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7633753 |
Piezoelectric air jet augmented cooling for electronic devices
In some embodiments, piezoelectric air jet augmented cooling for electronic devices is presented. In this regard, an apparatus is introduced having a plurality of more than about one hundred...
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7619889 |
Controllable heat transfer medium system and method for use with a circuit board
A system and method are provided for controlling a transfer of heat between circuit board components. Included is a circuit board with components mounted thereon. Also provided is a controllable...
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7619893 |
Heat spreader for electronic modules
A heat spreader is provided for use with an electronic module. The electronic module has a first side with a first plurality of electronic components mounted thereon and a second side with a second...
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7616442 |
Power electronic module cooling system and method
An improved cooling mechanism for a power electronics device is provided. More specifically, a cooling mechanism is provided wherein an air directing structure with a finite air-flow resistance is...
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7616445 |
Structure and method for efficient thermal dissipation in an electronic assembly
One embodiment of the present invention sets forth an electronic assembly, which comprises a printed circuit board having at least one opening, an electronic component mounted on a first side of...
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7613004 |
Heat sink with heat dissipating fins and method of manufacturing heat sink
A heat sink comprising: a heat dissipating portion comprising a plurality of metal fins each having a heat receiving portion and a heat dissipating portion having elasticity; a fin fixing member to...
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7602607 |
External protrusion for air flow distribution
An apparatus with some embodiments is described having a protrusion to provide air flow distribution to a computing device. In some embodiments, the apparatus may include a housing with one or more...
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7599182 |
Heat dissipation device
An exemplary heat dissipation device is provided for removing heat from a first electronic element and a second electronic element attached to a circuit board. The first electronic element is...
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7593225 |
Disk array system
In the disk array system, in the basic chassis, HDD modules are installed from a front surface in a front part of a backboard, and duplex CTL modules are installed up and down from a rear surface...
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7586746 |
Heat dissipating device with air duct
A heat dissipating device used for dissipating heat from a heat generating device ( 100 ) in a computer. The heat dissipating device includes a fan bracket ( 20 ), a fan ( 27 ) received in the fan...
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7586742 |
Heat dissipation module
A heat dissipation module includes a first heat dissipation apparatus, a second heat dissipation apparatus, at least one first flapper and at least one second flapper. The first heat dissipation...
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7583501 |
Electronic apparatus
An electronic apparatus includes a case, a fan, a plurality of electronic parts, and a heat sink mounted for each electronic part. The heat sink includes a fluid unit, and a shutter plate...
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7580262 |
Heat dissipation assembly for graphics card and blade server using the same
A heat dissipation assembly mounted to a main board in a blade server includes a graphics card, a heat sink, and a thermal board. The graphics card includes a GPU and a plurality of first graphics...
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7576985 |
Rapid cooling of exhaust from arc resistant electrical equipment
A system and method are provided for cooling exhaust from a power center, such as in the event of an arc fault. In one embodiment, a system is provided that includes a power center having an...
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7573712 |
Electronic device with airflow guiding duct
An electronic device with an airflow guiding duct includes a chassis, an airflow guiding duct, and a top cover. The chassis includes a bottom wall and a sidewall perpendicular to the bottom wall. A...
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7573714 |
Method and apparatus for dissipating heat in a computer system
A cooling system for a computer is provided. In one implementation, the cooling system includes a heat spreader that is in thermal contact with a heat generating component in the computer, a frame...
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7554808 |
Heat sink with thermoelectric module
An apparatus may include a thermally-conductive heat sink core having at least one surface, a solid-state heat pump including a first surface and a second surface, the first surface in contact with...
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7554809 |
Heatsink assembly structure
A heatsink assembly structure combined with a heat-generating element disposed on a circuit board is provided. The heatsink assembly structure includes a heat conducting plate and at least one...
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7554804 |
Electronic module configured for air flow therethrough and system including same
An electronic module. The electronic module includes a chassis, a plurality of capacitors, a plurality of bus bars, and a heat sink. The chassis includes a first end and a second end. The first end...
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7554805 |
Heat dissipation structure for electronic devices
The present invention discloses a heat-dissipation structure for electronic devices, which comprises: a housing having an accommodation space accommodating at least one heat-generating element; a...
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7551437 |
Cooling mechanism for circuit board
A cooling mechanism for a circuit board includes a board having electronic components disposed thereon, one or more heat radiation plates disposed on the board, a cooling fan for cooling the board...
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7548428 |
Computer device heat dissipation system
A computer device heat dissipation system comprising a heat exchanger having a plurality of fins connected to a heat pipe, at least one of the plurality of fins comprises at least one aperture to...
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7542292 |
System for efficiently cooling a processor
One embodiment of a system for efficiently cooling a processor includes an active hybrid heat transport module adapted to be integrated with a fansink. The hybrid heat transport module comprises...
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7542290 |
Computer device cooling system
A computer device cooling system comprising a heat exchanger comprising an airflow face and a plurality of cooling fans disposed to form an airflow face, the cooling fan airflow face sized to...
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7535709 |
Airflow-guiding device
An airflow-guiding device ( 40 ) is secured at one side of a row of fans ( 20 ) in a computer chassis ( 10 ) and is capable of allowing air to flow therethrough in one direction only. The...
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7535710 |
Electronic device
An electronic device. The electronic device includes a housing, a passage, and a plurality of first fans. The housing has an inner space, with the passage disposed therein. The plurality of first...
