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7391613 |
Memory module assembly including a clamp for mounting heat sinks thereon
A memory module assembly includes a printed circuit board ( 10 ) having a main heat-generating electronic component ( 52 ) thereon, first and second heat sinks ( 20 ), ( 30 ) attached on opposite...
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7390427 |
Hydrofluoroether as a heat-transfer fluid
The present invention provides an apparatus comprising a device and a mechanism for heat transfer comprising a hydrofluoroether heat-transfer fluid wherein the heat transfer fluid is represented by...
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7388752 |
Series-connected heat dissipater coupled by heat pipe
A series-connected heat dissipater coupled by heat-pipe used for the interface cards of a computer system. Wherein, a plurality of additional auxiliary dissipaters are provided onto the insertion...
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7388747 |
Heat plate fixing structure
A heat plate fixing structure is provided, suitable for being used in the heatsink structure of the heating element for an electronic device, which is provided with a support part and a fixing...
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7388746 |
Heatsink assembly
A heatsink assembly having a simple structure for coupling a heatsink and an electronic chip is provided with a heatsink which contacts an electronic chip mounted on a substrate and absorbs heat...
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7385821 |
Cooling method for ICS
The present invention is a cooling device for removing heat from an integrated circuit. In one embodiment, the cooling device includes a conduit and a flexible channel having a first open end and a...
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7385817 |
Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled
Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates,...
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7385816 |
Dual impeller push-pull axial fan heat sink
A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate...
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7382616 |
Cooling system for computer hardware
The present invention represents a significant advancement in the field of cooling systems for computer hardware. In one embodiment, a system for cooling a heat-generating electronic device is...
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7380409 |
Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing
An isolation valve assembly, a coolant connect/disconnect assembly, a cooled multi-blade electronics center, and methods of fabrication thereof are provided employing an isolation valve and...
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7379301 |
Integrated liquid cooling system
An integrated liquid cooling system for removing heat from a heat-generating component includes a base ( 10 ), a pump ( 20 ) mounted in the base and a heat-dissipating member ( 30 ) communicating...
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7373967 |
Mechanical assembly, for regulating the temperature of an IC-Chip, having a gimbaled heat-exchanger with coiled springy conduits
A mechanical assembly for regulating the temperature of an IC-chip in an IC-module includes: a) a heat-exchanger having a first face for contacting a second face on the IC-module; and b) a gimbal,...
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7372698 |
Electronics equipment heat exchanger system
An electronics equipment heat exchanger system for thermally managing the electronic devices of a computer server and the exhaust air emitted from the computer server. The electronics equipment...
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7369410 |
Apparatuses for dissipating heat from semiconductor devices
An apparatus for providing two-phase heat transfer for semiconductor devices includes a vapor chamber configured to carry a cooling liquid, the vapor chamber having base section, and a plurality of...
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7369409 |
Apparatus, method, and control program for cooling electronic devices
A thermal distribution detecting unit detects a thermal distribution state on a surface of an electronic device. An emission control unit identifies a position to be cooled in accordance with the...
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7365981 |
Fluid-cooled electronic system
A fluid-cooled electronic assembly including a base having a fluid inlet and a fluid outlet therein, a cap attached to the base to form a fluid containment chamber therebetween, wherein the fluid...
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7365980 |
Micropin heat exchanger
An apparatus including a micropin thermal solution is described. The apparatus comprises a substrate and a number of micropins thermally coupled to the substrate. The micropins are arranged in a...
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7362575 |
Cooling method use diamond pins and heat pipes
An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal...
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7362574 |
Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus
A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold...
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7360582 |
Flow distributing unit and cooling unit having bypass flow
A cooling unit for cooling in particular power semiconductors contains a distributor for guiding liquid across a surface to be cooled. The distributor comprises an inlet manifold ( 8 ) and outlet...
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7359198 |
System and method for inducing turbulence in fluid for dissipating thermal energy of electronic circuitry
A method for cooling a circuit comprises generating movement of fluid along a path through a closed-loop system. The method further comprises inducing turbulence in the fluid by movement of at...
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7355857 |
Heat sink gasket
A receptacle assembly is provided having a gasket interposed between a heat sink and the receptacle, in order to provide EMI shielding and limit leakage from an opening in the receptacle that...
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7355428 |
Active thermal control system with miniature liquid-cooled temperature control device for electronic device testing
A temperature control system, which includes a miniature liquid-cooled heat sink, is used to provide a controlled temperature surface to an electronic device, such as a semiconductor device, during...
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7353859 |
Heat sink with microchannel cooling for power devices
An apparatus for cooling at least one heated surface includes a base plate defining a number of inlet and outlet manifolds. The inlet manifolds are configured to receive a coolant, and the outlet...
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7352577 |
Liquid-cooled heat dissipation module
A liquid-cooled heat dissipation module for circularly dissipating heat from a heat source. The liquid-cooled heat dissipation module includes a fan having a base; a pump disposed on the base; a...
