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7388752 |
Series-connected heat dissipater coupled by heat pipe
A series-connected heat dissipater coupled by heat-pipe used for the interface cards of a computer system. Wherein, a plurality of additional auxiliary dissipaters are provided onto the insertion...
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7385821 |
Cooling method for ICS
The present invention is a cooling device for removing heat from an integrated circuit. In one embodiment, the cooling device includes a conduit and a flexible channel having a first open end and a...
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7382617 |
Heat sink assembly
A heat sink assembly for dissipating heat from a fully buffered dual inline memory module includes a first heat-dissipating sheet, a second heat-dissipating sheet and at least one clip. The first...
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7375970 |
High density memory module using stacked printed circuit boards
A module is electrically connectable to a computer system. The module includes at least one multilayer structure having a plurality of electrical contacts which are electrically connectable to the...
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7372703 |
Heat dissipation structure for interface card
A heat dissipation structure configured to couple with an interface card is provided. The heat dissipation structure comprises a first heat conduction portion arranged above a first surface of a...
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7365983 |
Grease protecting apparatus for heat sink
A grease protecting apparatus ( 10 ) includes a heat sink ( 12 ) defining a plurality of receiving cavities ( 124 ) therein, a layer of grease ( 16 ) spread on a surface ( 122 ) of the heat sink,...
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7365972 |
Electronic device with dual heat dissipating structures
An electronic device with dual heat dissipating structures use in an electronic system is disclosed. The electronic device comprises the circuit board having the first and second heat producing...
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7362584 |
Heat relief socket
A heat relief socket is provided where a contact carrier substrate is provided carrying a plurality of contacts, and is supported by a frame. The frame has an open area therethrough which can...
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7362575 |
Cooling method use diamond pins and heat pipes
An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal...
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7362573 |
Heat dissipation device
A heat dissipation device includes a heat sink having a heat conducting core and a plurality of fins extending from the core. The core has a downward extension portion extending away the fins for...
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7359205 |
Bottom exit of exhaust air from a chassis to reduce acoustics emission
Embodiments of the present invention recite an electronic device comprising a chassis, a backplane, at least one heat generating component coupled with the backplane, and a fan. In embodiments of...
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7355858 |
Heat sink for surface-mounted semiconductor devices and mounting method
A heat sink for surface-mounted semiconductor devices is provided on a superordinate circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally...
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7355854 |
Apparatus for improved grounding of flange mount field effect transistors to printed wiring boards
An apparatus for improved grounding and heat transfer between flange mount field effect transistors and printed wiring boards is provided comprising a cut-out formed in the printed wiring board,...
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7349221 |
Device for increased thermal conductivity between a printed wiring assembly and a chassis
A floating guide device provides increased thermal conductivity between a printed wiring assembly and a heat sink chassis. The guide device includes an elongated thermally conductive rod and a...
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7349217 |
IC socket assembly
The IC socket assembly includes the heat sink for abutting the upper surface of an IC package to dissipate heat generated thereby, and a fixing member for fixing the heat sink to the housing. The...
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7347249 |
Fixing device for a radiator
A fixing device for a radiator provides a joining side projecting outward from a lateral side of each of the elastic strip members and has an engaging part at two inclining ends of the respective...
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7342787 |
Integrated circuit cooling apparatus and method
In various embodiments, heat from a computer component may be absorbed into a medium, moved to a remote heat dispersal unit and dissipated into the surrounding air. In some embodiments, the heat...
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7336493 |
Cold plate cooling apparatus for a rack mounted electronic module
Apparatus which is capable of providing efficient cooling of rack mounted electronic modules while accommodating relatively large tolerances in the mounting of the modules. A plurality of thermally...
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7336492 |
Heat dissipating apparatus
A heat dissipating apparatus ( 10 ) for dissipating heat from a heat-generating electronic component includes a heat sink ( 14 ), a resilient clipping member ( 162 ), and an operating member ( 164...
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7336491 |
Heat sink
A heat dissipation device for electrical components includes an outer surface and an inner surface. The outer surface is configured for mounting the electrical components thereon, wherein the...
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7336487 |
Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant
Embodiments of a cold plate and a manifold plate are disclosed. The cold plate may be coupled with an integrated circuit die, and the cold plate may also include a flow path to receive a liquid...
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7335035 |
Electric junction box
An electric junction box includes a circuit construct as an internal circuit component. The circuit construct includes relays mounted on one side of a printed circuit board and bus bars fixed on...
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7330355 |
Fixed pillar with heat loss
A fixed pillar with heat loss is a fixed pillar for losing heat. The fixed pillar with heat loss includes a metal body, a screw thread and a plurality of grooves. The metal body is a hollow body....
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7327574 |
Heatsink module for electronic device
A heatsink module for electronic device includes a heatpipe, a board, a heatsink and at least a resilient plate. The board is mounted on one end of the heatpipe, and formed with at least a fixing...
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7327568 |
Heat sink assembly with rotatable fins
A heat sink assembly having rotatable fins includes a housing, a first heat dissipating device, a rod, an elastic member and a lever. The housing includes a first sidewall having a first hole, a...
