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7613005 |
Mounting device for mounting heat sink onto electronic component
A mounting device ( 10 ) for mounting a heat sink ( 40 ) onto a printed circuit board ( 60 ) with a heat generating electronic component ( 50 ) mounted thereon. The mounting device includes a...
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7613004 |
Heat sink with heat dissipating fins and method of manufacturing heat sink
A heat sink comprising: a heat dissipating portion comprising a plurality of metal fins each having a heat receiving portion and a heat dissipating portion having elasticity; a fin fixing member to...
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7610678 |
Heat transfer sheet, heat transfer structural body and manufacturing method of the heat transfer structural body
A pattern is formed with an insulative resin on a bonding face of a silicon chip, which is a heat generating element, and a pattern is formed with the insulative resin on a bonding face of a heat...
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7609521 |
Heat dissipation device with a heat pipe
A heat dissipation device includes a fin assembly, a base, a heat pipe soldered with the base, and a heat spreader sandwiched between the heat pipe and the fin assembly. The fin assembly has a...
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7608315 |
Insulator with high thermal conductivity and method for producing the same
A high thermal conduction insulator exhibiting thermal conductivity, insulating properties and heat radiating properties is produced by supplying a molding material composed of an insulating resin,...
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7606036 |
Heat dissipation device
A heat dissipation device includes a thermal attach block ( 10 ), a heat pipe ( 30 ) thermally attached to the block, and a fin unit ( 90 ) thermally attached to the heat pipe. The block includes a...
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7606035 |
Heat sink and memory module using the same
Provided are a heat sink and a memory module using the heat sink. In one embodiment, the heat sink includes a first and second guide pin respectively disposed in first and second heat spreaders...
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7606031 |
Heat dissipating device
A heat dissipating device includes a circuit board ( 23 ), an electronic component ( 24 ) being arranged on the circuit board, a base ( 211 ) being thermally attached to the electronic component,...
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7606028 |
Heat dissipation device having a fan holder for attachment of a fan
A heat dissipation device includes a heat sink, a fan and a fan holder locking the fan on the heat sink. The heat sink defines two slots in two opposite lateral sides thereof. The fan holder...
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7606027 |
Electronic apparatus cooling structure
An electronic apparatus includes a circuit board, circuit elements mounted on the circuit board, and a cooling structure for cooling the circuit elements. The circuit elements include a heat...
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7599186 |
Heat conduction bus, particularly for a microprocessor-based computation unit
A heat conduction bus, particularly for a microprocessor-based computation unit, includes a single starting end, a heat-conducting strip ( 1 ) provided with a plurality of tabs ( 7 - 12 ) for...
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7595993 |
Mounting structure with heat sink for electronic component and female securing member for same
A mounting structure is provided which is capable of easily attaching a heat sink irrespective of a thickness of an LSI (Large-Scale Integration circuit) mounted on a printed circuit board. Each...
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7595991 |
Using the wave soldering process to attach motherboard chipset heat sinks
A electronic device and method for extracting heat from a heat producing component having front and back sides, the front side is disposed across from the back side, and the front side is attached...
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7595988 |
Thermal management system and method for electronic assemblies
According to an embodiment of the present invention, a thermal management system for an electronic assembly includes an electronic component coupled to a substrate, the substrate coupled to a...
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7593232 |
Electronic apparatus and circuit board unit
An electronic apparatus is provided with a housing, a circuit board section and a heat transfer member. The circuit board section is accommodated in the housing. The circuit board section includes...
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7593228 |
Technique for forming a thermally conductive interface with patterned metal foil
A technique for forming a thermally conductive interface with patterned metal foil is disclosed. In one particular exemplary embodiment, the technique may be realized as a thermally conductive...
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7592695 |
Compound heat sink
A compound heat sink for the removal of thermal energy useful for, inter alia, electronic devices or other components. The compound heat sink includes a die cast base element; an extruded...
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7589972 |
Electrical connector with clip mechanism
An electrical connector assembly ( 100 ) made in accordance with a preferable embodiment of the present invention comprises an electrical socket ( 20 ) with a plurality of contacts received...
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7589971 |
Reconfigurable heat sink assembly
An electrical assembly including a housing having an inner surface. At least one mounting feature protrudes from the inner surface. At least one heat sink is inserted onto the at least one mounting...
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7589969 |
Folding protective cover for heat-conductive medium
A folding protective cover structure is used to cover and protect a heat-conductive medium disposed on the bottom surface of a heat sink device. An unfoldable plate body is employed and has a...
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7589968 |
Heat-dissipating electromagnetic shield
A first sheet metal is configured into an enclosure and first and second pluralities of fingers are bent inwardly from the sheet metal to serve retention fingers, the first plurality frictionally...
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7589967 |
Heat dissipation device
A heat dissipation device includes a heat sink ( 10 ) for contacting a heat-generating component and a fan ( 20 ) mounted to the heat sink. The fan includes a frame ( 22 ) and a motor ( 24 )...
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7588549 |
Thermoelectric temperature control for extracorporeal blood circuit
A waterless blood heater/cooler device directly controlling temperature of blood flowing through an extracorporeal blood circuit. A thermoelectric module is coupled to a supply voltage to generate...
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7588074 |
In the rate of energy transfer across boundaries
A heat exchanger comprises at least one first fluid passage contiguous with at least one second fluid passage. The first fluid passage is separated from the second fluid passage by a common...
