|
Match
|
Document |
Document Title |
|
|
7063127 |
Method and apparatus for chip-cooling
A thermal interface for IC chip cooling is provided. One embodiment of the thermal interface includes a thermally conductive liquid or paste-like metal(s) disposed within a flexible, thermally...
|
|
|
7061765 |
Electronic device
An electronic device (GER) with a housing (GEH), in which at least one circuit substrate (STT) is provided with an assembly side (BES), whereby at least one electronic component (BAU) is arranged...
|
|
|
7059396 |
System for configuring the geometric parameters for a micro channel heat exchanger and micro channel heat exchangers configured thereby
Geometric parameters of micro channel aspect ratios are determined for heat exchangers for gaseous fluids in which micro channels have a surface area density greater than 10000 m 2 /m 3 in the...
|
|
|
7055589 |
Clip for heat sink
A clip ( 30 ) securing a heat sink ( 10 ) includes a pair of spaced V-shaped main bodies ( 32 ) respectively received in grooves ( 16 ) of the heat sink. A pair of spaced wings ( 38 ) extends...
|
|
|
7057895 |
Thermal standoff for close proximity thermal management
A thermal management system is described for cooling an electronic component mounted on a printed circuit board. The thermal management system includes a heat sink coupled to an electronic...
|
|
|
7055577 |
Heat dissipation device for electronic device
A heat dissipation device includes a column ( 1 ) for being positioned on an electronic device for dissipating heat therefrom, a plurality of fin units ( 5 ) attached to and stacked along the...
|
|
|
7056566 |
Preappliable phase change thermal interface pad
A thermal interface for facilitating heat transfer from an electronic component to a heat sink. According to a preferred embodiment, the thermal interface comprises a first planar substrate that...
|
|
|
7051790 |
Protect cover for a radiator
A protect cover for a radiator is utilized to protect thermal grease coated at the bottom of the radiator. The protect cover has a cover body with a bottom and lateral sides. Further, the cover...
|
|
|
7054158 |
Cooling body
The present invention relates to a heat sink ( 1 ) with a main body ( 2 ) for accommodating at least one electronic structural element ( 5 ), and with a spring element ( 3 ) for pressing the...
|
|
|
7054159 |
Printed wiring board having heat radiating means and method of manufacturing the same
In the present invention, a printed wiring board with an electronic component mounted on a circuit board in which the electronic component is provided with a heat radiating plate for conducting...
|
|
|
7048038 |
Increased thermal capability of portable electronic device in stationary or docked mode
A technique for increasing the thermal capability of a portable electronic device includes transferring dissipated heat from a heat source disposed within the portable electronic device to at least...
|
|
|
7050303 |
Semiconductor module with vertically mounted semiconductor chip packages
A semiconductor module with vertically arranged semiconductor packages may include a module board with a plurality of insertion holes. A plurality of semiconductor packages may be inserted in a...
|
|
|
7050305 |
Automotive control module housing
An automotive control module includes a plastic housing with a snap-fit metal cover. A printed circuit board is positioned within a cavity formed in the housing, and is attached to the housing with...
|
|
|
7050304 |
Heat sink structure with embedded electronic components for semiconductor package
A heat sink structure with embedded electronic components is proposed, wherein a plurality of recessed cavities are formed on a heat sink for embedding the electronic components and receiving at...
|
|
|
7050302 |
Captive socket actuator
Illustrative embodiments of the present invention include, but are not limited to, a heat sink equipped with a captive socket actuating device designed to facilitate engagement and disengagement of...
|
|
|
7044212 |
Refrigeration device and a method for producing the same
The cooling device, particularly for electronic components, such as microprocessors, consists of a substrate ( 1 ), which features a heat-inlet surface that is in thermal contact with an object ( 6...
|
|
|
7046918 |
Space heater with pretreated heat exchanger
A space heater with a linear source of infrared radiant energy in heat exchange relationship with a heat exchanger formed of copper or aluminum material. The copper is pretreated to soften the...
|
|
|
7046515 |
Method and apparatus for cooling a circuit component
An apparatus includes a thermally conductive section with a side facing approximately parallel to an axis and adapted to be thermally coupled to a circuit component, and includes a fluid supply...
|
|
|
7044202 |
Cooler for electronic devices
A cooler for electronic devices provides cool air to the inlet sides of the heat sink by using a radial blower with blades located around air outlets of the heat sink. This blower is driven by a...
|
|
|
7040389 |
Integrated heat dissipation apparatus
An integrated heat dissipation apparatus includes a thermal conductor base and a heat sink interlocked with each other. The thermal conductor base has a channel formed in an upper portion thereof...
|
|
|
7040388 |
Heat sink, method of manufacturing the same and cooling apparatus using the same
A heatsink of the present invention has a column having a heat conducting plate with a heat receiving face contacting a heat producing element. On the side faces of the column are a plurality of...
|
|
|
7042728 |
Clamping structure and heat dissipating module using same
A clamping structure is used to fix a heat-dissipating body on a chip module. The clamping structure comprises a clamping body, two clamping portions, a pivot element, a top frame and a bottom...
|
|
|
7038913 |
Heat dissipation assembly including heat sink and fan
A heat dissipation assembly includes a heat sink ( 100 ), a fan ( 200 ) and a fan holder ( 300 ). The heat sink includes a plurality of fins ( 110 ) and defines a groove ( 122 ) in the fins at a...
|
|
|
7036574 |
Heat sink
A heat sink arrangement for modular electronic and/or opto-electronic equipment is provided. The equipment module is inserted into an interface and a heat sink is pivotably arranged so as to be...