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7325588 |
High serviceability liquid cooling loop using flexible bellows
A liquid loop cooling apparatus includes tubing enclosing an interior bore or lumen within which a cooling fluid can circulate, a moveable cold plate rigidly coupled to the tubing, and at least one...
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7317616 |
Mechanism for connecting loop heat pipe and method therefor
A mechanism for connecting a loop heat pipe and a method therefore. The mechanism can communicably connect two pipe openings of a loop heat pipe, which includes a connector body. The connector body...
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7307844 |
Heat dissipation mechanism for electronic apparatus
This disclosure presents a heat dissipation mechanism, which conducts generated heat of a thermal device to the housing of an electronic apparatus by a metal piece fastened between the thermal...
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7307840 |
Cross-flow redundant air cooling method for high reliability electronics
An electronic assembly cooling system including a module case assembly that has a module case wall. The system includes a first and second air driver and an electronic assembly located in-front of...
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7304848 |
Apparatus for performance testing of heat dissipating modules
An apparatus ( 10 ) for performance testing of heat dissipating modules ( 19 ) includes an enclosure ( 11 ) configured for receiving the heat dissipating module therein, a vertically movable...
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7303005 |
Heat spreaders with vias
Constructions for and methods of manufacturing graphite heat spreaders having thermal vias placed therethrough are provided. Thermal vias having one or two flanges are disclosed, as are flush...
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7301774 |
Universal locking device for heat sink
A locking device for securing a heat sink to a heat generating component includes a locking plate, a plurality of locking feet each pivotably attached to the locking plate and a plurality of...
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7301773 |
Semi-compliant joining mechanism for semiconductor cooling applications
A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection...
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7301755 |
Architecture for power modules such as power inverters
Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive...
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7298619 |
Cable management arm with integrated heat exchanger
In electronic and/or electrical equipment, a cable management assembly is configured for usage in an electronic and/or electrical equipment rack assembly. The cable management assembly comprises at...
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7286359 |
Use of thermally conductive vias to extract heat from microelectronic chips and method of manufacturing
A cooling device for a microcircuit provides a direct path of thermal extraction from a high heat producing area to a cooler area. A thermal insulation layer is formed on a body having at least one...
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7280360 |
Socket adapted for compressive loading
A ball grid array (BGA) socket is adapted to receive and electrically connect to an integrated circuit disposed between a circuit substrate and a heat sink. An attachment element is adapted to hold...
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7277284 |
Microchannel heat sink
A microchannel heat sink as well as method includes one or more microchannels through which a working fluid flows to remove heat from a heat-generating component, such as a microelectronic chip,...
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7270176 |
System and apparatus for fixing a substrate with a heat transferring device
A system for fixing a substrate with a heat transferring device in an assembled orientation; the system comprising: a substantially rod-shaped positioning member having a length generally...
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7254023 |
Heat dissipation assembly
A heat dissipation assembly includes a blower holder, a blower, a first heat sink and a second heat sink. The blower includes an inlet and an outlet and is attached to the blower holder. The blower...
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7252139 |
Method and system for cooling electronic components
A system and method for cooling electronic components. The system includes a surface. One or more electronic components are coupled to the surface, the one or more electronic components including...
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7248479 |
Thermal management for hot-swappable module
A method according to one embodiment may include providing a heat generating component disposed on a first side of a first circuit board, and transferring heat from the heat generating component...
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7247089 |
Automatic recirculation airflow damper
An automatic recirculation airflow damper for use in electronic enclosures utilizing multiple air moving devices to cool electronic components within the enclosure. When an air moving device is...
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7243704 |
Mechanical assembly for regulating the temperature of an electronic device, having a spring with one slideable end
A mechanical assembly, for regulating the temperature of an electronic device, includes a gimbal and a heat-exchanger which is attached to the gimbal. The gimbal includes a base member, a carrier...
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7237606 |
Wafer supporter
A wafer supporting unit ( 10 ) includes a base ( 12 ) and a thermally conductive member ( 14 ). The base is formed by nickel material. The thermally conductive member is formed in the shape of a...
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7236362 |
Minimization of cooling air preheat for maximum packaging density
An electronic hardware cabinet includes a forced-air component positioned to force a stream of air to move through the cabinet and at least two electronic assemblies mounted within the cabinet,...
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7233495 |
Circuit configuration member and method of fabricating the same
A circuit configuration member has a space capable of storing a resin in a liquid state is formed on the adhering face and on an inner side of the case main body. The adhering face of the heat...
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7228894 |
Heat spreader with controlled Z-axis conductivity
A device for distributing waste heat from a heat source evenly across an exterior surface of an enclosure is disclosed. The device includes a first layer of material that has a high thermal...
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7227749 |
Thermal bus load control management for electronic systems
An electronic apparatus comprising a housing having a plurality of electronic components and two or more separate heat transfer systems each thermally communicating with different one or more of...
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7218517 |
Cooling apparatus for vertically stacked printed circuit boards
An apparatus, system and method for cooling vertically stacked printed circuit boards (PCBs). In one embodiment, a first PCB is disposed within a substantially enclosed lower chamber inside a PCB...
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