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9033027 Heat transfer device including compressible particles suspended in a circulating heat-transfer fluid  
A heat transfer device including a container in which a heat-transfer fluid circulates in a closed loop. The heat transfer fluid is capable of undergoing an increase in volume on solidifying. The...
9027347 Solar collector, and an electrical energy generation plant including such solar collectors  
A solar collector (26) includes: an outer tube (64) of circular cross-section, closed at one of its ends, an absorption layer (52) arranged inside the outer tube (64), for absorbing solar...
9021698 Flat plate heat pipe and method for manufacturing the same  
The present invention relates to a flat plate heat pipe and a method for manufacturing the same. The heat pipe includes a flattened pipe whose inner surface is coated with a wick structure layer....
9013869 Consolidated thermal module  
A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.
9004113 Pipe having variable cross section  
A pipe having variable cross section and including a working core pipe, capillary pipes or sheets, an outer pipe, a connection support, and a cavity. The capillary pipes or sheets are attached to...
8997839 Thin heat pipe structure and method of manufacturing same  
A thin heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The...
8997840 Heat-dissipating unit having a hydrophilic compound film and method for depositing a hydrophilic compound film  
A heat-dissipating unit having a hydrophilic compound film and a method for depositing a hydrophilic compound film are disclosed. The heat-dissipating unit includes a metallic body having a...
8988880 Heat transfer assembly with heat pipe brace and method for assembling a heat transfer assembly  
An electronics device and method for assembling a heat transfer assembly of the same. An electronics device includes a circuit board, a chassis that houses the circuit board, a heat pipe...
8985195 Condensing device and thermal module using same  
A condensing device and a thermal module using same are disclosed. The condensing device includes a hollow main body having a first inlet, a first outlet, and a flow-guiding zone. In the...
8985197 Heat dissipation unit with mounting structure  
A heat dissipation unit with mounting structure includes a main body and a plurality of mounting elements. The main body internally defines a chamber, and includes a plurality of supports located...
8985196 Heat dissipation device with mounting structure  
A heat dissipation device with mounting structure includes a main body and a plurality of mounting elements. The main body includes an internally defined chamber having a first side and an...
8982560 Thermal management of an electronic device  
A system for thermal energy storage is disclosed herein. The system includes an electronic device and a docking station to receive the electronic device. The electronic device contains a device...
8973646 Slim type pressure-gradient-driven low-pressure thermosiphon plate  
A slim type pressure-gradient-driven low-pressure thermosiphon plate includes a main body closed by a cover. The main body includes a central heat receiving zone, a pressure accumulating zone and...
8976528 Fasteners and dual-thickness thermal stages in electronic devices  
The disclosed embodiments provide a system that facilitates heat transfer in an electronic device. The system includes a heat pipe configured to conduct heat away from a heat-generating component...
8967236 Inorganic aqueous solution (IAS) for phase-change heat transfer medium  
An inorganic aqueous solution for use in a phase-change heat transfer device comprises an aqueous solution of potassium permanganate (KMnO4), potassium dichromate (K2Cr2O7), chromium trioxide...
8966935 Heat exchanger  
A heat exchanger is described and which includes a heat exchanger portion defining a multiplicity of internal passageways, and wherein at least one of the passageways is defined in part by a...
8964393 Display device  
The present invention provides a display device comprising a display panel, a driving chip and a heatsink. The driving chip is used to drive the display panel. The heatsink is thermally connected...
8956483 Manufacturing method of casing of heat pipe  
A method for manufacturing a casing of a heat pipe includes steps: providing a hollow mold; injecting a feedstock of powder and molten binder into the mold under pressure, thus forming a desired...
8958206 Split bezel hinge in a double dense blade server  
A blade server comprises first and second housing portions. Each housing portion includes a cover securing a first printed circuit board assembly, two sides extending from the cover, a bezel...
8919427 Long-acting heat pipe and corresponding manufacturing method  
A heat pipe includes a metal tube, a heat-absorption part, a capillary and working fluid. The metal tube has a chamber formed therein. A vapor channel and a liquid channel communicating with the...
8921702 Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments  
In one possible implementation, a thermal plane structure includes a non-wicking structural microtruss between opposing surfaces of a multilayer structure and a thermal transport medium within the...
8919426 Micro-channel pulsating heat pipe  
A heat pipe device and a corresponding method in which micro-channel embedded pulsating heat pipes are incorporated into a substrate. A volume of fluid in a vacuum is introduced into a...
8908373 Cooling structure for an electronic component and electronic instrument  
A metal plate that forms a heat-absorbing surface has a center portion which protrudes so as to correspond to the size of a semiconductor element. A fixing support point of a plate spring is...
8897012 Electronic device and heat dissipation module thereof  
The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat...
8887672 Water heater containing a phase change material  
An appliance includes a water heater storage tank, a heating assembly configured to heat water within the water heater storage tank, and a heat exchange device disposed within the heat storage...
8879261 Heat-dissipating device for electronic apparatus  
A heat-dissipating device for an electronic apparatus can include: a thermal base coupled to a first electronic component in such a manner that enables heat-transfer therebetween so that heat...
