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8184435 |
Hot aisle containment cooling system and method
An air containment cooling system for containing and cooling air between two rows of equipment racks includes a canopy assembly configured to enclose a hot aisle defined by the two rows of...
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8174830 |
System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling
A circuit board includes a pump and a channel. The channel includes a liquid metal and a coating. The liquid metal is pumped through the channel by the pump and the coating reduces diffusion and...
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8164901 |
High efficiency heat removal system for rack mounted computer equipment
An efficient method of heat removal from rack mounted computer equipment, network gear and other electronic equipment, consisting of solid heat conducting components in direct contact with the heat...
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8161643 |
Method for forming a cooling jacket for an electric motor
A cooling jacket for a motor includes an extruded jacket body having an outer peripheral surface, an inner peripheral surface, and a plurality of discrete cooling passages located between the inner...
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8162035 |
High conductivity ceramic foam cold plate
A cold plate and method for cooling using the cold plate are disclosed. The cold plate includes a housing having hyperporous, microchannel ceramic foam strips disposed therewithin. A plurality of...
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8132616 |
Temperature conditioning system with thermo-responsive valves
Disclosed is a temperature conditioning system including several thermal transfer blocks, where each is associated with one of several components requiring thermal management. Each of the...
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8130496 |
Device and method for mitigating radio frequency interference
Embodiments of the present invention describe a device and method of mitigating radio frequency interference (REI) in an electronic device. The electronic device comprises a housing, and a thermal...
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8120916 |
Facilitating cooling of an electronics rack employing water vapor compression system
A cooling apparatus and method are provided for facilitating cooling of an electronic apparatus that includes a semiconductor element. The cooling apparatus includes an evaporator containing a...
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8116080 |
Container-based data center having greater rack density
A container includes first and second long sides parallel to the container's length. Racks are organized in rows parallel to the container's width. Each rack is receptive to installation of...
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8107241 |
Electric power conversion apparatus including cooling units
In a conventional cooling device, a heat pipe or a circulation-type liquid cooler provided with a pump is used and therefore, a large space is needed for the cooling device. There is provided a...
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8089765 |
Extruded server case
A liquid submersion cooled computer that includes a seamless, extruded main body used to form a liquid-tight case holding a cooling liquid that submerges components of the computer. By forming the...
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8082977 |
Ceramic mounting for wafer apparatus with thermal expansion feature
A mounting apparatus includes a surface plate; a temperature control unit integrated with the surface plate; and a bottom plate integrated with the temperature control unit via a heat insulation...
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8081461 |
Cooling apparatus with thermally conductive porous material and jet impingement nozzle(s) extending therein
A cooling apparatus and method of fabrication are provided for facilitating cooling of an electronic device. The cooling apparatus includes a thermally conductive porous material and a liquid...
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8072758 |
Automotive inverter assembly
In an embodiment, an automotive inverter assembly has at least one component for cooling. The inverter assembly has a supporting body for supporting the at least one component. The supporting body...
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8071816 |
Hydrofluoroacetal compounds and processes for their preparation and use
The present disclosure provides a compound according to the formula: Rf1[CH(—O—CH(3-m)Rf2m)(—O—CF2—CFH—Rf3)]n [I] wherein n is 1 or 2, wherein m is 1, 2 or 3, wherein, when n is 1, Rf1 is selected...
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8066057 |
Flow distributing unit and cooling unit
A distributor (1) for distributing a flow of cooling fluid over one or more surface(s) (3) to be cooled has a housing (13) that may be manufactured in a single piece together with inlet (8) and...
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8064197 |
Heat management using power management information
A multi-core microprocessor provides an indication of the power management state of each of the cores on output terminals. Cooling of the cores is adjusted responsive to the indication of the power...
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8064201 |
Securing device and thermal module incorporating the same
A thermal module includes a fin assembly, a heat spreader, a heat pipe connected between the fin assembly and the heat spreader, and a securing plate. The securing plate has at least three...
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8064198 |
Cooling device for semiconductor element module and magnetic part
A cooling device for a semiconductor element module and a magnetic part, includes: a water-cooled type heat sink having a cooling water passage; a semiconductor element module including a plurality...
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8052282 |
Heat dissipation system and electronic device utilizing the same
An electronic device includes a heat dissipation system and an operating system. The heat dissipation system includes a housing, a first heat dissipation module received in the housing, heat pipes...
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8050028 |
Heat dissipation in computing device
A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk...
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8050034 |
Electronic apparatus and cooling system
An electronic apparatus comprises a case configured to house an electronic circuit unit and includes an air intake, through which external air is taken into the case, and an exhausting opening,...
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7990714 |
Heat dissipation device and fasteners thereof
A heat dissipation device includes a heat sink, a heat absorbing plate, a heat pipe thermally connecting the heat sink and the absorbing plate, a pressing plate secured to the heat absorbing plate...
