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8184436 |
Liquid-cooled electronics rack with immersion-cooled electronic subsystems
Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vapor-condensing heat exchanger to condense dielectric fluid vapor egressing from the...
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8184435 |
Hot aisle containment cooling system and method
An air containment cooling system for containing and cooling air between two rows of equipment racks includes a canopy assembly configured to enclose a hot aisle defined by the two rows of...
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8176972 |
Compliant vapor chamber chip packaging
An arrangement for improving the cooling efficiency of semiconductor chips. One embodiment is to construct a vapor chamber with one compliant surface for improving the efficiency of transferring...
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8179677 |
Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and...
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8174826 |
Liquid cooling system for stackable modules in energy-efficient computing systems
A computing system is provided. In the computing system, a plurality of modules physically arranged in a three dimensional hexadron configuration. In the computing system, the at least one module...
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8174828 |
Narrow gap spray cooling in a globally cooled enclosure
Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and...
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8174824 |
Enclosure with access panel
Techniques for accessing an enclosure are disclosed herein. In one embodiment, an enclosure is configured for rack mounting. The enclosure includes an access panel disposed in a top surface of the...
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8174831 |
Heating circuit and electronics assembly
A heating circuit and an electronics assembly for use in a vehicle includes an external housing having outer walls and an internal wall dividing the external housing into an electronics cavity and...
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8174830 |
System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling
A circuit board includes a pump and a channel. The channel includes a liquid metal and a coating. The liquid metal is pumped through the channel by the pump and the coating reduces diffusion and...
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8169780 |
Power conversion device
In a power conversion device including: a converter which steps up or down a voltage of a direct current power supply; and an inverter which converts the direct current voltage obtained by the...
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8169779 |
Power electronics substrate for direct substrate cooling
Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical...
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8162036 |
Heat pipe structure and flattened heat pipe structure
A heat pipe structure including a pipe body and a working substance is provided. The pipe body has two closed ends opposite to each other, an inner surface, a compressed portion, and an expanded...
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8164901 |
High efficiency heat removal system for rack mounted computer equipment
An efficient method of heat removal from rack mounted computer equipment, network gear and other electronic equipment, consisting of solid heat conducting components in direct contact with the heat...
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8162038 |
Heat sink assembly
A heat sink assembly includes a base, a fin group located at a top of the base, a heat pipe connecting the base with the fin group, a fan mounted on a side of the fin group and a supporting bracket...
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8164902 |
Electronic apparatus
An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades...
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8159821 |
Diffusion bonding circuit submount directly to vapor chamber
A method for providing a high in-plane and through-plane thermal conductivity path between a heat producing electronic device and a heat sink is described. A vapor chamber, or other type of heat...
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8154864 |
LED display module having a metallic housing and metallic mask
The present invention is a robust LED display module for use in an electronic sign which display module includes a metallic housing, a heat conductive interface panel, an LED circuit board and...
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8141621 |
Apparatus and method for providing in situ cooling of computer data centers during service calls
An apparatus and method for cooling electronic components housed in a computer rack while performing maintenance operations is provided. The apparatus, in one embodiment, includes a heat exchange...
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8144467 |
Dehumidifying and re-humidifying apparatus and method for an electronics rack
Dehumidifying and re-humidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes a dehumidifying air-to-liquid heat exchanger disposed at an air inlet side...
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8136581 |
Heat transport apparatus and heat transport apparatus manufacturing method
A heat transport device having a composite structure that is readily manufactured and a method for manufacturing such a heat transport device are provided. The heat transport device includes a...
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8139355 |
Memory module connector having memory module cooling structures
One embodiment of the present invention provides a computer memory system that includes at least one DIMM connector having a DIMM socket for releasably receiving a terminal edge of a DIMM. A...
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8136366 |
Method, system and hardware device for temperature control
The invention provides a temperature control method, system and hardware device, wherein, the method comprising: after the system logs in operation system, a temperature control function module...
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8136580 |
Evaporator for a heat transfer system
A heat transfer system includes an evaporator having a heated wall, a liquid barrier wall containing working fluid, a primary wick positioned between the heated wall and an inner side of the liquid...
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8139358 |
Apparatus for externally changing the direction of air flowing through electronic equipment
A first conduit is externally attached to one of two opposing sidewalls of electronic equipment and a second conduit is externally attached to the other of the opposing sidewalls. Each conduit has...
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8134833 |
Evaporator for a cooling circuit
An evaporator is disclosed for a cooling circuit. The evaporator includes a housing having at least one wall for contacting a heat emitting device. A channel, the cross section of which is small...
