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6791832 |
Electronic package
An electronic package for providing an increased density of electronic components in systems includes electronic components mounted on two surfaces of a substrate. Electrical coupling is provided...
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6788540 |
Optical transceiver cage
The present invention relates to a cage for holding an optical transceiver module in electrical contact with a host circuit board. The cage includes front, middle and rear sections, and facilitates...
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6788538 |
Retention of heat sinks on electronic packages
A structure for removing heat from a packaged electronic component. The structure includes three, main elements. First, a heat sink has a pedestal with opposing ends and a plurality of fins...
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6785142 |
System and method for detecting blank modules
A system and method for detecting blank modules includes an information handling system including at least one computing component, a modular chassis, a management module, and one or more sensors....
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6785136 |
Coupling mechanism for radiator
A coupling mechanism for radiator aims to fasten a radiator to a heat generating element of a socket on a main board for absorbing the thermal energy generated by the heat generating element. The...
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6781838 |
ATTACHING DEVICE FOR MOUNTING AND FIXING A DEVICE FOR GENERATING HEAT AND A HEAT SINK PROVIDED ON THE DEVICE FOR GENERATING HEAT ON A BOARD, A MOUNT BOARD HAVING THE BOARD, THE DEVICE FOR GENERATING HEAT, AND THE HEAT SINK, AND AN ATTACHING METHOD OF THE DEVICE FOR GENERATING HEAT AND THE HEAT SINK PROVIDING ON THE DEVICE FOR GENERATING HEAT ON THE BOARD
An attaching device is provided for mounting and fixing a device for generating heat, such as a semiconductor device, and a heat sink provided on the device for generating heat on a board. The...
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6779593 |
High performance cooling device with heat spreader
A low-cost, fan assisted cooling device is disclosed. The cooling device includes a heat mass with a taper bore therein adapted to receive a heat spreader that has a shape that complement the taper...
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6781837 |
System and method for information handling system heat sink retention
A heat sink retention system and method secures a heat sink proximate to a packaged electronic component, such as central processing unit, by rotationally engaging the heat sink with a retaining...
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6781831 |
Card-cage with integrated control and shaping of flow resistance curve for multiple plenum chambers
An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or...
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6781840 |
Fastening mechanism
Fastening members such as tapping screws and rivers having a shaft are used to fasten objects such as circuit elements, a circuit board and a casing to a target object such as a heat sink of a...
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6781835 |
Air-applying device having a case with an air inlet port, a cooling unit having the air-applying device, and an electronic apparatus having the air-applying device
An air-applying device has an impeller having a center of rotation, and a case which contains the impeller. The case includes a first edge defining an inlet port of air which exposes the center of...
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6776224 |
Heating dissipating device for electronic elements
A heating dissipating device for electronic elements comprises a bottom plate and a plurality of heat dissipating sheets; the bottom plate being formed with a plurality of grooves. A lower end of...
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6778395 |
Heat sink clip
A heat sink clip ( 10 ) includes a pressing section ( 11 ) and first and second spring sections ( 12, 14 ). A first arm ( 15 ) depends from the first spring section. An operation lever ( 24 )...
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6776221 |
Computer system having a chassis-level capillary pump loop transferring heat to a frame-level thermal interface component
A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which...
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6771508 |
Method and apparatus for cooling an electronic component
In one embodiment, the invention provides a system. The system comprises using a plurality of heat absorbing fins to absorb heat from an electronic component of a substrate-mounted electronic...
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6771506 |
Heat sink fastener
A heat sink fastener ( 10 ) includes a pressing beam ( 20 ), a clamping beam ( 30 ), and an operating lever ( 40 ). The pressing beam includes a first pivot portion ( 26 ) at one end thereof, and a...
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6771504 |
Thermal transport element for use with a heat dissipating electrical assemblage
A heat transporting electrical assemblage retained in a retaining unit transports heat between a heat sink and a thermal transport element in fluid communications with the heat sink. The thermal...
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6766851 |
Heat sink fin assembly
A heat sink fin assembly structure, suitable for various kinds of computer chip sets or processors, mainly has a plurality of heat sink fins assembled to form a plurality of upright and parallel...
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6765798 |
Electronic thermal management utilizing device with deflectable, two-leg conductive member; and with elastic, thermally-conductive material there between
A thermal management device is for a electronic apparatus, and includes a thermally conductive member, and elastic and thermally conductive material. The member is for engagement with a heat...
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6765794 |
Heat sink, manufacturing method thereof, and electronic apparatus having the heat sink
It is an exemplified object of the present invention to provide a heat sink, method of manufacturing the same, and electronic apparatus having the heat sink in which a fine and inexpensive...
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6765797 |
Heat transfer apparatus
The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer...
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6765799 |
Heat dissipating fins interlocking mechanism
The present invention of a heat dissipating fin pieces interlocking mechanism includes a plurality of aluminum or copper fin pieces wherein the lower center protruding section is bent and folded...
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6757968 |
Chip scale packaging on CTE matched printed wiring boards
A circuit assembly has a heat sink assembly and a chip scale package assembly. The chip scale package assembly has an integrated circuit die coupled to a first printed wiring board. The heat sink...
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6755242 |
Active heat sink structure with directed air flow
An active heat sink structure includes at least one heat sink. Each heat sink includes a heat sink base having a top surface with a top surface periphery, a top surface center at a central portion...