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7584780 |
Active heat sink structure with flow augmenting rings and method for removing heat
An active heat sink is described for use in the transfer of heat from a heat generating device such as a semiconductor chip and the like with a heat sink having an embedded fan surrounded by a...
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7583502 |
Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC)
A heat sink is presented for dissipating heat from an integrated circuit (IC). The heat sink is made of a heat conductive material having a generally planar shape and adapted to receive an IC chip...
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7583501 |
Electronic apparatus
An electronic apparatus includes a case, a fan, a plurality of electronic parts, and a heat sink mounted for each electronic part. The heat sink includes a fluid unit, and a shutter plate...
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7581583 |
Heat dissipating device with adjusting member
A heat dissipating device includes a heat sink, and an adjusting member. The heat sink includes a base, and a plurality of fins formed on a top surface of the base. The adjusting member includes a...
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7580264 |
Power supply and fixing structure of heatsink and circuit board applicable to the same
A power supply of an image forming device with a heatsink fixed on a circuit board using an iron rivet is described. The rivet is fastened using a riveter. A crimped portion at a tip of the rivet,...
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7576989 |
Heat sink assembly having supporting clip
A heat sink assembly includes an unit and a plurality of fasteners extending through the unit for fixing the unit to a heat-generating electronic component. Each fastener comprises a bolt and a...
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7576987 |
Clip for heat dissipation device
A clip includes a body with a first end and a second end, an actuating member pivotally coupled to the second end of the body via a pivot, and a movable fastener pivotally coupled to the actuating...
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7570490 |
Variable spring rate thermal management apparatus attachment mechanism
A device to thermally couple a thermal management apparatus to at least one heat generating component of a circuit substrate includes at least a first portion that is adapted to couple to the...
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7567439 |
Heat dissipation device having a rotatable fastener
A heat dissipation device includes a heat sink, a retention module and a rotatable fastener for securing the heat sink to the retention module. The retention module includes two supporting ribs and...
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7566490 |
Composite material and base plate
A composite material and a base plate made of this composite material for mounting electrical components and for connecting these components to a cooling device is disclosed. In one embodiment, the...
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7564689 |
Clip for heat sink
A clip ( 100 ) includes a body ( 10 ), a handle ( 30 ) and a movable fastener ( 20 ). The body has a first end terminating in a supporting portion ( 16 ) and a second end terminating in a latching...
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7564687 |
Heat dissipation device having a fixing base
A heat dissipation device includes a heat sink and a fixing base for securing the heat sink to a heat-generating device. The heat sink includes a base and a pair of flanges formed on two opposite...
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7561428 |
Information processing apparatus
A disclosed information processing apparatus includes a central processing unit; a substrate on which the central processing unit is mounted; a housing configured to form a space for accommodating...
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7558067 |
Retaining tool for a heat sink
A retaining tool for a heat sink includes a frame, at least an operation member and at least an engaging member. The frame is attached to an upper portion of the heat sink with a projection at two...
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7558062 |
Heat-dissipating module and electronic apparatus
A heat-dissipating module suitable for dissipating heat generated by a heat-generating element is provided. The heat-dissipating module includes a first heat-conducting plate, a first...
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7554810 |
Mounting apparatus for securing heat dissipation module to circuit board
A heat dissipating apparatus includes a plurality of posts for being detachably attached to a circuit board adjacent a socket mounted thereon, a mounting frame for being attached to the heat...
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7554809 |
Heatsink assembly structure
A heatsink assembly structure combined with a heat-generating element disposed on a circuit board is provided. The heatsink assembly structure includes a heat conducting plate and at least one...
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7551446 |
Thermal management device attachment
A thermal management device attachment apparatus may be used to thermally couple a thermal management device to a heat generating component on a circuit board. The attachment apparatus may include...
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7551435 |
Heat-absorbing member, cooling device, and electronic apparatus
Electronic components differing in height (a CPU 2 a, a capacitor 2 b, and coil elements 2 c ) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the...
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7550097 |
Thermal conductive material utilizing electrically conductive nanoparticles
Thermal interface compositions contain both non-electrically conductive micron-sized fillers and electrically conductive nanoparticles blended with a polymer matrix. Such compositions increase the...
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7548428 |
Computer device heat dissipation system
A computer device heat dissipation system comprising a heat exchanger having a plurality of fins connected to a heat pipe, at least one of the plurality of fins comprises at least one aperture to...
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7548426 |
Heat dissipation device with heat pipes
A heat dissipation device includes a base ( 14 ) for absorbing heat from an electronic device and a plurality of fins ( 20 ) arranged on the base. A heat pipe ( 32 ) thermally contacts the fins and...
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7545647 |
Compliant thermal interface structure utilizing spring elements
A structure for cooling an electronic device is disclosed. The structure includes a solid heat-conducting layer disposed over the electronic device. The solid heat-conducting layer is a planar...
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7545645 |
Heat dissipation device
A heat dissipation device includes a heat spreader ( 20 ), a heat pipe ( 30 ), a heat sink ( 40 ) and a cooling fan ( 50 ) for generating forced airflow to the heat sink. The heat pipe has an...
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7540081 |
Thermally conductive interface
A thermally conductive material is provided as a mixture of a silicone, a ceramic powder, and a curing catalyst. The material may be pre-formed into a pad and each side of the film protected with...
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7539019 |
Apparatus for transferring heat from a heat spreader
An apparatus for transferring heat from a heat spreader is provided. The apparatus includes a heat dissipating member and a heat spreading member adjacent the heat dissipating member, the heat...
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