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7440283 |
Thermal isolation devices and methods for heat sensitive downhole components
A device for isolating a heat sensitive component includes a heat sink positioned adjacent to the heat sensitive component. The heat sink has a stepped thermal response to an applied heat. The heat...
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7440276 |
Cooling-fan-free system module
A cooling-fan-free system module includes a housing unit having a front and a rear case together defining a receiving space therebetween, and the rear case being highly thermal-conductive; a...
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7440284 |
Holding device for a heat sink
A holding device for a heat sink being attached to a circuit board includes a back plate and a frame member. The back plate provides a plurality of fixing posts with a free end of the respective...
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7440280 |
Heat exchange enhancement
A heat exchange structure includes a plurality of elongated air ducts. The heat exchange structure has an exterior heat exchange surface and interior heat exchange surfaces, the interior surfaces...
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7436672 |
Semiconductor device and method of manufacture thereof
A transfer mold type power module (“TPM”) is provided with a projection at each of the four corners on its front main surface. The TPM is also provided a first screw hole at its center. A...
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7436669 |
3D multi-layer heat conduction diffusion plate
A 3D multi-layer heat conduction diffusion plate comprises at least one super conduction diffusion plate which is capable of quickly conducting heat energy, has a short cooling time, and can...
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7436673 |
Heat sink fixing assembly
A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure...
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7436664 |
Electronic appliance
In an electronic appliance, a base is thermally fused by a heat generating component. On the base, a heat dissipating fin group including heat dissipating fins each extending in a Y direction is...
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7436671 |
Retention module for a heat sink
A retention module ( 10 ) for securing a heat sink ( 20 ) to a printed circuit board ( 30 ) includes a pair of carriage arms ( 12 ) separated by a space and a connecting wall ( 14 ) interconnecting...
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7433191 |
Thermal contact arrangement
A thermal contact arrangement. The thermal contact arrangement may mitigate or reduce migration over time of a thermal interface material positioned between a chip and a heat sink. The thermal...
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7431072 |
Heat sink with increased cooling capacity and semiconductor device comprising the heat sink
A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor...
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7431071 |
Fluid circuit heat transfer device for plural heat sources
A heat sink or heat transfer device particularly for integrated circuits, uses a phase change working fluid in a cyclic flow path having at least one evaporator that serves multiple heat sources....
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7430121 |
Heat sink fastener
A heat sink fastener includes a main body, a piercing body and an operating member. The main body has a pressing part for pressing a heat sink toward a heat-generating component. An engaging part...
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7430122 |
Electronic device assembly with clips for mounting a heat sink thereon
An electronic device assembly includes a PCB ( 10 ), a heat sink ( 30 ) mounted on the PCB, a back plate ( 20 ) attached below the PCB, a fan holder ( 40 ) mounted on a top of the heat sink and a...
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7428154 |
Package structure, printed circuit board mounted with the same, electronic apparatus having the printed circuit board
A package structure to be mounted on was external printed circuit board includes a package board that is mounted with an exoergic circuit element, and a heat sink that radiates heat from the...
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7423873 |
Heat dissipation device having fan holder for attachment of a fan
A heat dissipation device includes a heat sink ( 10 ), a fan holder ( 20 ) located on the heat sink and a fan ( 30 ) mounted on the fan holder. The heat sink includes a plurality of fins ( 14 )...
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7423877 |
Heat dissipation device
A heat dissipation device includes a heat-absorbing member having two arched concave walls formed at opposite sides thereof, and a plurality of fins extending outwardly and slantwise from each of...
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7423880 |
Secure device capable of engaging with a heat sink firmly
A secure device for a heat sink includes a frame and a plurality of cylindrical posts. The frame provides a plurality of elongated projections at the inner side thereof. Each of the cylindrical...
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7423881 |
Arrangement and method for cooling a power semiconductor
In an arrangement and a method for cooling a power semiconductor in which at least one power semiconductor is electrically and thermally conductively connected to at least one passive electric...
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7423879 |
Sleeve-tightening heat dissipating module
A sleeve-tightening heat dissipating module includes a pillar, a sleeve, a stand, and heat sinks, wherein the pillar is a cylinder with a wider lower part, and the sleeve can be enclosed at a...
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7423882 |
Rotating clip
Apparatus and methods for mounting of a cooling device coupled to a circuit board include use of a clip that is rotated to mate with and engage the cooling device. Rotation of the clip occurs...
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7420810 |
Base heat spreader with fins
A thermal management device for the removal of thermal energy useful for, inter alia, electronic devices or other components.
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7419722 |
Heat-radiating sheet and heat-radiating structure
A heat-radiating structure is equipped with a heat-radiating sheet, a case and exothermic bodies. Heat-radiating sheet is equipped with a graphite sheet, and an electrically insulating elastic...
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7417864 |
Gear driven socket activation mechanism
A socket activation assembly is configured to close over a component and drive a gear during closure that activates a socket to engage the component.
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7417078 |
Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work
An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic...
