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8184439 |
Semiconductor module
A semiconductor module includes a semiconductor package generating thermal energy, a heat collecting member transferring thermal energy from the semiconductor package to a heat collection area in...
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8169782 |
Electronic circuit device
An electronic circuit device that suppresses deformation of an adhesive layer of a flexible printed circuit board during formation of a resin seal portion, and suppresses deterioration of the...
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8149574 |
Cooling fan housing assembly
A cooling fan housing assembly for assembling to a heat sink includes a boosting portion and a connecting portion extended from the boosting portion. The connecting portion includes a first part...
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8144469 |
Processor loading system
A component loading system includes a board having a socket, wherein the board includes a first mounting member and a pair of first heat dissipater coupling posts that extend from the board...
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8134835 |
Compression clamping of semiconductor components
The present invention relates to a clamping device for compression clamping of one or more semiconductor devices and associated semiconductor components with a desired compression force equally...
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8134837 |
Twist-secured assembly of a power semiconductor module mountable on a heat sink
A power semiconductor module system includes a power semiconductor module, a heat sink and at least one fastener. The power semiconductor module includes a bottom side with a first thermal contact...
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8134836 |
Packaged heat dissipating assembly for an intermediate bus converter
A packaged heat dissipating assembly for an intermediate bus converter (IBC) has a frame being mounted on and around the IBC and a heat sink being mounted on the frame. The packaged heat...
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8127439 |
Method of manufacturing electronic component device
A recessed portion is formed in a predetermined position in a heat-spreading component. A thermoplastic resin serving as a thermal interface material (TIM) is stored in the recessed portion....
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8130499 |
Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board
The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an...
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8130498 |
Heat sink of at least one electronic component
The invention relates to a cooling body of at least one electrical component. According to the invention, a first cooling body section is designed as a spring and a contact surface is provided on...
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8120171 |
Power drive unit including a heat sink and a fastener
A power drive unit is configured to comprise a heat sink, a power module pressed by a press member to the heat sink to be fastened thereto and a spring member that has a substantially circular...
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8111516 |
Housing used as heat collector
A system for cooling processor assembly is disclosed which comprises a printed circuit board (PCB) with a plurality of heat emitting electronic components and a housing for each PCB with a heat...
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8111513 |
Industrial computer
An industrial computer includes a first casing, a second casing, a storage unit, a cover, and a heat dissipation unit. The second casing and the first casing form a closed casing, and the outside...
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8081458 |
Heat dissipation apparatus for electronic device
A heat dissipation apparatus adapted for simultaneously cooling a first electronic component and a second electronic component includes a heat sink adapted for being thermally attached to the first...
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8077476 |
Electronic device mounting structure
An electronic device mounting structure includes a thermally conductive base, a busbar located on the base, an electronic device mounted on the busbar, a thermally conductive wall standing on the...
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8072763 |
Printed circuit board assembly
A printed circuit board assembly includes a heat sink, a back board, and a securing member. The heat sink is configured to be mounted on a heat generating element of a printed circuit board. The...
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8072762 |
Printed circuit board assembly
A printed circuit board assembly includes a printed circuit board, a first heat dissipating module, and a second heat dissipating module. The printed circuit board includes a first heat generating...
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8064202 |
Sandwich structure with double-sided cooling and EMI shielding
A sandwich structure and method thereof is disclosed for double-sided cooling, EMI noise shielding and current carrying in mini-modules. The proposed structure comprises a top structure and a...
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8064201 |
Securing device and thermal module incorporating the same
A thermal module includes a fin assembly, a heat spreader, a heat pipe connected between the fin assembly and the heat spreader, and a securing plate. The securing plate has at least three...
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8057082 |
Multiple axes adjustable lighting system
A lighting assembly includes a thermally conductive mounting having a mounting surface is provided. The lighting assembly further includes a thermally conductive carriage having a front and a rear...
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8059411 |
Vehicular electronics assembly
An electronics assembly for use in a vehicle is provided. The assembly comprises a heat sink, a dam coupled to the heat sink, the dam and the heat sink combining to form a reservoir, an electronic...
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8050037 |
Electronic control device using LC module structure
In an electronic control device that includes two or more kinds of lead-insertion-type parts, including at least a coil and a capacitor, the parts are installed on a support that has a wiring, a...
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8040674 |
Heat dissipation module and fan thereof
The present invention provides a heat dissipation module and a fan thereof. The heat dissipation module includes a heatsink and a frameless fan. The fan is disposed in the heatsink. The fan...
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8023268 |
Printed circuit board unit and semiconductor package
A terminal bump set including the outermost bump row inscribed in a first prism standing upright on the front surface of a package substrate. A heat conductive member contacts with the surface of...
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8018722 |
Double bonded heat dissipation
Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation.
