector may include a first PCB that may provide a first set of electrical contacts on its first side and solder pads on its second side. The first PCB may further include a...
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7426118 |
Printed wiring board
To cancel a magnetic field in an interconnection pattern of a printed wiring board. A first interconnection pattern 3 a is formed on a surface 1 a of an insulating substrate 1 . A second...
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7411134 |
Hybrid ground grid for printed circuit board
Electrical mounting boards and methods for their fabrication and use are disclosed herein. In particular, such mounting boards embodiments utilize hybrid ground lines interconnected through a...
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7405940 |
Piston reset apparatus for a multichip module and method for resetting pistons in the same
Disclosed is a piston reset apparatus for a multichip module that includes a base with multiple projections and two unit associating pegs extending from opposite ends of the base, a hat disposed...
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7405362 |
Semiconductor devices having more than two-rows of pad structures and methods of fabricating the same
A semiconductor device is provided including a printed circuit board and first, second and third rows of power and/or signal pads on the printed circuit board. A plurality of input and output...
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7402755 |
Circuit board with quality-indicator mark and method for indicating quality of the circuit board
A circuit board with a quality-indicator mark and a method for indicating quality of the circuit board. The circuit board includes a plurality of circuit board units. A plating bus is formed around...
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7399930 |
Method and device for repair of a contact pad of a printed circuit board
Methods and devices are provided for repairing a damaged contact pad that is located on a first surface of a printed circuit board and connected to a via that passes through the circuit board....
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7396596 |
Article with a coating of electrically conductive polymer
A coated article, which has (i) at least one electrically non-conductive base layer, (ii) at least one layer of copper and/or a copper alloy, and (iii) a layer which contains at least one...
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7393580 |
Layered board and electronic apparatus having the layered board
A layered board is disclosed which can avoid the occurrence of cracks in a core layer due to shearing stress caused by a difference in coefficient of thermal expansion between the core layer and a...
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7390973 |
Memory module and signal line arrangement method thereof
The pesent invention discloses a memory module and a signal line arrangement method thereof. The memory module includes memory chips mounted on both sidees in a mirror form; and a printed circuit...
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7388158 |
Concentric spacer for reducing capacitive coupling in multilayer substrate assemblies
In one embodiment, a substrate assembly includes a flat substrate having oppositely disposed planar surfaces and a conductor. The conductor is formed on at least one of the planar surfaces and...
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7385665 |
Display device
A display device includes a display panel which includes an effective display section, a flexible board which supplies a driving signal to the effective display section, a connection part at which...
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7385142 |
Manufacturing method of electronic part and wiring substrate
A manufacturing method of an electronic part, comprises: sectioning a wiring substrate along a line intersecting a through hole, the wiring substrate having; a base substrate, a wiring pattern...
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7375286 |
Printed circuit board and manufacturing method thereof
A plurality of wiring patterns in a stripe form are formed to be parallel to one another on one surface of a base insulating layer. The wiring patterns each have a layered structure including a...
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7365272 |
Circuit board with identifiable information and method for fabricating the same
A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit...
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7362491 |
Heated glass panels and methods for making electrical contact with electro-conductive films
A heated glass panel assembly according to one embodiment of the invention may include a substrate having an electro-conductive film provided thereon. A conductor is positioned in contact with the...
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