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Document Title |
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6707675 |
EMI containment device and method
Disclosed herein are electromagnetic interference ‘EMI’ containment devices and methods for abating interference generated by electronic devices.
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6707673 |
Heat sink for chip stacking applications
A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat...
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6707676 |
Heat sink for automatic assembling
The heat-sink assembly of the invention is attached to the PC board with the use of surface mount technology. The assembly comprises a base part or a base member soldered to the PC board and a top...
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6704199 |
Low profile equipment housing with angular fan
The present invention is directed to a ventilating or cooling element for airflow cooling in a digital data processing apparatus, and it is particularly suited to such apparatus having a high...
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6698500 |
Heat sink with fins
A heat sink with fins comprising a group of heat dissipating fins which comprise combination of heat dissipating fins made of at least two kinds of metals having different heat conductivity, and a...
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6698505 |
Cooler for an electronic device
A cooler for an electronic device of the present invention is provided with a heatsink and a cross flow blower with an electric motor. The heatsink comprises a base and heat exchanging means made...
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6698511 |
Vortex heatsink for high performance thermal applications
A method, apparatus, and article of manufacture for improving the thermal efficiency for heat transfer from an electronic device using a vortex heatsink arrangement. The apparatus comprises a fin...
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6698499 |
Cooling device and method
A cooling device includes a heat sink assembly that may also form a housing surrounding a chamber. The housing may be constructed of a plurality of cooling vanes which have elongated openings...
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6695042 |
Adjustable pedestal thermal interface
A heat sink is constructed including at least one thermally conductive pedestal, allowing configuration of the heat sink to make contact with a plurality of heat-generating electronic devices where...
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6695045 |
Bladed heat sink
A bladed heat sink. The sink includes a connecting board, a plurality of blades, a frame and at least one reinforcing rib. The connecting board is enclosed by the frame. The blades radiate from the...
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6691768 |
Heatsink design for uniform heat dissipation
The present invention discloses improved heatsink designs and methods for cooling a heat source. One embodiment is a heatsink assembly for removing heat from an electronic component, the heatsink...
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6688379 |
Heat dissipation device with high efficiency
The heat dissipation device includes a frame and an impeller. The frame has an inlet and an outlet, in which the inlet has a noncircular shape. The inlet can be provided with a blocking board so as...
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6684501 |
Foil heat sink and a method for fabricating same
A design and method for fabricating a foil heat sink including a fin body, wherein the fin body includes a plurality of heat sink fins having a fin head and a fin foot and wherein the plurality of...
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6683788 |
Operating device for heat sink
An operating device ( 10 ) for detaching a heat sink ( 40 ) from a heat-generating electronic device ( 30 ) includes a bracket ( 12 ) and four handles ( 14 ) rotatably connected to the bracket. The...
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6681847 |
Radiator fin formed by sintering operation
This invention relates to a radiator fin formed by sintering operation, which comprises a base board formed by means of powder metallurgical sintering and a radiator fin formed by the bent metal...
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6675885 |
Heat-dissipating device for electronic components
A heat dissipating device includes a plurality of plates each having a three-sided base plate portion and a pair of fin plate portions. The base plate portion has a contact side adapted to contact...
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6678159 |
Method of transporting heat from a heat dissipating electrical assemblage
A method of transporting heat from a heat dissipating electrical assemblage having a circuit board insertable in a card cage or retaining unit and at least one heat generating component mounted...
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6672380 |
Heat sink base pad
A heat sink base pad mainly has a heat sink base with a plurality of heat sink holes disposed on the face plate of the base and a heat tube pivotally disposed at the lower end of the face plate...
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6672379 |
Positioning and buckling structure for use in a radiator
A radiator with positioning and buckling structure includes multiple metal plates, each of which has a main body, and a folded side portion is connected to one or two sides of the main body. The...
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6671176 |
Method of cooling heat-generating electrical components
A method of cooling heat-generating electrical components during service has a heat-removing element. Heat-removing element comprises a plurality of vias therein and is fixedly attached to a tip of...
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6667874 |
Structure for eliminating electromagnetic interference caused by central processing unit
A structure for eliminating electromagnetic interference caused by CPU includes a fixing seat, onto which two conductive members having a plurality of elastic contacts are mounted. Each of the...
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6662412 |
Buckle of IC heat dissipating device
A buckle of an IC heat dissipating device for installing a heat dissipating fin device to a top surface of an IC located in an IC socket comprises a pair of clamping arms; a supporting frame being...
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6661666 |
Device for enhancing the local cooling of electronic packages subject to laminar air flow
A device having features for enhancing the cooling of an electronic package subject to laminar air flow. The features include a bluff body, located adjacent the electronic package and within the...
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6661660 |
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power...
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6657860 |
Heat dissipating device and computer
A heat sink, cooling member, semi-conductor substrate cooling system, computer and method for providing sufficient cooling performance through a heat sink is provided. In part, there is provided a...
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6657865 |
Heat dissipating structure
A heat dissipating structure is formed via the assembly of metallic fins. An upper side, an inner side, and a lower side of each fin respectively form a first, second, and third folded edge. At...