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6754078 |
Heat dissipating device with slanting engaged heat dissipating sheets and bottom plate
A heat dissipating device comprises a bottom plate and plurality of heat dissipating sheets. A surface of the bottom plate is formed with a plurality of inclined recesses which are spaced with an...
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6749009 |
Folded fin on edge heat sink
A heat sink for cooling electrical or electronic devices comprises a spreader plate having a top surface and having a bottom surface for attaching to the electronic device. A folded fin formed from...
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6742573 |
Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin
A heat sink including a heat dissipating fin comprises (1) a heat dissipating fin having a plurality of mountain-shaped portions and base portions supporting the mountain-shaped portions, (2) a...
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6742581 |
Heat sink and fin module
A heat sink comprises a base portion, and a multiplicity of thin plate fins erected on the base portion in parallel with each other. The fins are folded in two at their lower ends to form two-ply...
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6741475 |
Portable electronic apparatus with replaceable built-in external power supply module
An electronic apparatus includes a housing, a circuit unit, and an external power supply module. The housing is formed with a circuit receiving space and a module receiving space. The circuit unit...
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6732786 |
Edge-mounted heat dissipation device having top-and-bottom fan structure
A heat dissipation device is mounted to an edge of a circuit board for removing heat from an electronic device mounted on the circuit board. The heat dissipation device includes a contact pad made...
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6735082 |
Heatsink with improved heat dissipation capability
A tandem heat sink operable to provide heat dissipation to one or more electronic components. The tandem heat sink apparatus creates air turbulence within the air stream across the one or more...
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6735077 |
Thermal diffuser and radiator
The present invention relates to a thermal diffuser which having a path for close thermal coupling uniformly between an electronic component mounted in an electronic equipment and a desired thermal...
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6735084 |
Heat sink for electronic devices, and circuit board and plasma display panel assembly each equipped with the heat sink
A heat sink for electronic devices, and circuit board and plasma display panel assembly, each equipped with the heat sink. The heat sink for electronic devices, and circuit board and PDP assembly...
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6735081 |
Thermal management apparatus for horizontal electronics enclosures
A reconfigurable apparatus for thermal management of an electronics module is described. The apparatus includes a pair of fans generating airflow along respective fan axes. The apparatus also...
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6731504 |
Heat sink fastener
A heat sink fastener for securing a heat sink to a CPU is described as having a holding down spring plate. The holding down spring plate has a flat bearing portion at one end, a first hook plate...
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6729384 |
Cooling fin assembly
A cooling fin assembly according to the invention includes a plurality of cooling fins joined with one another for forming a plurality of vertical and parallel cooling fins mounted on a base of a...
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6729385 |
Fin structure and the assembly thereof
A fin structure is disclosed. The fin structure includes a first concavo-convex portion formed with a concave on a first surface of the fin in the direction of thickness and a corresponding convex...
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6728105 |
Electronic apparatus having a heat conducting sheet that promote heat radiation from a memory module
Disclosed herein is an electronic apparatus that comprises a housing having an outer wall, a receptacle provided in the housing and having an opening made in the outer wall, and a heat-generating...
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6728104 |
Methods and apparatus for cooling a circuit board component
The heat sink of the present invention includes a device portion, a bend portion, and a support portion that thermally couples the circuit board component to a support member, thereby allowing for...
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6724629 |
Leaf spring load plate with retained linear cam slide
An integrated circuit attachment implementation includes a mechanism for inserting and securely holding a replaceable component to an integrated circuit. The mechanism includes a top plate, leaf...
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6724624 |
Housing with directed-flow cooling for computer
Housing with directed-flow cooling ( 10 ) for computer ( 110 ) provides auxiliary airflow for cooling a heat-sensitive component, such as CPU ( 120 ). Housing ( 10 ) includes partition ( 60 ) that...
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6722419 |
Computer cooler
A computer cooler fixed on top of CPU for dissipating heat generated by CPU includes at least a base whose bottom surface is connected with upper surface of CPU and a plurality of cooling fins...
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6714414 |
Spring spacer assemblies for maintaining electrical components in contact with thermal transfer surfaces
A spring spacer assembly maintains thermal contact between a thermal transfer surface of a heat sink and a heat-generating electrical component mounted on a printed circuit board between the...
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6714415 |
Split fin heat sink
A heat sink for dissipating heat from an electronic component includes a core and a plurality of fins extending outwardly from the core. The fins may be at least partially curved. Each fin may...
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6712130 |
CPU cooling structure
A CPU cooling structure is constructed to include a heat sink adapted for mounting on a motherboard to absorb heat from a CPU of the motherboard, a fan provided above the heat sink and adapted for...
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6711019 |
Mounting fitting of heat sink and method of removing the same
A mounting fitting of a heat sink of the present invention is unitarily formed of a first spring, a second spring, a central part disposed in the boundary between the first and second springs, a...
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6711016 |
Side exhaust heat dissipation module
A side-exhaust heat dissipation module for cooling an electronic device. The side-exhaust heat dissipation module comprises a base, a fan, a fin assembly and an airflow guiding cover. The fan is...
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6704976 |
Fastener for a heat-radiator
A fastener for a heat-radiator is composed of a frame and two strips. The frame has two parallel first sides and two parallel second sides perpendicular to the first sides. Each first side has a...
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6707675 |
EMI containment device and method
Disclosed herein are electromagnetic interference ‘EMI’ containment devices and methods for abating interference generated by electronic devices.
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6707673 |
Heat sink for chip stacking applications
A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat...
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