|
Match
|
Document |
Document Title |
|
|
8182647 |
Hydrophilic biodegradable adhesives
A moisture-curable and biodegradable adhesive that includes the reaction product of: (a) an isocyanate component having an average functionality of at least 2; (b) an active hydrogen component...
|
|
|
8157950 |
Aldimine and composition containing aldimine
Aldimines of Formula (I), which can be used as latent curing agents in curing compositions, for example, in moisture-curing polyurethane compositions that have isocyanate groups. The aldimines are...
|
|
|
8153244 |
Reinforcement patches with unidirectionally-aligned fibers
Reinforcement patches comprising a mastic and a plurality of unidirectionally-aligned fibers at least partially embedded in a first major surface of the mastic are described. Generally, at least...
|
|
|
8153269 |
Hybrid components containing reactive hotmelt adhesives
Reactive hotmelt adhesives based on copolyamide can be used in hybrid components. These hybrid components find application in, for example, vehicle construction and aircraft construction.
|
|
|
8128782 |
Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate
The present invention provides an amine based epoxy resin curing agent and an epoxy resin composition containing the curing agent. The epoxy resin composition has a high gas barrier performance, a...
|
|
|
8119251 |
Polyamides
The reaction of diner acids, C10-C20 dicarboxylic acids, and alkylene diamines having from 2 to 8 carbon atoms provides polyamides having good oil and solvent resistance, high heat resistance,...
|
|
|
8119737 |
Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a...
|
|
|
8114519 |
Derivatized solid epoxy resin and uses thereof
Derivatized solid epoxy resins of the formula (I), which are outstandingly suitable as impact modifiers; and compositions which include such derivatized solid epoxy resins and are outstandingly...
|
|
|
8105460 |
Handling layer and adhesive parts formed therewith
A handling layer and adhesive parts having the handling layer are formed according to the present invention along with used therefore.
|
|
|
8097119 |
Heat-resistant structural epoxy resins
Epoxy adhesive compositions containing a rubber-modified epoxy resin contain a bisphenol. The bisphenol can be pre-reacted with the rubber-modified epoxy resin to advance the resin. The adhesives...
|
|
|
8088245 |
Structural epoxy resins containing core-shell rubbers
Core-shell rubbers are incorporated into epoxy adhesives. The adhesives are structural type adhesives that contain an epoxy resin and a toughener, and may contain a liquid rubber in addition to the...
|
|
|
8075721 |
Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability
This invention relates to the thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arr...
|
|
|
8076424 |
Heat-curable compositions comprising low-temperature impact strength modifiers
The present invention relates to compositions which contain at least one epoxide adduct A having on average more than one epoxide group per molecule, at least one polymer B of the formula (I), at...
|
|
|
8074423 |
Parquet joint kit system and method for manufacturing a parquet joint kit system
The three components composed parquet joint cement system comprises an aqueous epoxy resin dispersion, an amine hardener, which forms a solid adduct, and a wood flour. The solid portion in an...
|
|
|
8071217 |
Heat-curable epoxy resin composition containing one blocked and one epoxide-terminated polyurethane prepolymer
Discussed are heat-curable epoxy resin compositions containing at least one epoxy resin A with, on average, more than one epoxide group per molecule, at least one curing agent B for epoxy resins,...
|
|
|
8071698 |
Surface-promoted cure of cationically curable compositions comprising vinyl ethers
The present invention relates to cationically curable compositions for curing on a surface comprising a cationically curable component, an accelerator species comprising at least one vinyl ether...
|
|
|
8066891 |
Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film
The present invention provides a laminate comprising an insulating layer having suppressed dusting properties, an insulating film comprising the insulating layer, and an electronic circuit...
|
|
|
8062468 |
Low-temperature impact resistant thermosetting epoxide resin compositions with solid epoxide resins
The invention relates to compositions containing at least one solid epoxide resin A, at least one polymer B of formula (1), at least one thixotropic agent C made from a urea derivative and at least...
|
|
|
8062469 |
Adhesive resin composition and bonding method
The present invention relates to an inexpensive adhesive resin composition which is applicable even to a base material having a poor bonding property. The adhesive resin composition comprises (A) a...
