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Match Document Document Title
8157951 Capacitively coupled plasma reactor having very agile wafer temperature control  
A plasma reactor for processing a workpiece includes a reactor chamber, an electrostatic chuck within the chamber having a top surface for supporting a workpiece and having indentations in the top...
8157915 CVD reactor having a process-chamber ceiling which can be lowered  
The invention relates to an apparatus for the deposition of one or more layers on a substrate (4), which comprises a process chamber (2) which is arranged in a reactor housing (1) and has a...
8142609 Plasma processing apparatus  
A plasma processing apparatus including a mounting table that includes a mounting table body having a temperature adjusted to be a predetermined level, and an electrostatic chuck disposed on an...
8110045 Processing equipment for object to be processed  
Processing equipment for an object to be processed is provided with a process container, the internal of which can be evacuated, a gas introducing means for introducing a prescribed gas into the...
8092602 Thermally zoned substrate holder assembly  
A thermally zoned substrate holder including a substantially cylindrical base having top and bottom surfaces configured to support a substrate. A plurality of temperature control elements are...
8092639 Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes  
A plasma reactor having a reactor chamber and an electrostatic chuck with a surface for holding a workpiece inside the chamber includes a backside gas pressure source coupled to the electrostatic...
8083855 Temperature control module using gas pressure to control thermal conductance between liquid coolant and component body  
A temperature control module for a semiconductor processing chamber comprises a thermally conductive component body, one or more channels in the component body and one or more tubes concentric...
8082977 Ceramic mounting for wafer apparatus with thermal expansion feature  
A mounting apparatus includes a surface plate; a temperature control unit integrated with the surface plate; and a bottom plate integrated with the temperature control unit via a heat insulation...
8056503 Plasma procesor and plasma processing method  
An etching chamber 1 incorporates a focus ring 9 so as to surround a semiconductor wafer W provided on a lower electrode 4. The plasma processor is provided with an electric potential control DC...
8048228 Masking apparatus and method of fabricating electronic component  
A masking apparatus includes a mask base body and a mask plate. The mask base body includes at least one spacer plate, and a cavity in which an electronic component can be housed. The mask plate is...
8038796 Apparatus for spatial and temporal control of temperature on a substrate  
An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside...
8016975 Etching system  
An etching system. An etching chamber includes an exhaust port. A gas input pipe is connected to the etching chamber, inputting etching process gas thereinto. A top RF electrode is disposed above...
8012304 Plasma reactor with a multiple zone thermal control feed forward control apparatus  
A plasma reactor having a reactor chamber and an electrostatic chuck having a surface for holding a workpiece inside the chamber includes inner and outer zone backside gas pressure sources coupled...
8007591 Substrate holder having a fluid gap and method of fabricating the substrate holder  
A substrate holder (20) for supporting a substrate (30). A heating component (50) is positioned adjacent to a supporting surface and between the supporting surface and a cooling component (60). A...
7993705 Film formation apparatus and method for using the same  
A method for using a film formation apparatus includes performing film formation of a product film selected from the group consisting of a silicon nitride film and a silicon oxynitride film on a...
7988062 Temperature control device for target substrate, temperature control method and plasma processing apparatus including same  
A temperature control device for a target substrate includes a mounting table having temperature control members respectively provided in temperature systems to control temperatures of regions of...
7988816 Plasma processing apparatus and method  
A plasma etching apparatus includes an upper electrode and a lower electrode, between which plasma of a process gas is generated to perform plasma etching on a wafer W. The apparatus further...
7972444 Workpiece support with fluid zones for temperature control  
A workpiece support is disclosed defining a workpiece-receiving surface. The workpiece support includes a plurality of fluid zones. A fluid, such as a gas, is fed to the fluid zones for contact...
7931776 Plasma processing apparatus  
A plasma processing apparatus including a chamber having an inner wall with a protective film thereon and a sample stage disposed in the chamber in which plasma is generated by supplying...
7927424 Padded clamp ring with edge exclusion for deposition of thick AlCu/AlSiCu/Cu metal alloy layers  
A substrate clamp ring has an edge exclusion lip with a variable bottom surface. At least a portion of that bottom surface has a height above the substrate contact level selected to minimize...
7913752 Cooling device for vacuum treatment device  
A cooling system for a vacuum processing apparatus is provided with an internal heat conduction path for transfer of heat entering the subject body through the vacuum processing apparatus, a heat...
RE42175 Electrostatic chucking stage and substrate processing apparatus  
This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the...
7867356 Apparatus for reducing polymer deposition on a substrate and substrate support  
An adjustable RF coupling ring is capable of reducing a vertical gap between a substrate and a hot edge ring in a vacuum processing chamber. The reduction of the gap reduces polymer deposits on the...
7862659 Semiconductor manufacturing device  
The present invention relates to a semiconductor manufacturing device that a maintenance or a repairing is easy so that an efficiency of manufacturing can be enhanced because a high temperature of...
7854821 Substrate processing apparatus  
A substrate processing apparatus includes a heat transfer gas supply mechanism to supply a heat transfer gas through a supply passage into a portion between a worktable and a substrate to improve...
7850782 ***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Thermally zoned substrate holder assembly  
A thermally zoned substrate holder including a substantially cylindrical base having top and bottom surfaces configured to support a substrate. A plurality of temperature control elements are...