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6654249 |
Circuit arrangement
A circuit arrangement includes a base body, with one or more substrates, an intermediate-circuit board, a compression device and a driver circuit. Each substrate includes a positive-pole conductive...
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6644396 |
Anchor base for heat sink of IC chipset
An anchor base for a heat sink for an IC chipset is formed basically in a rectangular frame comprising: two lateral plates respectively formed at the bottom of two opposite lateral stiles of the...
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6643137 |
Heat-dissipating device with grounding capability
A heat-dissipating device is adapted for use with a multi-layer circuit board having a grounding layer and that has an electronic component mounted thereon. The heat-dissipating device includes a...
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6640883 |
Computer heat sink
A computer heat sink, it especially suits heat sinking of various chip sets or processors which may generate high temperature during running, and has the effect of better efficiency of heat sinking...
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6639803 |
Compliant heat sink device/mounting system interconnect and a method of implementing same
A heat sink device interconnect including a mounting device, having a mounting device top, a board stiffener, wherein the board stiffener is disposed so as to be communicated with the mounting...
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6625026 |
Heat-activated self-aligning heat sink
A heat-activated self-aligning heat sink is built thermally connecting at least one heat-generating devices on a substrate to the heat sink body, where the heat-generating devices may not be...
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6621707 |
Liquid-cooled electronic apparatus
An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is...
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6619381 |
Modular heat dissipating device
A modular heat dissipating device comprising multiple U-shaped fins connected to one another. Each fin includes an upper plate extending from an upper edge of the fin. At least one aperture is...
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6616999 |
Preapplicable phase change thermal interface pad
A thermal interface for facilitating heat transfer from an electronic component to a heat sink. According to a preferred embodiment, the thermal interface comprises a first planar substrate that...
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6618251 |
Cooling device capable of contacting target with smaller urging force
A heat conductive fluid is interposed between an electronic component and a heat sink. The heat conductive fluid serves to enhance the contact between the surface of the electronic component and...
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6614658 |
Flexible cable stiffener for an optical transceiver
An optical transceiver utilizes a stiffener including a surface adapted for attachment of a portion of a flexible circuit having electrical components that protrude from the flexible circuit. The...
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6611999 |
Detent means for a heat sink
The detent means for a heat sink is provided thereon with an elastic member in connecting with two side clamp holders, the elastic member is bent to render the bending area to be the force bearing...
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6611430 |
Miniature self-locking, spring action, microwave module retainer
A miniature, self-locking, spring action, microwave T/R module retainer device includes a retainer body that holds a double arched spring and transfers the spring load to a coldplate. The double...
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6607023 |
Structure for assembling a heat sink assembly
A structure for assembling a heat sink assembly uses at least an interlocking device to assemble at lease a heat sink fin. The improvement in the interlocking devices comprises a female slot, a...
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6607028 |
Positioning structure for heat dissipating fins
A positioning structure for heat dissipating fins is provided. The heat dissipating fins is comprised of multiple metal plates, each of which comprising a main body, and a folded side portion...
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6606246 |
Method and apparatus for retaining cooling apparatus and bus bar
A method and apparatus for retaining a cooling apparatus in engagement with an integrated circuit including a frame with a bus bar carrying an electrical signal from one part of a circuitboard to...
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6598666 |
CPU cooling arrangement
A CPU cooling arrangement is constructed to include a heat sink fastened to a CPU holder and disposed in contact with the CPU in the CPU holder, the heat sink having a vertically extended solid...
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6600649 |
Heat dissipating device
A heat dissipating device includes a heat dissipating fin unit, a heat dissipating fan unit, a heat exchanger, and a pump. The pump draws working fluid from the heat exchanger via a delivery pipe,...
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6595275 |
Heat sink assembly
A heat dissipation assembly includes a base with a ridge and multiple fins mounted on top of the base. Each of the fins has a plate with a cutout defined in a mediate portion of a bottom edge to...
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6590772 |
CPU and circuit board mounting arrangement
A CPU and circuit board mounting arrangement in which a CPU connector is installed in a circuit board for top loading of a CPU to electrically connect respective bottom pads of the CPU to...
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6587341 |
Heat dissipater structure
A heat dissipater structure has a heat sink base with peripheral sides thereof folded upwards from the bottom plate and cut into a plurality of lateral plates at proper angles to form wind channels...
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6587346 |
Combination electrical power distribution and heat dissipating device
In accordance with the teachings of the present invention, the electronic system comprises a housing having a base and a lid. A circuit board is installed on the base of the housing. At least one...
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6578625 |
Method and apparatus for removing heat from a plate
A cooling system ( 10 ) includes a member ( 26 A, 26 B) with an opening ( 27 ) therethrough, and includes first and second heat-conductive sections ( 21, 22 ) disposed adjacent the member on...
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6577504 |
Integrated heat sink for different size components with EMI suppression features
An integrated heat sink that can provide heat dissipation from multiple components mounted on a circuit board with each component having a different height dimension relative to each other is...
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