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7243424 |
Production method for a multilayer ceramic substrate
An object of the invention is to connect different dielectrics electrically to each other in the direction of main surface of a sheet in a multilayer ceramic substrate and to increase the degree of...
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7189297 |
Method of manufacturing ESD protection component
A method of manufacturing an Electro Static Discharge (ESD) protection componentin which slurry including varistor particles and a resin binder is produced, and a varistor green sheet is formed...
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7186307 |
Method for manufacturing a ceramic multilayer circuit board
By increasing the quantity of resin binder of at least one of conductive paste and ceramic green sheet, adhesion between conductive film and the ceramic green sheet is improved when an intaglio...
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7185421 |
Method and apparatus for manufacturing multilayer printed wiring board
The present invention has an object to provide a producing method and producing apparatus of multilayered printed-circuit board that has eliminated the resin flow and resolved the problems of board...
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7141129 |
Electronic module including a low temperature co-fired ceramic (LTCC) substrate with a capacitive structure embedded therein and related methods
A method for making an electronic module includes forming a low temperature co-fired ceramic (LTCC) substrate with at least one capacitive structure embedded therein. Forming the LTCC substrate may...
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7011725 |
High performance embedded RF filters
Embedded, coupled, shaped waveguide resonators having conductive walls sandwiched between two fired green tape stacks, said conductive walls having apertures therein whose size and location...
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6855222 |
Method for manufacturing laminated multilayer electronic components
A method for producing a laminated electronic component produces a laminated electronic component having a superior surge-proofing property, a sufficient resistance to a flux, and excellent...
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6846375 |
Method of manufacturing multilayer ceramic wiring board and conductive paste for use
The present invention provides a method of manufacturing a low-temperature sintering multilayer ceramic wiring board comprising the steps of: forming a wiring layer by printing conductive paste ( 4...
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6758927 |
Method for making monolithic piezoelectric ceramic element
A method for making a monolithic piezoelectric ceramic element having high mechanical strength, excellent piezoelectricity, and high reliability is disclosed. The method includes the steps of...
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6749706 |
Method of manufacturing monolithic piezoelectric ceramic device
A method of manufacturing a piezoelectric ceramic device having excellent piezoelectric characteristics and high reliability is described. The method includes the steps of coating conductive paste...
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6723192 |
Process for producing a thin film EL device
A composite substrate in which the surface of the insulating layer is not influenced by the electrode layer and which requires neither a grinding process nor a sol-gel process, is easy to produce...
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6533888 |
Apparatus and method for fabricating buried and flat metal features
The present invention relates generally to a new method and apparatus to enable high yielding double sided and/or multipass screening in the manufacture of multilayer ceramic packages. Also, the...
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6488795 |
Multilayered ceramic substrate and method of producing the same
A method of producing a multilayered ceramic substrate in which wiring conductors can be provided on both main surfaces and the density of the wiring conductors can be increased by a non-shrinkage...
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6471805 |
Method of forming metal contact pads on a metal support substrate
A method of forming low resistance contact pads on a metal support substrate for a multilayer ceramic printed circuit board comprising forming a patterned layer of a conductive metal on the metal...
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6444066 |
Method for manufacturing ceramic electronic device
A highly reliable ceramic electronic device is manufactured by suppressing diffusion of silver, the ceramic device having a silver-based conductive pattern on a sintered glass ceramic compact...
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6270601 |
Method for producing filled vias in electronic components
The present invention relates to a process for producing filled vias which are made of two components, a first component which forms a bonding layer between the wall of the via and a second...
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6241838 |
Method of producing a multi-layer ceramic substrate
A method of producing a multi-layer ceramic substrate involves the steps of preparing compact blocks including a raw ceramic functional material to be the passive component, preparing a raw...
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6217821 |
Method of forming distortion-free circuits
A method of forming a distortion-free circuit whereby a conductive composition is applied to at least one layer of green ceramic tape. The conductive composition formulation is based on total...
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6045747 |
Method of producing an LC-circuit
A method is provided of producing an LC-circuit in form of a single component, in which the inductor and capacitor elements are arranged atop one another, and where the inductor elements are formed...
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6041496 |
Method of making ceramic substrate
The present invention relates to multi-layer ceramic packaging of hybrid micro-electronic devices, including those for implantable medical devices. The invention permits size reduction and design...
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5882536 |
Method and etchant to join ag-clad BSSCO superconducting tape
A method of removing a silver cladding from high temperature superconducting material clad in silver (HTS) is disclosed. The silver clad HTS is contacted with an aqueous solution of HNO 3 followed...
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5876538 |
Method for manufacturing a ceramic multilayer substrate for complex electronic circuits
Ceramic multilayer substrates as circuit supports for complex electronic circuits wth integrated capacitors are manufactured by printing capacitor structures, using the screen printing process,...
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5840140 |
Method for making a microceramic optical shutter
A method of making a microceramic optical shutter includes forming a sacrificial stator member and inserting the sacrificial stator member into the bottom ceramic portion in the green state, a top...
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5795422 |
Method for forming molded ceramic devices having embedded spiral coils
A method of fabricating a molded ceramic device having an embedded spiral coil, is disclosed which includes: forming grooves that provide portions of a spiral coil in surfaces of first and second...
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5766392 |
Method of manufacturing a multilayer ceramic electronic component
In order to inhibit a fired multilayer ceramic electronic component from delamination resulting from combustion of resin contained in conductive paste which is applied to internal conductors of the...
