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6782941 |
Heatsink and heatsink device using the heatsink
A heatsink and a heatsink device using the heatsink are provided. The heatsink is formed of a plurality of thin heatsink plates, and the individual heatsink plates are bound to one another to be...
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6785139 |
Electric connection box
In an electric connection box containing a bus bar board in a case, heat radiation member-side bus bars are connected to a heat radiation member, and switching devices, such as FETs, are mounted on...
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6783692 |
Heat softening thermally conductive compositions and methods for their preparation
A heat softening thermally conductive composition comprises: a matrix comprising a silicone resin, and a thermally conductive filler. The composition can be used as a thermal interface material in...
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6785137 |
Method and system for removing heat from an active area of an integrated circuit device
A method for removing heat from an active area of an integrated circuit device is provided. The method includes applying a separator to the active area of the integrated circuit device. A thermally...
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6779595 |
Integrated heat dissipation apparatus
An integrated heat dissipation apparatus, having a first heat dissipating element, a second heat dissipating element, a thermal conductive heat sink and at least one L-shape heat pipe. The thermal...
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6781834 |
Cooling device with air shower
A cooling device with an air shower is disclosed. The cooling device includes a heat mass with a plurality of spaced apart fins connected therewith. An air shower including an injector face with a...
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6779593 |
High performance cooling device with heat spreader
A low-cost, fan assisted cooling device is disclosed. The cooling device includes a heat mass with a taper bore therein adapted to receive a heat spreader that has a shape that complement the taper...
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6781832 |
Cooling unit for cooling heat generating component and electronic apparatus containing cooling unit
A cooling unit comprises a heat sink arranged adjacent to a heat generating component, the heat sink having area dimensions greater than the heat generating component. A heat diffusing member is...
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6781830 |
Methods and systems of heat transfer for electronic enclosures
An electronics enclosure is provided. The enclosure includes a modular card cage adapted to receive one or more electronic circuit cards and a heat sink adapted to protrude through an opening of an...
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6781837 |
System and method for information handling system heat sink retention
A heat sink retention system and method secures a heat sink proximate to a packaged electronic component, such as central processing unit, by rotationally engaging the heat sink with a retaining...
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6781829 |
Device for reducing the noise level of a component with moving parts and for cooling the same
The invention pertains to a device for reducing the noise level of, and for cooling, a Component ( 1 ) with moving parts, such as a hard disk in a PC system. The device comprises a Container ( 2 )...
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6781840 |
Fastening mechanism
Fastening members such as tapping screws and rivers having a shaft are used to fasten objects such as circuit elements, a circuit board and a casing to a target object such as a heat sink of a...
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6776226 |
Electronic device containing thermal interface material
A thermal interface member in a heat generating, electronic device is provided. The thermal interface member comprises either a single fluoroelastomer or a blend of fluoroelastomer components that...
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6776224 |
Heating dissipating device for electronic elements
A heating dissipating device for electronic elements comprises a bottom plate and a plurality of heat dissipating sheets; the bottom plate being formed with a plurality of grooves. A lower end of...
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6778388 |
Water-resistant electronic enclosure having a heat sink
A device and method for enclosing electronics in a waterproof environment and transferring the heat generated by the electronics to an external environment is provided. The device includes a...
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6772828 |
Cooling fin assembly
A cooling fin assembly includes a cooling fin in a U-shaped rectangular tank disposed with fastening lugs at the front and rear of the upper surface thereof; the sides of the U-shaped tank extended...
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6771508 |
Method and apparatus for cooling an electronic component
In one embodiment, the invention provides a system. The system comprises using a plurality of heat absorbing fins to absorb heat from an electronic component of a substrate-mounted electronic...
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6771501 |
Fire resistant electronic engine controller
An electronic engine controller is provided in which a backup controller or independent protection module is located in a sealed housing 8 which itself is located within the main housing 4 of...
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6771507 |
Power module for multi-chip printed circuit boards
A power module assembly for multi-chip printed circuit boards: A heat distribution plate has first and second fields of receptacles integrally formed therein. The receptacles are populated with...
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6771504 |
Thermal transport element for use with a heat dissipating electrical assemblage
A heat transporting electrical assemblage retained in a retaining unit transports heat between a heat sink and a thermal transport element in fluid communications with the heat sink. The thermal...
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6768642 |
VME circuit host card with triple mezzanine configuration
A circuit card assembly includes a host card having connector assemblies and a conduction-cooling path. A first and second mezzanine card each having electronic circuitry defining a component field...
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6766852 |
Heatsink plate
A heatsink plate includes a bottom wall and two opposite side walls. Each of the two opposite side walls has a first side, a second side, and a concave shoulder located between the first side and...
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6766851 |
Heat sink fin assembly
A heat sink fin assembly structure, suitable for various kinds of computer chip sets or processors, mainly has a plurality of heat sink fins assembled to form a plurality of upright and parallel...
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6765798 |
Electronic thermal management utilizing device with deflectable, two-leg conductive member; and with elastic, thermally-conductive material there between
A thermal management device is for a electronic apparatus, and includes a thermally conductive member, and elastic and thermally conductive material. The member is for engagement with a heat...
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6763881 |
Thermally matched gradient heat sink
An assembly comprising a heat generating electronic device and a heat sink is provided with an intermediate gradient region between them. This intermediate region comprises a material having a...