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7986528 |
Cooling plate structure of cooling apparatus and transmitter with the cooling apparatus
A cooling plate structure of a cooling apparatus includes a cooling plate and at least one refrigerant circulating conduit disposed in the cooling plate. The conduit includes refrigerant...
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7983044 |
Electrical apparatus, cooling system therefor, and electric vehicle
An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of...
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7983040 |
Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes...
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7978472 |
Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof
Liquid-cooled electronics racks and methods of fabrication are provided wherein a liquid-based cooling apparatus facilitates cooling of electronic subsystems when docked within the electronics...
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7974096 |
Three-dimensional thermal spreading in an air-cooled thermal device
The present disclosure relates to heat transfer thermal management device utilizing varied methods of heat transfer to cool a heat generating component from a circuit assembly or any other...
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7966979 |
Mounting and cooling device for emissions system electronics
A cooling device for emissions system electronics is disclosed. The cooling device may have a mount for an exhaust treatment device. The mount may have a framework comprising a plurality of rigid...
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7969728 |
Heat dissipation device with a fan holder attached with a position-adjustable air guiding member
A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at front and rear sides of...
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7965513 |
Electronic device assembly with heat dissipation device
An exemplary electronic device assembly includes a printed circuit board with an electronic component thereon, and a heat dissipation device. The heat dissipation device includes a heat sink...
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7965510 |
Power conversion apparatus and power module
A power conversion apparatus includes a power module, four corners of which are fastened to a cooling jacket from its front surface by a front surface side fastening apparatus that includes nuts...
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7965511 |
Cross-flow thermal management device and method of manufacture thereof
The present disclosure relates to heat transfer thermal management device utilizing varied methods of heat transfer to cool a heat generating component from a circuit assembly or any other...
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7952873 |
Passive conductive cooling module
A cooling module includes a thermally conductive plate, a bladder disposed on at least one side of the plate, the bladder have a chamber, and fluid disposed in the chamber of the bladder wherein...
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7948757 |
Multi-fluid cooling of an electronic device
A method of fabricating a multi-fluid cooling system is provided for removing heat from one or more electronic devices. The cooling system includes a multi-fluid manifold structure with at least...
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7948756 |
Heat dissipation device
A heat dissipation device includes a base, a connecting member and a wire-shaped clip. The base thermally contacts with an electronic component mounted on a printed circuit board. The connecting...
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7944688 |
Heat dissipating structure including a position-adjusting unit
A heat dissipating structure for a heat source includes a position-adjusting unit, a first heat dissipating element, a second heat dissipating element and a first heat conducting element. The...
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7944694 |
Liquid cooling apparatus and method for cooling blades of an electronic system chassis
Apparatus and method are provided for facilitating liquid cooling of a plurality of blades of an electronic system chassis. The apparatus includes a chassis-level manifold assembly with a first...
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7940527 |
Cooling system for electronic structural units
Cooling systems (1) suitable for cooling an electronic unit (2) or assembly. The cooling system is provided with a cooling channel (6). An electronic unit (2) rests over a heat-conducting cooler...
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7936560 |
Cooling device and electronic equipment including cooling device
A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins,...
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7921903 |
Heat exchange system
A heat exchange system for electronic devices, preferably data processing devices which include high-performance processors or have a high processor density, includes essentially a primary cooling...
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7911782 |
Liquid submersion cooling system
A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling heat-generating components in computer systems and other...
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7911792 |
Direct dipping cooled power module and packaging
A power module package including a fully enclosed package comprising sidewalls; wherein at least one of said sidewalls includes a conductive substrate; wherein circuit elements are mounted on said...
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7905276 |
Method and apparatus for leak-proof mounting of a liquid cooling device on an integrated circuit
Apparatus for cooling of an electrical circuit element on an electrical element package, comprising in combination, structure including a hollow body defining a cavity for containing cooling fluid...
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7905275 |
Ceramic foam cold plate
An exemplary cold plate housing defines an inlet port and an outlet port. A plurality of foam strips are disposed in the housing. Each foam strip suitably has pore size of no more than around 50...
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7907408 |
Cooling apparatus and power converter
A cooling apparatus with high strength and good heat radiation characteristics. In the cooling apparatus, a heat exchanger is joined to an evaporator disposed on the lower side in a face to face...
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7903404 |
Data centers
According to one embodiment, a data center comprises a first data center section comprising one or more equipment element elements. Each computer element has one or more heat generating sources. A...
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7903409 |
System and method for cooling an electronic device
A system for cooling an electronic device having a heat-generating component includes a passive cooling device having a cooling ability designed to expire after a predetermined amount of heat is...
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7903420 |
Fixing structure of fixing a thermal module
A fixing structure for fixing a thermal module on a chip of a printed circuit board is provided. The printed circuit board has a plurality of studs and a positioning post. The fixing structure...
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7886816 |
Intelligent cooling method combining passive and active cooling components
A method for cooling a semiconductor including passive cooling including transferring heat via passive cooling components; active cooling including transferring heat via active cooling components;...
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