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6889755 |
Heat pipe having a wick structure containing phase change materials
A wick for use in a heat pipe is provided incorporating particles of micro-encapsulated phase change material bonded together to form the wick. Use of a wick structure comprising micro-encapsulated...
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6889756 |
High efficiency isothermal heat sink
An isothermal heat sink use operational principles of heat pipes and includes a plate-like body including a housing, an interior partition and a wick. The housing has an inner chamber under a...
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6888722 |
Thermal design for minimizing interface in a multi-site thermal contact condition
An electronic assembly that may include an integrated circuit package that is mounted to a substrate. The assembly may have a thermally conductive phase change material that couples the integrated...
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6886627 |
Radial heat sink with helical shaped fins
An electronic assembly includes an integrated circuit (e.g., a processor) mounted on a substrate (e.g., a motherboard), and a radial heat sink thermally coupled to the integrated circuit. The...
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6886625 |
Elastomeric heat sink with a pressure sensitive adhesive backing
The present invention discloses a net-shape molded elastomeric heat-dissipating device that includes an integrally formed conformable interface surface. A base elastomeric matrix material is loaded...
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6886249 |
Method for making finned heat sink assemblies
A construction is provided for a finned heat sink constructed from a plurality of components separately formed from graphite materials. The components include a base and a plurality of fins. In one...
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6883592 |
Heatsink for electronic component
A heatsink for dissipating heat from a heat-generating source such as an electronic component includes heatsink plates, wherein the individual heatsink plates are bound together at a binding...
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6883591 |
Stackable heat sink
A stackable heat sink comprising a plurality numbers of metal heat dissipation plates, the heat dissipation plate further comprises a bottom plate, two side plates facing each other locates on both...
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6883594 |
Cooling system for electronics with improved thermal interface
A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher...
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6883593 |
Heat sink for convection cooling in horizontal applications
A heat sink for free convection cooling in horizontal applications is provided. Specifically, the heat sink includes a plurality of spaced apart cooling fins, which are supported by an angled base....
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6882536 |
Wrap-around cooling arrangement for printed circuit board
A wrap-around cooling arrangement for a printed circuit board is disclosed. Such an arrangement comprises: a printed circuit board (“PCB”) having a first side and a second side opposite to said...
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6880624 |
Heat pipe
A heat pipe has at least one diamond element through which at least a portion of heat flowing into the heat pipe passes.
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6882533 |
Thermal connector for cooling electronics
A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can...
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6880621 |
Radiator
The present invention provides a radiator that consists of a plurality of f ins, one side of each fin has at least one wing parallel relative to the side, the wing is disposed spaced from the fin....
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6882535 |
Integrated heat spreader with downset edge, and method of making same
A downset edge integrated heat spreader is disclosed. The downset edge can be formed to an industrially accepted flatness with a single stamping operation. The downset edge can provide a surface...
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6882534 |
Fastening device for heat slug
A fastening device for heat slug includes a frame, two projections and a heat slug. The frame defines an accommodating space therein. The projections are formed on the frame. The heat slug has a...
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6879486 |
Central inlet circuit board assembly
An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or...
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6879487 |
Fan-securing device for use with a heat transfer device
A fan-securing device secures a fan to a heat transfer device that allows for the rapid removal of the fan without disturbing the remainder of the heat transfer device. The fan-securing device...
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6874573 |
Thermal interface material
A composition for use as a thermal interface material in a heat-generating electronic device is provided. The composition comprises a blend of nitrile rubber and carboxyl-terminated butadiene,...
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6876550 |
Active heat sink for high power microprocessors
A cooling apparatus for cooling a heat source such as a microprocessor, comprising a mobile heat sink placed in close proximity to the heat source; and a thermal conductor for conducting heat...
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6870736 |
Heat sink and package surface design
An electronic assembly that includes a heat sink, a thermal interface material, integrated circuit, and a package connected to the integrated circuit. The thermal interface material is positioned...
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6868899 |
Variable height thermal interface
A variable-height thermal-interface device is provided for transferring heat from a heat source to a sink. The device comprises a first uniaxial rotary cylindrical joint comprising a first...
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6868898 |
Heat pipe having an inner retaining wall for wicking components
A heat pipe is provided, which includes at least one outer structural wall, a wicking structure, and an inner retaining wall for the wicking structure. The outer structural wall has condenser,...
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6870735 |
Heat sink with visible logo
A heat sink is for an element to be cooled has a thermally conductive base and a plurality of thermally conductive pins or fins extending substantially perpendicular from the base, said pins or...
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6867975 |
Heat sink, fixing method thereof and electronic apparatus using heat sink
Heat sink has fins on the top surface thereof and pin portions on the bottom surface thereof. Rivets having longitudinal through-hole are inserted into holes in a retention module. When the heat...
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6867970 |
Modular converter unit
A modular converter unit and a power converter assembly having at least one modular converter unit are described. The converter unit includes a two-sided cooling device and an intermediate circuit...