|
|
|
7038911 |
Push-pull dual fan fansink
A heat sink having an air flow director on each of multiple fins attached to a heat sink base. The air flow directors direct most of the air flow from dual push-pull fans towards a midline and a...
|
|
|
7036573 |
Polymer with solder pre-coated fillers for thermal interface materials
A thermal interface material made of a binder material and a fusible filler.
|
|
|
7032651 |
Heat exchanger
A heat exchanger apparatus including a two-dimensional array of heat exchanging conduits, wherein each conduit includes an inlet and an outlet, and a manifold for providing heat exchanging fluid to...
|
|
|
7032657 |
Effervescence keeper
An effervescence keeper is shown as an elongated body for placement into an open container having a quantity of carbonated liquid. The effervescence keeper includes a stopper for supporting the...
|
|
|
7032650 |
Cooling fin set
A cooling fin set, which is disposed on a heat source of a computer, includes a plurality of cooling fins. Each cooling fin includes some fastening portions formed thereon. The fastening portions...
|
|
|
7028755 |
Heat dissipation device with interlocking fin plates
A heat dissipation device ( 20 ) includes a plurality of individual fin plates ( 40 ) arranged side by side. Each fin plate includes a main body ( 42 ). First and second flanges ( 44, 46 ) extend...
|
|
|
7028754 |
High surface area heat sink
A heat sink is built including a three dimensional array of cylindrical openings for air to flow through instead of fins. By having a larger surface area than heat sinks with fins, this high...
|
|
|
7031160 |
Magnetically enhanced convection heat sink
A magnetically enhanced convection heat sink comprises a heat sink member for dissipating heat from a heat source. A magnetic source creates a magnetic field concentrated at a first location, the...
|
|
|
7028753 |
Apparatus to enhance cooling of electronic device
An electronic device has at least one component that is capable of generating a quantity of heat. The electronic device further has an air-moving device and an air duct. The air moving device is...
|
|
|
7031161 |
Cooling system for adjustable electric drive
The invention relates to a cooling arrangement for an adjustable electric drive. The arrangement is arranged to conduct heat generated in electric devices by means of a liquid flowing through the...
|
|
|
7025129 |
Adhesive to attach a cooling device to a thermal interface
A method of providing thermal connection between a thermal cooling device and an integrated circuit package is provided. An adhesive is applied to a thermal interface outside a heat transfer area...
|
|
|
7027304 |
Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
Heat sinks, heat pipes, and other thermal management devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive...
|
|
|
7025122 |
Heat sink element coupling structure (2)
A heat sink element coupling structure comprised of a “+” or a “+”-shaped horizontal offset disposed on the upper and lower or left and right two sides or a certain position on the lateral...
|
|
|
7027299 |
Electronics assembly with arrangement for air cooling
An electronics assembly, for example a computer that may be employed as a network server, has an enclosure, and a plurality of heat-generating components such as microprocessors located inside the...
|
|
|
7027303 |
Electronic power module
The inventive electronic power module is provided for effecting the smooth starting of motors. The module essentially includes two semiconductor elements, which are connected in an electrically...
|
|
|
7023699 |
Liquid cooled metal thermal stack for high-power dies
The present invention provides a system for conducting heat away from an electrical component wherein the system has an elastically deformable member providing thermal communication with an...
|
|
|
7021367 |
Liquid cooling jacket
In a liquid cooling jacket, to improve the heat transfer coefficient, extensibility and assembling, the liquid cooling jacket comprises a base bonded to a heating element; a post standing...
|
|
|
7023701 |
Device for cooling memory modules
A device for cooling memory modules can include a plurality of elements. The elements can thermal couple at least two memory modules. The device can further include a body or a plurality of contact...
|
|
|
7021366 |
Heat dissipation apparatus and method
A heat dissipation apparatus and method for dissipating heat from a heat source includes a thermal conductive element bonding to the heat source to transfer heat energy generated by the heat source...
|
|
|
7023702 |
Apparatus including circuit board and heat sink and method of making the apparatus
In some embodiments, an apparatus includes a circuit board, a plurality of metal inserts, and a heat sink having a plurality of mounting holes. Each of the metal inserts may include at least one...
|
|
|
7018701 |
Thermally conductive sheet and method for manufacturing the same
A thermally conductive sheet includes a polyolefin elastomer mixed with a thermally conductive filler. The amount of volatile organic gas generated from the sheet is not more than 1000 μg/cm 2 ...
|
|
|
7019977 |
Method of attaching non-adhesive thermal interface materials
Securing a heat sink to an electronic device, such as an integrated circuit package, includes applying an adhesive layer to only a periphery of a surface on a thermal interface material. The...
|
|
|
7019976 |
Methods and apparatus for thermally coupling a heat sink to a circuit board component
A heat sink has a flexure member attached to a base of the heat sink and located between the base and an associated circuit board component. As the heat sink attaches to a circuit board carrying...
|
|
|
7017653 |
Heat sink clip mechanism
A heat sink clip is provided for attaching a heat sink assembly to a universal retention module (URM). The heat sink clip includes a body and a lever attached to the body by way of a pin. The body...
|
|
|
7017654 |
Apparatus and method of forming channels in a heat-exchanging device
An apparatus and method of manufacturing an apparatus for circulating a cooling material within a heat exchanger is disclosed. The apparatus comprises a manifold layer and an interface layer. The...
|
|
|
7019969 |
Dual fan heat sink with flow directors
A heat sink having air flow directors on each of multiple fins attached to a heat sink base. The air flow directors direct air flow from dual fans towards a geometric center of the heat sink base,...
|