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Document Title |
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7561428 |
Information processing apparatus
A disclosed information processing apparatus includes a central processing unit; a substrate on which the central processing unit is mounted; a housing configured to form a space for accommodating...
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7558067 |
Retaining tool for a heat sink
A retaining tool for a heat sink includes a frame, at least an operation member and at least an engaging member. The frame is attached to an upper portion of the heat sink with a projection at two...
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7558062 |
Heat-dissipating module and electronic apparatus
A heat-dissipating module suitable for dissipating heat generated by a heat-generating element is provided. The heat-dissipating module includes a first heat-conducting plate, a first...
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7554809 |
Heatsink assembly structure
A heatsink assembly structure combined with a heat-generating element disposed on a circuit board is provided. The heatsink assembly structure includes a heat conducting plate and at least one...
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7554810 |
Mounting apparatus for securing heat dissipation module to circuit board
A heat dissipating apparatus includes a plurality of posts for being detachably attached to a circuit board adjacent a socket mounted thereon, a mounting frame for being attached to the heat...
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7551435 |
Heat-absorbing member, cooling device, and electronic apparatus
Electronic components differing in height (a CPU 2 a, a capacitor 2 b, and coil elements 2 c ) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the...
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7551446 |
Thermal management device attachment
A thermal management device attachment apparatus may be used to thermally couple a thermal management device to a heat generating component on a circuit board. The attachment apparatus may include...
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7550097 |
Thermal conductive material utilizing electrically conductive nanoparticles
Thermal interface compositions contain both non-electrically conductive micron-sized fillers and electrically conductive nanoparticles blended with a polymer matrix. Such compositions increase the...
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7548428 |
Computer device heat dissipation system
A computer device heat dissipation system comprising a heat exchanger having a plurality of fins connected to a heat pipe, at least one of the plurality of fins comprises at least one aperture to...
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7548426 |
Heat dissipation device with heat pipes
A heat dissipation device includes a base ( 14 ) for absorbing heat from an electronic device and a plurality of fins ( 20 ) arranged on the base. A heat pipe ( 32 ) thermally contacts the fins and...
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7545647 |
Compliant thermal interface structure utilizing spring elements
A structure for cooling an electronic device is disclosed. The structure includes a solid heat-conducting layer disposed over the electronic device. The solid heat-conducting layer is a planar...
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7545645 |
Heat dissipation device
A heat dissipation device includes a heat spreader ( 20 ), a heat pipe ( 30 ), a heat sink ( 40 ) and a cooling fan ( 50 ) for generating forced airflow to the heat sink. The heat pipe has an...
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7540081 |
Thermally conductive interface
A thermally conductive material is provided as a mixture of a silicone, a ceramic powder, and a curing catalyst. The material may be pre-formed into a pad and each side of the film protected with...
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7539019 |
Apparatus for transferring heat from a heat spreader
An apparatus for transferring heat from a heat spreader is provided. The apparatus includes a heat dissipating member and a heat spreading member adjacent the heat dissipating member, the heat...
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7539018 |
Heat sink retaining clip for an electrical connector assembly
An electrical connector assembly is provided that includes a guide frame having an internal compartment configured to receive an electrical component. The guide frame extends a length between a...
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7535714 |
Apparatus and method providing metallic thermal interface between metal capped module and heat sink
An apparatus and method for creating a metallic thermal interface is shown for connecting an electronic module to a heat sink. Using an interface metal such as indium or malleable indium alloys,...
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7532475 |
Semiconductor chip assembly with flexible metal cantilevers
A stress release thermal interface is provided for preventing the building up of stress between chip and heat sink surfaces in a multi-chip module (MCM) while maintaining reliable thermal and...
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7532474 |
Apparatus for dissipating heat from electronic components in an enclosed housing
An electronic device includes a housing configured to enclose an electronic component mounted to an inner portion of the housing. A thermally conductive gap-filler is in thermal contact with the...
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7530388 |
Heat sink
A heat sink includes first and second fin sets. The first fin set includes a plurality of fins each having a flange extending perpendicularly from an edge thereof and oriented in a same first...
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7532468 |
Heat sink having high heat dissipation efficiency
A heat sink includes a thermally conductive base, a plurality of thermally conductive fins extending from the base, and a guiding member. The base has a top surface from which the fins extend, and...
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7532476 |
Flow solutions for microelectronic cooling
Flow solutions for cooling one or more microelectronic device(s) are generally described. In this regard, according to one example embodiment, a cooling apparatus comprising a heat sink base...
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7529094 |
Integrated heat sink and light pipe mounting assembly
A heat sink and light pipe assembly is provided for an electronic module configured to be mounted on a circuit board. The assembly includes a bracket configured to be held proximate the electronic...
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7527090 |
Heat dissipating device with preselected designed interface for thermal interface materials
Embodiments of the invention includes a heat dissipating device. The heat dissipating device includes a main body having a surface, wherein the surface is plated or coated with at least two...
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7529092 |
Electromagnetic interference shield and heat sink apparatus
A combination heat sink and electromagnetic interference shield device is provided for a point of distribution card of a television receiver. The combination POD card heat sink and EMI shield...