7846255 Processing equipment for object to be processed  
Processing equipment for an object to be processed is provided with a process container, the internal of which can be evacuated, a gas introducing means for introducing a prescribed gas into the...
7845310 Wide area radio frequency plasma apparatus for processing multiple substrates  
An antenna array for a radio frequency plasma process chamber including, an array of electrodes, an array of dielectric tubes concentrically disposed about each electrode tube to define a chamber...
7837798 Semiconductor processing apparatus with a heat resistant hermetically sealed substrate support  
An apparatus for manufacturing a semiconductor or liquid crystal is provided with a reaction chamber housing a ceramic holder with an embedded resistive heating element, and a cylindrical support...
7837828 Substrate supporting structure for semiconductor processing, and plasma processing device  
A substrate supportingstructure (50) for semiconductor processing, comprising a mounting table (51) for placing a processed substrate (W) disposed in a processing chamber (20), wherein temperature...
7824498 Coating for reducing contamination of substrates during processing  
A substrate support has a support structure and a coating on the support structure having a carbon-hydrogen network. The coating has a contact surface having a coefficient of friction of less than...
7815740 Substrate mounting table, substrate processing apparatus and substrate processing method  
A substrate mounting table includes a plurality of passageways independently provided therein, a temperature control medium flowing through the passageways, and a gap formed between at least two of...
7806983 Substrate temperature control in an ALD reactor  
A deposition system includes a process chamber for conducting an ALD process to deposit layers on a substrate. An electrostatic chuck (ESC) retains the substrate. A backside gas increases thermal...
7803246 Etching system  
An etching system. An etching chamber includes an exhaust port. A gas input pipe is connected to the etching chamber, inputting etching process gas thereinto. A top RF electrode is disposed above...
7771536 Substrate processing apparatus  
The substrate processing apparatus according to the present invention is aimed to stably and efficiently perform a deposition process on a substrate W. The substrate processing apparatus supports...
7771564 Plasma processing apparatus  
In a plasma processing apparatus equipped with a vacuum vessel and a sample table which is arranged within the vacuum vessel and has a sample mounting plane where a sample is mounted on an upper...
7763147 Arc suppression plate for a plasma processing chamber  
A plasma processing chamber configured to generate a plasma is provided. The plasma processing chamber includes a substrate support assembly which includes a substrate support that is capable of...
7731798 Heated chuck for laser thermal processing  
A chuck for supporting a wafer and maintaining a constant background temperature across the wafer during laser thermal processing (LTP) is disclosed. The chuck includes a heat sink and a thermal...
7713380 Method and apparatus for backside polymer reduction in dry-etch process  
A method for preventing the formation of contaminating polymeric films on the backsides of semiconductor substrates includes providing an oxygen-impregnated focus ring and/or an oxygen-impregnated...
7699934 Epitaxial wafer production apparatus and susceptor structure  
A susceptor structure capable of discharging the atmosphere containing dopant species and filling a wafer pocket, without causing a large quantity of a raw material gas to flow from the front...
7678197 Susceptor device  
A susceptor device comprises a base body, an electrostatic absorbing inner electrode which is disposed on a bottom surface of the base body, a power supplying terminal, an insulating sprayed layer...
7674353 Apparatus to confine plasma and to enhance flow conductance  
The embodiments of the present invention generally relate to a plasma reactor. In one embodiment, a plasma reactor includes a substrate support is disposed in a vacuum chamber body and coupled to...
7670436 Support ring assembly  
A substrate ring assembly is provided for a substrate support having a peripheral edge. The assembly has an annular band having an inner perimeter that surrounds and at least partially covers the...
7670434 Vapor phase growth apparatus  
It is to provide a vapor phase growth apparatus which can perform vapor phase growth of a thin film having a good uniformity throughout a surface of a wafer. The vapor phase growth apparatus...
7655579 Method for improving heat transfer of a focus ring to a target substrate mounting device  
A focus ring heat transfer method improves heat transfer of a focus ring arranged in an outer peripheral portion of a mounting surface of a mounting table adapted to mount a target substrate in a...
7618516 Method and apparatus to confine plasma and to enhance flow conductance  
The embodiments of the present invention generally relate to annular ring used in a plasma processing chamber. In one embodiment, the annular ring includes an inner wall, an upper outer wall, a...
7615133 Electrostatic chuck module and cooling system  
An electrostatic chuck module for a semiconductor manufacturing apparatus which can be cooled with water and in which there is no penetration leak includes an electrostatic chuck plate of alumina...
7585386 Plasma processing apparatus, electrode plate for plasma processing apparatus, and electrode plate manufacturing method  
A plasma processing apparatus for performing a plasma process on a target substrate includes a process container configured to accommodate the target substrate and to reduce pressure therein. A...
7582186 Method and apparatus for an improved focus ring in a plasma processing system  
A focus ring configured to be coupled to a substrate holder comprises a first surface exposed to a process; a second surface, opposite the first surface, for coupling to an upper surface of the...
7582166 Holder for supporting wafers during semiconductor manufacture  
An improved wafer holder design is described which has manufacturing and performance advantages over present state-of-the-art holders used in various wafer processing applications. The new wafer...
Matches 1 - 50 out of 204 1 2 3 4 5 >