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6866540 |
Indicia-equipped actuator assembly
An indicia-equipped actuator assembly for removably coupling a CPU with a socket assembly, the actuator assembly comprising an engaging assembly for use in placing a socket assembly in an open or...
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6867976 |
Pin retention for thermal transfer interfaces, and associated methods
Structure and methods are disclosed for transferring thermal energy from an object to a thermal spreader. A plurality of pins are biased against the object so that the plurality of pins contact...
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6863508 |
Measuring gas pump with heated and insulated pump head
A pump for gases to be measured having a pump housing in which a pump chamber is located. The pump chamber is sealed off by a working membrane that is connected to a crank drive by a connecting rod...
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6865085 |
Heat dissipation for electronic enclosures
An electronics enclosure is provided. The enclosure includes a cylindrical body, one or more modular card cages adapted to receive one or more electronic circuit cards. The one or more modular card...
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6862183 |
Composite fins for heat sinks
A heat sink that dissipates heat from an electronic device. The heat sink includes a base that is adapted to be thermally coupled to the electronic device, and a fin that is thermally coupled to...
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6857470 |
Stacked chip package with heat transfer wires
The present invention provides a stacked chip package having at least one heat transfer wire. The heat transfer wire is disposed between the stacked chips and at least one end of each transfer wire...
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6859367 |
Heat sink attachment device
Heat sink attachment components are provided comprising retention bolts with a coil spring captured between the head of the retention bolt and a retention lock flange of a retention lock. A portion...
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6859368 |
Fixing structure for dissipation device
A fastening structure for dissipation device has a metal plate with at least one screw hole, a screw with an engagement part, an elastic element, and a screw cap. The screw and the elastic...
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6856016 |
Method and apparatus using nanotubes for cooling and grounding die
An embodiment of the present invention described and shown in the specification and drawings is a process and a package for facilitating cooling and grounding of a semiconductor die using carbon...
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6851869 |
Highly thermally conductive electronic connector
The electronic connector ( 10 ) includes an improved heat dissipating housing for cooling heat generating devices located within the connector ( 10 ). The electronic connector ( 10 ) of the present...
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6851467 |
Heat sink assembly
A heat sink assembly includes a heat exchanging section formed by a thermally conductive sheet folded into alternating ridges and troughs defining generally parallel spaced fins having opposite end...
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6853554 |
Thermal connection layer
A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can...
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6853553 |
Heat dissipation system for audio amplifier
A heat dissipation system for an audio amplifier is presented, including a housing having a plurality of apertures therein; at least one completely enclosed air tunnels, each air tunnel extending...
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6845812 |
Heatsink with multiple, selectable fin densities
A heat sink ( 100 ) for use with a heat generating device, that includes: a base member ( 110 ); a fixed set of adjacent heat dissipating surfaces ( 120 ) formed in the base member ( 110 ) for...
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6847524 |
Electronic apparatus having cooling unit for cooling heat-generating component
An electronic apparatus comprises a housing containing a heat-generating component, and a cooling unit. The cooling unit includes a heat sink thermally connected to the heat-generating component, a...
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6843308 |
Heat exchanger device using a two-phase active fluid, and a method of manufacturing such a device
A flat sheet structured thermal device using a two-phase active fluid. The device including at least a top sheet, at least two intermediary sheets, and a back sheet stacked longitudinally. Each...
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6845010 |
High performance heat sink configurations for use in high density packaging applications
An enhanced heat dissipation device to extract heat from an integrated circuit device includes a thermally conductive core having upper and lower outer surface areas. The device further includes a...
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6845013 |
Right-angle power interconnect electronic packaging assembly
The assembly includes a mother board having a processor carrier having a processor attached thereto. A heat sink is thermally coupled to the processor carrier and is located on top of the carrier....
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6840307 |
High performance heat exchange assembly
Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate, at least two fins and at least one porous reticulated...
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6839232 |
Fan-less housing
In a heat dissipating internally fan-less housing ( 20 ) for electronic circuits and components ( 28 ), the housing has an assembly of two container ( 10 ) parts comprising heat-sink fins ( 12 )....
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6834711 |
Heat-radiating structure with low height
A heat-radiating structure with low height, including a first heat-radiating plate and a second heat-radiating plate spaced above the first heat-radiating plate. The first heat-radiating plate is...
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6836409 |
Component cooling in electronic devices
A device for dissipating heat produced by circuitry such as the circuitry associated with an optical transponder includes a plurality of heat dissipating regions. Each heat dissipating region...
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6836408 |
Method and apparatus for force transfer via bare die package
The present application describes a method and an apparatus for facilitating increased uniformity and diffusion of force transfer on a bare die electronic package for example, when such electronic...
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6833991 |
Passive cooling apparatus for an outdoor cabinet
A cooling apparatus attaches to a cabinet housing electronics for protecting the electronics from external elements. The cooling apparatus includes an exterior surface for exposure to the external...
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