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6765799 |
Heat dissipating fins interlocking mechanism
The present invention of a heat dissipating fin pieces interlocking mechanism includes a plurality of aluminum or copper fin pieces wherein the lower center protruding section is bent and folded...
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6761211 |
High-performance heat sink for electronics cooling
Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate having a recessed area on one surface and a flat area on...
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6758262 |
Heat sink, method for manufacturing same, and pressing jig
There is provided a heat sink comprising a base plate provided with a plurality grooves and concave portions, each of which has a substantially trapezoidal cross section having a flat bottom face...
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6760223 |
Apparatus and method for contacting device with delicate light-transparent pane
A heat-sinking apparatus ( 62, 64, 66 , and 68 ) containing a light-transparent pane ( 72 ) is configured in a way that enables the pane to be brought into contact with a device ( 40 ) such as a...
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6758263 |
Heat dissipating component using high conducting inserts
A thermal management system provides a heat dissipating component using a high thermal conductivity insert. The heat dissipating component may be a spreader or heat sink, and includes a planar...
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6758264 |
Heat sink and its manufacturing method
A heat sink including a substrate of insulating ceramic and, superimposed on its upper surface, a diamond film for disposing an element thereon. The heat sink has excellent heat radiation...
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6755240 |
Cooling device for an electronic component and cooling system with such cooling devices
A cooling device for an electronic component is specified, which is built up from a stack ( 1 ) of profiled plates ( 2 a ; 2 b ) lying on one another and connected to one another and, at the end of...
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6755242 |
Active heat sink structure with directed air flow
An active heat sink structure includes at least one heat sink. Each heat sink includes a heat sink base having a top surface with a top surface periphery, a top surface center at a central portion...
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6754078 |
Heat dissipating device with slanting engaged heat dissipating sheets and bottom plate
A heat dissipating device comprises a bottom plate and plurality of heat dissipating sheets. A surface of the bottom plate is formed with a plurality of inclined recesses which are spaced with an...
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6754079 |
KD heat sink fins
A knock down heat sink, and more particularly, to one that comprised of multiple fins overlapped among one another into a stack and a specific spacing is defined between any two abutted fins to...
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6752204 |
Iodine-containing thermal interface material
An iodine-containing thermal interface material disposed between a heat source and a heat dissipation device.
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6749009 |
Folded fin on edge heat sink
A heat sink for cooling electrical or electronic devices comprises a spreader plate having a top surface and having a bottom surface for attaching to the electronic device. A folded fin formed from...
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6751099 |
Coated heat spreaders
A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally...
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6749010 |
Composite heat sink with metal base and graphite fins
A composite heat sink apparatus includes a metal base which has a thermal conductivity of at least about 200 W/m°K. The metal base is preferably constructed either of copper of aluminum. The heat...
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6749013 |
Heat sink
A heat sink comprising (a) a plate-shaped heat pipe including an upper plate member and a lower plate member to form a hermetically sealed cavity, and a working fluid enclosed therein, and (b) at...
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6746768 |
Thermal interface material
A thermal interface and a thermal interface as part of a thermal management system that comprises a heat source, and a cooling module. The heat source has an external surface; the thermal interface...
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6742573 |
Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin
A heat sink including a heat dissipating fin comprises (1) a heat dissipating fin having a plurality of mountain-shaped portions and base portions supporting the mountain-shaped portions, (2) a...
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6742581 |
Heat sink and fin module
A heat sink comprises a base portion, and a multiplicity of thin plate fins erected on the base portion in parallel with each other. The fins are folded in two at their lower ends to form two-ply...
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6741465 |
Cooling method and apparatus for handheld devices
A method and apparatus for cooling an electronic component within a handheld device comprised of an extension to the casing of the handheld device and at least one portion of a cooling apparatus...
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6736195 |
Cooling fin arrangement
A containment ( 5 ) for a heat producing device has cooling fins ( 15 ) to dissipate the produced heat. In this type of cooling fin arrangement the cooling fins comprise, traditionally, smooth...
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6736204 |
Heat transfer surface with a microstructure of projections galvanized onto it
This invention relates to a heat transfer surface ( 3 ) or tubular or plate-like bodies ( 4 ) having a microstructure ( 7 ) projecting out of the base surface ( 3 a ) and consisting of projections...
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6735086 |
Heat-conducting device for circuit board
A heat-conducting device for conducting heat between a circuit board and an airframe of a missile includes a thermal plane onto which the circuit board is mounted, and a pair of feet that partially...
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6735082 |
Heatsink with improved heat dissipation capability
A tandem heat sink operable to provide heat dissipation to one or more electronic components. The tandem heat sink apparatus creates air turbulence within the air stream across the one or more...
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6735084 |
Heat sink for electronic devices, and circuit board and plasma display panel assembly each equipped with the heat sink
A heat sink for electronic devices, and circuit board and plasma display panel assembly, each equipped with the heat sink. The heat sink for electronic devices, and circuit board and PDP assembly...
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6729383 |
Fluid-cooled heat sink with turbulence-enhancing support pins
A pin array is connectively disposed between a surface region of a heat sink and a surface region of an entity to be cooled. Cooling fluid flows between the heat sink's surface region and the...
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