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7994424 |
Cooling of high voltage devices
A high voltage system including a HVDC valve, a liquid fluid cooling system for cooling the valve, and a high voltage bushing for transferring high voltage and high current from the fluid cooled...
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7990718 |
Heat dissipation device having a clip assembly
A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board includes a heat sink, a wire clip and two operating members. The heat sink has a bottom...
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7990715 |
Electrical assembly and fastening assembly thereof
An electric assembly includes a heat sink defining a through hole and a notch communicating with the through hole; a circuit board defining a fixing hole; and a fastening assembly. The fastening...
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7990719 |
Electronic system with heat dissipation device
A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different...
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7986520 |
Electronic device
According to one embodiment, an electronic device includes a printed wiring board, a first heat generating part and a second heat generating part secured to one surface of the printed wiring board,...
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7986521 |
Heat dissipation device and computer using same
A heat dissipation device includes a fin unit, a fan and a fan duct. The fin unit includes a plurality of fins stacked together. An airflow channel is defined between each two neighboring fins. The...
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7983047 |
Mounting assembly for heat sink
A mounting assembly includes a circuit board, a chip socket mounted on a topside of the circuit board with a chip attached thereon, a heat sink positioned on a top surface of the chip, and a...
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7983048 |
Structure for mounting semiconductor package
A mounting structure, in which semiconductor package 1 and heat sink 8 for dissipating heat generated from semiconductor package 1 are mounted on mounting board 3. The rear surface of semiconductor...
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7983043 |
Heat dissipation device
A heat dissipation device includes a heat sink and a pair of heat pipes fixed to the heat sink. The heat sink includes a rectangular post, four branches extending outwardly from four corners of the...
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7983046 |
Electronic control module and enclosed power module
Power electronic devices of an electronic control module are mounted in a power module disposed between the control module circuit board and an interior face of the control module case, with a...
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7974097 |
Printed circuit board and heat sink
A heat sink for a printed circuit board of power server includes at least one soldering portion. The heat sink is soldered to the printed circuit board at the soldering portion by a lead-free tin...
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7969730 |
Portable computer with thermal control and power source shield
A portable computer having a partially sealed cooling system is disclosed. The portable computer contains heat transfer materials that function to remove heat from a sealed area of the portable...
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7969728 |
Heat dissipation device with a fan holder attached with a position-adjustable air guiding member
A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at front and rear sides of...
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7969742 |
Bracket for mounting heat sink
A bracket is used to mount a heat sink to a printed circuit board (PCB). The heat sink can dissipate heat for an electronic component mounted on the PCB. Cantilevers can be detached from the...
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7965506 |
Heat sink apparatus and method for allowing air to flow directly to an integrated circuit package thereunder
A heat sink apparatus and method are provided for allowing air to flow directly to an integrated circuit package thereunder. In use, a heat sink is provided including an upper portion with a...
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7965511 |
Cross-flow thermal management device and method of manufacture thereof
The present disclosure relates to heat transfer thermal management device utilizing varied methods of heat transfer to cool a heat generating component from a circuit assembly or any other...
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7961473 |
Retention module for toolless heat sink installation
An integrated circuit is disposed on a circuit board. A heat sink retention module includes a bracket, members, and coil springs. The members extend through the coil springs and corresponding holes...
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7961471 |
Image processing apparatus with heat dissipating structure
An information processing apparatus having improved cooling efficiency is disclosed. The information processing apparatus includes a first chassis and a second chassis separated from each other at...
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7954332 |
Temperature control systems and methods
Systems and methods for controlling the temperature of an electrical device is described. The system includes a heat sink system in conjunction with a thermoelectric assembly. The systems and...
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7957148 |
Low profile computer processor retention device
A low profile computer processor retention device, the computer processor including a processor substrate and a heat spreader mounted on the processor substrate. The retention device includes a...
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7957149 |
Top actuated, force limiting heatsink retention system
Apparatus for securing or retaining a heatsink. The heatsink retention apparatus includes a heatsink module that cooperates with first and second spring loaded latches secure to a circuit board on...
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7952881 |
Thermal-electrical assembly for a portable communication device
A thermal-electrical assembly (200) provides with improved heat sinking, electrical shielding and electrical grounding. The thermal-electrical assembly is configured using a shield (202) having a...
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7948750 |
Portable electronic device incorporating extendable thermal module
An electronic device includes a chassis, an electronic component, a heat sink having a base and a thermal module. The chassis includes a bottom plate and a side plate surrounding the bottom plate....
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7948756 |
Heat dissipation device
A heat dissipation device includes a base, a connecting member and a wire-shaped clip. The base thermally contacts with an electronic component mounted on a printed circuit board. The connecting...
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7940528 |
Electronic device and heat sink thereof
An electronic device includes a casing, a thermal generating element, and a heat sink. The thermal generating element is disposed within the casing and operates to produce thermal energy. The heat...
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