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5759480 |
Method of firing and sintering a ceramic electronic component
Components whose palladium metal-containing constituent is not subject to delamination and which exhibit very good dielectric properties are obtained by means of a method of manufacturing a ceramic...
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5683790 |
Multilayer ceramic parts
A multilayer ceramic part including dielectric ceramic layers and internal conductor layers is prepared by forming dielectric ceramic layers from an oxide system dielectric ceramic material having...
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5635000 |
Method for screening using electrostatic adhesion
The present invention relates generally to a new apparatus and method for screening using electrostatic adhesion. More particularly, the invention encompasses an apparatus that uses an...
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5632942 |
Method for preparing multilayer ceramic/glass substrates with electromagnetic shielding
A method for making multilayer ceramic/glass substrates with electromagnetic shielding. The method comprises the steps of: (a) preparing a homogeneous inorganic slurry composition by blending and...
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5628919 |
Methods for producing a chip carrier and terminal electrode for a circuit substrate
A chip carrier according to the present invention includes: a carrier body including an upper face, a lower face, and an internal conductor; and a plurality of terminal electrodes formed on the...
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5547530 |
Method of manufacturing a ceramic substrate
The method of manufacturing a ceramic substrate having a plurality of bumps of the present invention, includes the steps of: forming a bump forming layer having a plurality of holes therein on at...
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5514451 |
Conductive via fill inks for ceramic multilayer circuit boards on support substrates
Conductive via fill inks for green tapes to be stacked and bonded to a support substrate, the glass used for the green tape having a firing temperature from 850°-950° C., wherein the glass used...
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5500996 |
Method for manufacturing a thermistor having a negative temperature coefficient in multi-layer technology
In a method for manufacturing a thermistor having a negative temperature coefficient in multi-layer technology, a plurality of layers are produced of ceramic material by producing a suspension and...
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5478420 |
Process for forming open-centered multilayer ceramic substrates
A multilayer ceramic substrate with an internal cavity extending from the top to the bottom surface of the substrate is produced using an insert material which fits within a cavity defined by...
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5474741 |
Method for reducing shrinkage during firing of ceramic bodies
A method for reducing X-Y shrinkage during firing of ceramic bodies in which a flexible constraining layer, which becomes porous during firing, is applied to the ceramic body such that the flexible...
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5456778 |
Method of fabricating ceramic circuit substrate
A ceramic circuit substrate is fabricated by preparing ceramic greensheets for the fabrication of the ceramic circuit substrate, and unsintered ceramic sheets unsinterable at a sintering...
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5440802 |
Method of making wire element ceramic chip fuses
A method of manufacturing a chip fuse includes the steps of depositing a plurality of columns of electrically conductive metal film on a green, unfired ceramic substrate, and disposing a plurality...
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5423930 |
Method of providing a sintered ceramic body having a concave portion
A method of manufacturing an electronic component having a concave portion. A ceramic laminate is prepared having a plurality of sheets with burnaway film formed thereon. The burnaway film material...
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5416277 |
Cicuit and process of manufacturing the circuit
In a process for manufacturing a circuit including a first circuit plane of a ceramic substrate which is covered with, for example, thick-film structures and is imprinted with corresponding...
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5412865 |
Method of manufacturing multilayer electronic component
A method of manufacturing a layered product to obtain a multilayer ceramic capacitor. A mother sheet supported by a carrier film is cut to obtain respective sheets to form a plurality of sheets....
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5407502 |
Method for producing a semiconductor device having an improved adhesive structure
A method is provided wherein semiconductor device includes a package, a semiconductor chip provided on the package, an intermediate layer formed on the package, an adhesive layer formed on the...
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5405466 |
Method of manufacturing multilayer ceramic electronic component
A method of manufacturing a multilayer ceramic electronic component including a step of firing a ceramic green sheet laminate having internal electrodes containing at least one of palladium and...
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5378297 |
Ferrite chip bead and method for making same
A ferrite chip bead includes a ferrite substrate, a plurality of outer electrodes formed at opposite sides of the ferrite substrate, and a plurality of conductive leads each extending transversely...
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5370759 |
Method for producing multilayered ceramic substrate
A method for producing a multilayered ceramic substrate including the steps of: forming at least two green sheets each including a low-temperature firing glass-ceramic substrate material, forming...
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5368667 |
Preparation of devices that include a thin ceramic layer
A device having a thin ceramic layer therein, is made by preparing a mixture of ceramic particles, a binder, and a plasticizer, and forming the mixture into a ceramic layer. A second layer is...
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5340422 |
Method for making ferrite chip bead array
A method for making a ferrite chip bead array in which a plurality of reinforcing outer electrodes are formed at the upper and lower surfaces of a ferrite substrate structure having a pair of...
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5329695 |
Method of manufacturing a multilayer circuit board
Methods of fabricating multilayer circuits are presented. In accordance with the present invention, a plurality of circuit layers are stacked, one on top of the other. At least one of the circuit...
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5304274 |
Method for manufacturing electrodes for multilayer ceramic capacitors
A method and apparatus for manufacturing electrodes for capacitors having a plurality of thin metal coatings on a ceramic dielectric substrate, with the coated substrates assembled in a monolithic...
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5290375 |
Process for manufacturing ceramic multilayer substrate
A ceramic multilayer substrate, containing a stack of alternate ceramic and inner conductor layers, the conductor layer having a melting point higher than a lowest firing temperature of the ceramic...
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5288351 |
Silver paste sintering method for bonding ceramic surfaces
A method for bonding a first ceramic element and a second ceramic element utilizes a silver powder paste composed of silver particles dispersed in a volatile vehicle. A film of the paste is applied...
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