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7522420 |
Clip module and heat-dissipation device having the same
A clip module and heat-dissipation device having the same is disclosed. The heat-dissipation device includes a retention module (RM) disposed on a circuit board having a heat-source, a heat sink...
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7522421 |
Split core circuit module
Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both major sides. Contacts distributed along the flexible circuitry provide connection between the module and...
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7518869 |
Information processing apparatus with a chassis for thermal efficiency and method for making the same
An information processing unit and a method for making the same with a cooling structure for a heat generating element, for example a CPU, which can efficiently cool the CPU without losing...
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7518873 |
Heat spreader, semiconductor package module and memory module having the heat spreader
A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat...
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7518863 |
Modularized radio frequency band components on removable doors
A cabinet system comprises a chassis having a plurality of openings, a plurality of modular doors, and at least one radio frequency system. Each opening has removably attached chassis-hinge...
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7518861 |
Device cooling system
A device cooling system comprises a heat pipe disposed in a device, the heat pipe having a condenser portion and at least two divergent evaporator portions, the at least two evaporator portions...
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7518875 |
Securing heat sinks to a device under test
Apparatus and method for securing a heat sink to a heat-generating device on a circuit board. The apparatus clamps onto the heating-generating device and the circuit board in a manner that avoids...
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7515420 |
Apparatus for transferring heat between two corner surfaces
An apparatus for transferring heat between two corner surfaces is provided. In one embodiment, an apparatus for transferring heat between two corner surfaces is provided. The apparatus comprises a...
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7513298 |
Cooling element for eliminating electromagnetic noise
The present invention is to provide a cooling element for eliminating electromagnetic noise, which is formed by bending a plate into a symmetric structure symmetrically comprising a contact part...
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7515424 |
Heat dissipation device having metal die-casting component and metal-extrusion component
A heat dissipation device for dissipating heat from heat-generating components on a printed circuit board includes a cover for covering the printed circuit board and a radiator mounted on the...
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7513063 |
Substrate processing apparatus
A heat exchanger efficiently and uniformly cools or heats portions to be controlled to a prescribed temperature, and then provides a surface processing apparatus which makes it possible to...
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7515425 |
Electronic device and cooling unit
An electronic device includes: a housing; a substrate that has a first surface and a second surface each mounted with a heat generating component and that is fixed in the housing; a first heat...
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7515423 |
Heat dissipation device
A heat dissipation device cooling a power adapter ( 50 ) includes first and second heat dissipation units ( 10 ), ( 20 ), at least one heat pipe ( 30 ) connecting the first and second heat...
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7509997 |
Heat sink
A heat sink includes a first array of fins defining a plurality of first channels therebetween, a second array of fins disposed at opposite sides of the first array of fins, and a plurality of...
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7511443 |
Ultra-compact, high-performance motor controller and method of using same
Featured is a controller for a motor that is ultra-compact, with a power density of at least about 20 watts per cubic cm (W/cm 3 ). The controller utilizes a common ground for power circuitry,...
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7508671 |
Computer system having controlled cooling
A computer system and its method of cooling are provided. A vapor chamber serves as a heat spreader for heat from the microelectronic die. A thermoelectric module serves to cool the vapor chamber...
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7508667 |
Heat sink backplate module, circuit board, and electronic apparatus having the same
An electronic apparatus includes a case, a circuit board disposed in the case, a heat sink backplate module, and a heat sink disposed on a heat source of the circuit board. The heat sink backplate...
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7508674 |
Fixture for attaching a heat sink to a heat generating device
A heat sink fixture for fixing a heat sink to a heat generating device is disclosed. The heat sink fixture at least has a suppressing section, two force-exertion sections and two fixing sections....
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7508662 |
Handle arrangement with integrated heat pipe
Handle arrangements having an integrated heat pipe for use with a portable electronic device are presented including: a heat pipe, the heat pipe configured with a heat receiving portion, a heat...
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7505275 |
LED with integral via
A light emitting diode comprising a body and a thermal via integral therewith and which extends from the body.
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7502229 |
Heat dissipation system for multiple integrated circuits mounted on a printed circuit board
A system is provided for heat sinking and environmental dissipation of heat generated by one or more ICs mounted to a printed circuit board. The system includes a primary thermally conductive plate...
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7497013 |
Method and apparatus for coupling fins in a high-fin density heatsink to dual heat-dissipating base plates
A dual base plate heatsink for use in dissipating heat for electronic devices with thermal contact between fins and the base plates and manufactured without welding. Separately extruded fins are...
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7499281 |
Multi-chip module with power system
Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural...
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7499274 |
Method, apparatus and system for enclosure enhancement
In some embodiments, a method, apparatus and system are described for enhancing an enclosure of a device, such as a computing device. The system may include a frame and an apparatus, wherein the...
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7499280 |
Heat dissipating device
A heat dissipating device which dissipates heat generated by a heat generating object mounted on a base includes a heat sink body, a heat-conducting area, a tip portion, an inclined surface, and a...
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7494712 |
Resin-impregnated flexible graphite articles
Composites are prepared from resin-impregnated flexible graphite materials. Impregnated materials are compressed and cured at elevated temperature and pressure to form structures suitable for uses...
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