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7349213 |
Coolant control unit, and cooled electronics system and method employing the same
A coolant control unit for a liquid cooled electronics system is provided, which includes an external coolant inlet and outlet for receiving and returning external coolant; an internal coolant loop...
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7349209 |
Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region
Apparatus and method are provided for facilitating cooling of an electronics rack employing an air delivery structure coupled to the electronics rack. The air delivery structure delivers air flow...
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7343963 |
Hybrid heat sink performance enhancement using recirculating fluid
A method and incorporated heat sink that is cooled both thorough air flow and liquid circulation is provided. The heat sink is disposed close to electronic components and used for their cooling. It...
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7342785 |
Cooling device incorporating boiling chamber
A cooling device incorporating a boiling chamber includes a heat sink ( 10 ), a fan ( 30 ) and a fan duct ( 50 ) covering the heat sink and the fan therein. The heat sink includes a chamber ( 14 )...
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7339789 |
Modular, scalable thermal solution
One embodiment of a modular, scalable cooling system includes a core cooling module configured to be thermally coupled to a heat-generating electronic device and a supplemental cooling module...
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7339788 |
Cooling unit and flow distributing element for use in such unit
A liquid-cooled power semiconductor unit has components to be cooled arranged on the upper side of a plate. The bottom side of the plate is cooled by liquid, which is guided along the plate by...
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7339787 |
Heat sink module for dissipating heat from a heat source on a motherboard
A heat sink module includes a fan set and a heat sink plate. The fan set is integrated as a whole, reducing manufacture time, and the material of the fan set is plastic, thus reducing the weight as...
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7337830 |
Cooling device of electronic device
A disclosed cooling device of an electronic device includes a cooling section thermally connected to the heat-generating electronic device so as to cool the electronic device with cooling water...
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7337829 |
Cooling unit
A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant...
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7336489 |
Waterproof thermal management module and portable
A waterproof thermal management module for a portable electronic device that including a housing and a heat source is disclosed. The waterproof thermal management module includes a separated...
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7336487 |
Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant
Embodiments of a cold plate and a manifold plate are disclosed. The cold plate may be coupled with an integrated circuit die, and the cold plate may also include a flow path to receive a liquid...
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7333334 |
Liquid cooling system and electronic equipment using the same
For cooling of an electronic equipment, a heat receiving jacket, to which piping extended outside the electronic equipment is connected, is mounted to a heat generating element in the electronic...
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7333332 |
Heatsink thermal module with noise improvement
The invention provided a heatsink thermal module with noise improvement, which has a heatsink thermal module additionally consisting of a heat pipe, a heatsink fins set and a fan module; the fan...
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7333331 |
Power unit device and power converter device
A power unit device which can be made small, with which special measures of plant and labor at the time of assembly are unnecessary, and of which assembly is easy and universality in its...
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7331378 |
Microchannel heat sink
The invention provides a heat sink for flowing coolant into inlet manifold channels extending into a inlet edge of a manifold where the flow is forced downward into parallel and spaced...
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7331377 |
Diamond foam spray cooling system
A diamond foam spray cooling system for improving the thermal management of a heat producing device. The diamond foam spray cooling system includes a thermal management unit including a spray...
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7327571 |
Thermal load balancing systems and methods
Systems and methods for implementing thermal load balancing are disclosed. In an exemplary embodiment, a thermal load balancing system for a multiprocessor computer having a plurality of processors...
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7327570 |
Fluid cooled integrated circuit module
An integrated circuit (IC) module has an IC die, a heat sink, a cooling fluid path and a fluid pump. The IC die, the heat sink and the fluid pump are mounted together. The fluid pump forces cooling...
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7327569 |
Processor module with thermal dissipation device
Embodiments include apparatus, methods, and systems of a processor module for a system board. An electronic module is removably connectable to a system board. The electronic module has first and...
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7325591 |
Liquid-cooling heat dissipation apparatus
A liquid-cooling heat dissipation apparatus includes a casing, a first compartment defined in the casing for assembling a liquid driving unit, a cooling plate module on bottom of the casing, a...
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7325588 |
High serviceability liquid cooling loop using flexible bellows
A liquid loop cooling apparatus includes tubing enclosing an interior bore or lumen within which a cooling fluid can circulate, a moveable cold plate rigidly coupled to the tubing, and at least one...
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7324341 |
Electronics assembly and heat pipe device
An electronics assembly is provided having a heat pipe device for cooling electronics. The assembly includes a substrate and an electronics package supported on the substrate. The assembly also...
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7321494 |
Graphics card apparatus with improved heat dissipating mechanisms
A cooling mechanism to dissipate thermal energy generated by the active electronic components of a graphics card assembly. A mechanism includes a radiator and a metal block that is thermally...
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7320359 |
Liquid cooling element and connection arrangement of liquid cooling element
The invention relates to a liquid cooling element for cooling heat generating elements of frequency converters, in particular, and an arrangement for connecting the liquid cooling element. The...
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7319594 |
Assembly of devices
An assembly of devices including at least one switchgear cabinet and a cooling device. The switchgear cabinet has a closed interior, in which electric installations can be housed. The cooling...
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