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7417860 |
Heat dissipation device
A heat sink assembly ( 10 ) includes a heat sink ( 12 ) and a wire clip ( 14 ). The heat sink includes a base ( 120 ) and a plurality of fins ( 124 ) mounted on the base. A channel ( 126 ) is...
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7414839 |
Heat dissipation device having a fan holder for attachment of a fan
A heat dissipation device comprises a heat sink, a fan, and a fan holder. The heat sink includes a base and a plurality of fins arranged on the base. The fan includes a frame having an engaging...
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7414841 |
Electronic cooling system having a ventilating duct
A heat dissipation device in a computer enclosure includes a heat spreader ( 20 ) mounted on a CPU ( 12 ), a first heat sink ( 30 ), a cooling fan ( 40 ) coupled to the first heat sink, a second...
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7414850 |
Heat dissipation module for electronic device
A heat dissipation module for removing heat from a heat-generating electronic component includes a base ( 106 ) and a clip ( 40, 40 a ). The clip includes a connecting arm ( 42, 42 a ) and a...
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7411791 |
Extendable heat dissipation apparatus
An extendable heat dissipation apparatus includes a base, an extendable heat dissipation member and a connecting element. A normal fin is formed on the base, and the connecting element integrates...
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7408773 |
Reinforced air shroud
An air shroud apparatus includes a base wall. A plurality of support walls extend from the base wall in a spaced apart orientation from each other. A component housing is defined between the...
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7408781 |
Cooling device for memory chips
A cooling device includes two side boards and a memory device is clamped between the two side boards. A cooling unit is positioned above the two side boards by two clips and includes a plurality of...
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7408777 |
Plasma display device
A plasma display device for keeping cooling efficiency of the device uniform between both horizontal and vertical positions. The plasma display device, which has a plasma display panel and a...
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7405930 |
Electronic apparatus
An electronic apparatus has a housing which is formed with a suction port and an exhaust port. The interior of the housing is partitioned with a first chamber and a second chamber by a partition...
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7403394 |
Heatsink locking device
A heatsink-locking device that is applied to lock a heatsink to a placement surface having an exothermic component, includes a bottom base fixed on the placement surface to dispose and position the...
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7400506 |
Method and apparatus for cooling a memory device
A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat...
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7400505 |
Hybrid cooling system and method for a multi-component electronics system
A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least...
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7400507 |
Fastening structure
A fastening structure for securing a heatsink module is provided. The structure includes at least a first fastening piece attached to the circuit board and having a first fastening member, a heat...
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7397666 |
Wedge lock
Various apparatus and methods are disclosed wherein a wedge member and a support engage one another to lock a first structure and a second structure to one another along an axis.
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7397664 |
Heatspreader for single-device and multi-device modules
A heatsink includes a heatsink base, an elastomeric base, multiple slider pins and an alignment frame coupled to the heatsink base. The elastomeric base includes multiple holes, the elastomeric...
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7395852 |
Enhanced energy concentrator composition
A thermal concentrator composition with optimized design and reduced thermal resistance as a means of enhancing heat transfer and energy conversion. The composition comprises a low thermal...
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7394657 |
Method of obtaining enhanced localized thermal interface regions by particle stacking
Integrated circuit-chip hot spot temperatures are reduced by providing localized regions of higher thermal conductivity in the conductive material interface at pre-designed locations by controlling...
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7393587 |
Sandwiched finstock
A finstock material for heat dissipation, which includes at least one sheet of flexible graphite sandwiched between two outer layers.
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7391618 |
Electronic component unit
Airflow is introduced into an enclosure through an air inlet in an electronic component unit. The airflow runs toward a first electronic component. The airflow absorbs heat from the first...
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7391615 |
Clip for heat sink
A clip includes a body with opposite first and second legs, a movable fastener, an actuating member and a sliding axle. The movable fastener has a retaining hole defined therein for engaging with a...
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7391617 |
Cooling arrangement for a computer system
A cooling arrangement for a computer system includes a base plate, a system board which coupled to the base plate, a processor arranged on the system board, and a cooling apparatus arranged on the...
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7390428 |
Compositions with nano-particle size conductive material powder and methods of using same for transferring heat between a heat source and a heat sink
A heat transfer composition and methods for using same to transfer heat in a transformer. In one embodiment, a heat transfer composition has soy-based oil, an additive comprising a nano-particle...
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7388751 |
Method and apparatus for attaching a processor and corresponding heat sink to a circuit board
An apparatus for attaching a processor and corresponding heat sink to a circuit board includes a board member, a frame member mounted on the board member, a plurality of connector portions on the...
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7385823 |
Retention module for a heat dissipation assembly
A retention module for a heat dissipation assembly is disclosed. In a first embodiment, the retention module may include a frame having an external member and an internal member enclosed within the...
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7385822 |
Clip assembly
A clip assembly ( 30 ) for mounting a heat sink ( 20 ) on a printed circuit board ( 10 ) includes a closed annular positioning portion ( 32 ) interferingly engaging with the heat sink, a securing...
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