8875779 Heat dissipation element with mounting structure  
A heat dissipation element with mounting structure includes a main body and a plurality of mounting elements. The main body includes a first side and a second side, between which a chamber is...
8869878 Flat plate heat pipe and method for manufacturing the same  
The present invention relates to a flat plate heat pipe and a method for manufacturing the same. The heat pipe includes a flattened pipe whose inner surface is coated with a wick structure layer....
8857502 Vapor chamber having heated protrusion  
A vapor chamber is configured to conduct heat generated by a heat-generating element and includes a bottom plate, a first wick structure, a second wick structure, a cover plate and a working fluid...
8819934 Instrument for fabricating a heat pipe  
The disclosure provides a method for fabricating a heat pipe, and an instrument of the method. The method for fabricating a heat pipe includes providing a hollow tube, wherein the hollow tube has...
8813834 Quick temperature-equlizing heat-dissipating device  
A heat-dissipating device includes a hermetic container, a metallic sheet, and two metallic nets. The hermetic container contains a liquid working medium and has an internal top side and an...
8811014 Heat exchange assembly and methods of assembling same  
A heat exchange assembly for use in cooling an electrical component is described herein. The heat assembly includes a casing that includes an evaporator section, a condenser section, and a...
8807203 Titanium-based thermal ground plane  
Titanium-based thermal ground planes are described. A thermal ground plane in accordance with the present invention comprises a titanium substrate comprising a plurality of pillars, wherein the...
8792238 Heat-dissipating module having loop-type vapor chamber  
A heat-dissipating module having a loop-type vapor chamber includes a heat-dissipating body, a loop-type vapor chamber, and a heat-conducting medium. The loop-type vapor chamber is completely...
8792226 Heat transfer system for use with electrical devices and method of operating the same  
A heat transfer system includes an electrical distribution cabinet extending about at least one current-carrying conductor. The heat transfer system also includes at least one...
8785024 Combination of heat pipe and louvered fins for air-cooling of Li-Ion battery cell and pack  
A heat pipe is described. The heat pipe includes a heat pipe body containing a working fluid; and a louvered cooling fin adjacent to one end of the heat pipe body, the louvered cooling fin...
8782889 Method for manufacturing a heat-dissipation unit including a heat-dissipation microstucture  
A heat-dissipation unit with heat-dissipation microstructure and method of manufacturing the same is disclosed. The heat-dissipation unit with heat-dissipation microstructure includes a main body...
8780560 Loop heat pipe, and electronic apparatus including loop heat pipe  
There is provided a loop heat pipe which includes an evaporator that internally includes at least one wick built, a condenser, a liquid pipe and a vapor pipe that connect the evaporator and the...
8780559 Heat exchange assembly for use with electrical devices and methods of assembling an electrical device  
An electrical device is described herein. The electrical device includes a housing that includes an inner surface that defines a cavity, a heat sink that is coupled to the housing and oriented...
8773855 Heat-dissipating device and electric apparatus having the same  
A heat-dissipating device and an electronic apparatus having the same are disclosed. The heat-dissipating device includes a heat-transferring heat pipe unit having a wick type of a heat pipe, in...
8763408 Hybrid thermoelectric-ejector cooling system  
A hybrid thermoelectric-ejector active cooling system having an increased Coefficient of Performance (COP) when compared to typical thermoelectric cooling modules. A thermoelectric cooling module...
8757247 Heat pipe structure  
A heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet...
8752616 Thermal management systems including venting systems  
A system includes a primary evaporator facilitating heat transfer by evaporating liquid to obtain vapor. The primary evaporator receives a liquid from a liquid line and outputs the vapor to a...
8739405 Method of manufacturing an evaporator for looped heat pipe  
An evaporator for a looped heat pipe (LHP) system, in which a working fluid circulates to cool heat generating electronic components that generate heat during operation, the evaporator including:...
8737071 Heat dissipation device  
A heat dissipation device is provided in the present disclosure, where the heat dissipation device includes a hollow heat-sink base and a set of fluid tube. The fluid tube is inserted in the...
8723205 Phosphor incorporated in a thermal conductivity and phase transition heat transfer mechanism  
A thermal conductivity and phase transition heat transfer mechanism has an opto-luminescent phosphor contained within the vapor chamber of the mechanism. The housing includes a section that is...
8720530 Multi-layer wick in loop heat pipe  
In one aspect of the present invention, a multi-layer wick for a loop heat pipe is provided. The multi-layer wick includes a primary wick, the primary wick comprising: a first layer; and a second...
8720062 Molding method for a thin-profile composite capillary structure  
A molding method for a thin-profile composite capillary structure includes the steps of preparing a metal grid and metal powder separately; attaching a liquid medium onto the metal grid by means...
8717745 Cooling method for cooling medium-voltage electrical switchgear using integrated heat pipes, and a system using said method  
The method of the invention makes it possible to cool electrical switchgear operating at medium voltage and high current, such as a circuit breaker. The method consists in inserting serially two...
8707729 Adsorption heat pump, adsorption refrigerator and adsorber elements therefor  
The invention relates to an adsorber element for a heat exchanger and an adsorption heat pump or adsorption refrigerator that contains at least one such adsorber element. The adsorber element...