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8132615 |
Heat sink and heat dissipation device having the same
A heat sink includes a heat dissipation fins assembly, a heat spreader, and a heat pipe. The heat dissipation fins assembly includes a plurality of heat dissipation fins. A guide plate extruding...
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8134837 |
Twist-secured assembly of a power semiconductor module mountable on a heat sink
A power semiconductor module system includes a power semiconductor module, a heat sink and at least one fastener. The power semiconductor module includes a bottom side with a first thermal contact...
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8134832 |
Electric drive
An electric drive is disclosed which includes at least a choke unit, a power step unit, and a capacitor unit for implementing power supply to an electricity-consuming device. A cooling arrangement...
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8132616 |
Temperature conditioning system with thermo-responsive valves
Disclosed is a temperature conditioning system including several thermal transfer blocks, where each is associated with one of several components requiring thermal management. Each of the...
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8130498 |
Heat sink of at least one electronic component
The invention relates to a cooling body of at least one electrical component. According to the invention, a first cooling body section is designed as a spring and a contact surface is provided on...
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8130497 |
Blade server
A server system with a cooling ability that can cope with an increase in the amount of heat generated by a CPU of a server module detachably mounted on a blade server. The server module includes an...
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8130496 |
Device and method for mitigating radio frequency interference
Embodiments of the present invention describe a device and method of mitigating radio frequency interference (REI) in an electronic device. The electronic device comprises a housing, and a thermal...
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8125781 |
Semiconductor device
A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing...
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8120916 |
Facilitating cooling of an electronics rack employing water vapor compression system
A cooling apparatus and method are provided for facilitating cooling of an electronic apparatus that includes a semiconductor element. The cooling apparatus includes an evaporator containing a...
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8118083 |
Circulation-type liquid cooling apparatus and electronic device containing same
A cooling apparatus includes a tank for keeping a coolant liquid therein and including an air layer, a heat receiver in contact with a heat generating part for receiving heat therefrom, a radiator...
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8120914 |
Semiconductor cooling apparatus
A semiconductor cooling apparatus having a tank forming body and semiconductor power device mounting substrates is disclosed. The tank forming body includes a first outer plate, a second outer...
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8120915 |
Integral heat sink with spiral manifolds
A heat sink is provided for directly cooling at least one electronic device package having an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at...
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8120918 |
Heat dissipation device
An exemplary heat dissipation device includes a fan having a plurality of first fixing cylinders, a heat sink having a plurality of second fixing cylinders, and a plurality of fasteners fixing the...
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8120917 |
Heat dissipation device
An exemplary heat dissipation device includes first and second heat sinks adapted for being thermally attached to first and second electronic components, respectively; and a heat pipe thermally...
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8116080 |
Container-based data center having greater rack density
A container includes first and second long sides parallel to the container's length. Racks are organized in rows parallel to the container's width. Each rack is receptive to installation of...
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8109324 |
Microchannel heat exchanger with micro-encapsulated phase change material for high flux cooling
A microchannel cooler containing a slurry having a particulate liquid/solid phase change material is provided balancing the interdependent factors of microencapsulated particle size with...
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8111513 |
Industrial computer
An industrial computer includes a first casing, a second casing, a storage unit, a cover, and a heat dissipation unit. The second casing and the first casing form a closed casing, and the outside...
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8109325 |
Heat transfer system
A thermodynamic system includes a cyclical heat exchange system and a heat transfer system coupled to the cyclical heat exchange system to cool a portion of the cyclical heat exchange system. The...
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8109323 |
Heat dissipation device having a clip
A heat dissipation device removing heat from a heat generating electronic device on a printed circuit board includes a base, a plurality of fins attached to the base and a clip for mounting the...
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8108082 |
Outdoor enclosure cooling system operating at off-peak hours
A cooling system and method for an outdoor electronics enclosure includes an air conditioner controlled to operate during off-peak hours, so as to pre-cool batteries. The cooled batteries keep the...
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8107241 |
Electric power conversion apparatus including cooling units
In a conventional cooling device, a heat pipe or a circulation-type liquid cooler provided with a pump is used and therefore, a large space is needed for the cooling device. There is provided a...
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8107234 |
Variable flow computer cooling system for a data center and method of operation
Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of...
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8102652 |
Base for power module
A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring...
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8101890 |
Fan apparency arrangement for an appliance
A fan apparency arrangement for an appliance having a fan for moving air in an interior of the appliance, including a pipe disposed in the airflow path of the fan and having first and second ends;...
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8100169 |
Spray nozzle apparatus and method of use
The subject invention pertains to a spray nozzle apparatus and method of use. The subject spray nozzle can be used to spray atomized fluid. The atomized fluid can then be incident on a heated...
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