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7511956 |
Electronic apparatus
According to one embodiment, a housing of an electronic apparatus includes a first sidewall portion provided with an air vent, a ceiling wall portion extending from an upper end of the first...
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7511955 |
Fan holder for receiving multiple fans
A fan holder for mounting fans includes a first plate having a plurality of airflow openings, and a second plate having a plurality of airflow openings aligned with the airflow openings of the...
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7502229 |
Heat dissipation system for multiple integrated circuits mounted on a printed circuit board
A system is provided for heat sinking and environmental dissipation of heat generated by one or more ICs mounted to a printed circuit board. The system includes a primary thermally conductive plate...
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7495911 |
Active heat-dissipating type of power supply apparatus having heat-dissipating mechanism for power input device
An active heat-dissipating type of power supply apparatus includes a casing, a first airflow channel, a second airflow channel, plural electronic components, an airflow driving device and a power...
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7492592 |
Heat dissipating apparatus for equipment chassis
A heat dissipating apparatus includes a bracket mounted in an equipment chassis, a fixing plate, a fan installed on the fixing plate, a rotating device mounted in the bracket and rotatably...
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7492593 |
Cooled electronics system employing air-to-liquid heat exchange and bifurcated air flow
Augmenting air cooling of electronics system using a cooling fluid to cool air entering the system, and to remove the heat dissipated by the electronics. A cooled electronics system includes a...
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7471514 |
Auxiliary cooling device for memory chips
An auxiliary cooling device includes two side boards with a space defined therebetween and the existed memory chips and the cooling plates on two sides of the memory chips are received in the...
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7466547 |
Apparatus for air cooling of an electronic device
An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly...
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7456751 |
Electronic apparatus and method of cooling the electronic apparatus
An electronic apparatus includes a housing, a first heat-generating member provided in the housing, a heat-radiating member thermally connected to the first heat-generating member, a first fan...
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7447023 |
Heat dissipation device for computer add-on cards
A heat dissipation device is to be mounted in a computer enclosure for dissipating heat generated by a VGA card ( 10 ). The heat dissipation device includes a heat sink ( 90 ), a fan ( 60 ) and a...
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7436660 |
Heat sinks for electronic enclosures
An apparatus for cooling electronics is disclosed. The apparatus generally relates to heat sinks that are operatively connected to electronics enclosures. The heat sinks may be part of the...
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7436663 |
Disk array system
In a disk array apparatus according to an aspect of the invention, temperatures of disk drives arranged in a casing are equalized to reduce a noise. A disk array apparatus 50 comprises plural...
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7397661 |
Cooled electronics system and method employing air-to-liquid heat exchange and bifurcated air flow
Augmenting air cooling of electronics system using a cooling fluid to cool air entering the system, and to remove the heat dissipated by the electronics. A cooled electronics system includes a...
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7397664 |
Heatspreader for single-device and multi-device modules
A heatsink includes a heatsink base, an elastomeric base, multiple slider pins and an alignment frame coupled to the heatsink base. The elastomeric base includes multiple holes, the elastomeric...
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7382616 |
Cooling system for computer hardware
The present invention represents a significant advancement in the field of cooling systems for computer hardware. In one embodiment, a system for cooling a heat-generating electronic device is...
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7382619 |
Printed circuit board with improved heat dissipation efficiency, electronic apparatus having printed circuit board with improved heat dissipation efficiency, CRT display device having printed circuit board with improved heat dissipation efficiency, and recording/reproducing device or video display device incorporating recording/reproducing device having printed circuit board with improved heat dissipation efficiency
The invention provides an electric apparatus having a printed circuit board with an improved heat dissipation capacity, and, in particular, to provide an electric apparatus requiring plural printed...
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7379300 |
Fixing mechanism for a fan fixing frame
A fixing mechanism fixes a side of a fan frame having a plurality of cooling fans and provided with a locking elastic tab having a second locking portion to a bottom board of a housing of an...
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7362584 |
Heat relief socket
A heat relief socket is provided where a contact carrier substrate is provided carrying a plurality of contacts, and is supported by a frame. The frame has an open area therethrough which can...
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7362572 |
Techniques for redundant computing within a 1U form factor with improved resource partitioning and management
An improved redundant computing apparatus includes a chassis assembly configured to (i) mount to a standard electronic equipment rack and (ii) consume substantially 1U of space in a particular...
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7355857 |
Heat sink gasket
A receptacle assembly is provided having a gasket interposed between a heat sink and the receptacle, in order to provide EMI shielding and limit leakage from an opening in the receptacle that...
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7355852 |
Modular liquid cooling of electronic assemblies
An electronic system includes an array of electronic assemblies at a first location within a system. An array of liquid cooling assemblies is placed at a second location within the system. Hoses or...
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7355851 |
Power adapter with fan assembly and control circuit
A power converter with a fan assembly cools down a temperature of the power converter. The power converter with a fan assembly includes a housing, a plate, and a second plate. The housing includes...
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7352572 |
Fire block module
The fire block module includes a number of rectangular plate strips, arranged vertically and parallel to each other to form a grid layer. The grid layer is arranged horizontally in respect of the...
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7352575 |
Dynamic air moving system
Disclosed is a dynamic air moving system comprising a rail system disposed in an electronic enclosure, at least one fan housing moveably disposed on the rail system, the fan being actuatable along...
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