|
|
|
8062467 |
Two-component adhesive for producing semi-finished products and composite sandwich materials
Two-component adhesives (K), which includes two components K1 and K2. Component K1 includes at least one epoxy resin A with more than one epoxy group per molecule on average; at least one epoxy...
|
|
|
8043534 |
Maleimide compositions and methods for use thereof
The invention is based on the discovery that compositions containing certain maleimide compounds and aromatic diene compounds are useful as thermosetting resins for the electronic packaging...
|
|
|
8021456 |
Filter element with high temperature polymer retaining straps and method of manufacture
A filter element for removing particles from a particulate laden fluid stream includes, in an exemplary embodiment, a filtration media formed into a tubular configuration and that a plurality of...
|
|
|
8007630 |
Method of multilayer film dry lamination of airbag fabrics
An inflatable automotive protective cushion and method of formation. The protective cushion includes a multilayer film coating with an adhesive layer and an overlying barrier layer. The adhesive...
|
|
|
8002937 |
Alignment and affixment system for trim parts
A trim part is aligned, via a flexible, split jig, to a finished primary surface and adhered by an epoxide to a secondary structural surface. An epoxide fixing accelerant is applied to the epoxide...
|
|
|
7998305 |
Electrical interconnect using locally conductive adhesive
An anisotropic electrically conducting interconnect is disclosed in which an adhesive comprising particles having a breakable coating of at least one electrically nonconductive material is...
|
|
|
7967796 |
Adhesive for injection needle, a method for bonding injection needle, a syringe front-assembly and a syringe
The present invention inhibits the occurrence of the foreign matters attributable to an adhesive for bonding an injection needle to a needle-base member so as to enhance the yield of a syringe when...
|
|
|
7968668 |
Diisocyanate terminated macromer and formulation thereof for use as an internal adhesive or sealant
A novel macromer or mixture thereof is described herein, comprising benzoyl isocyanate terminal moieties and at least two residues of a water-soluble polymer having a molecular weight ranging from...
|
|
|
7967943 |
Circuit-connecting material and circuit terminal connected structure and connecting method
A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes...
|
|
|
7968196 |
Circuit-connecting material and circuit terminal connected structure and connecting method
A circuit-connecting material interposed between mutually-facing circuit electrodes, and electrically connecting the electrodes, either by direct contact, or via conductive particles present in the...
|
|
|
7951251 |
Adhesive film, flexible metal-clad laminate including the same with improved dimensional stability, and production method therefor
It is an object of the present invention to provide an adhesive film which is used for producing, by a laminating method, a flexible metal-clad laminate in which the change in dimensions is...
|
|
|
7951456 |
Two-component epoxy adhesive composition
A two-component epoxy adhesive composition comprises a) a first component comprising a first epoxy resin and a second epoxy resin being flexibilized by an elastomer, and b) a second component...
|
|
|
7947779 |
Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer
Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a...
|
|
|
7922860 |
Manufacturing inkjet head by adhering with epoxy resins and alkyl imidazole
Disclosed are an adhesive agent composition which has high chemical resistance and solvent resistance and is curable at around room temperature, an inkjet head which has good durability and jetting...
|
|
|
7914641 |
Sealing material for flat panel display
A sealing material for a flat panel display contains 100 parts by weight of a compound (A) containing at least one epoxy group in the molecule, and 0.01 to 40 parts by weight of a compound (B) that...
|
|
|
7892391 |
Compositions of ethylene/vinyl acetate copolymers for heat-sealable easy opening packaging
Disclosed are compositions comprising ethylene/vinyl acetate copolymers, tackifying resins and optionally polyolefins (for example, polyethylene and polypropylene) that provide strong, tight...
|
|
|
7892396 |
Toughened activatable material for sealing, baffling or reinforcing and method of forming same
An activatable material and articles incorporating the same is disclosed. The activatable material includes at least three of epoxy resin; impact modifier; blowing agent; curing agent; and filler....
|
|
|
7879956 |
Circuit-connecting material and circuit terminal connected structure and connecting method
A circuit-connecting material for interposing between circuit electrodes facing each other and electrically connecting the electrodes, after curing by heat and pressure, either by direct contact or...
|
|
|
7875146 |
Method of producing harmonics generating device
It is provided a chip having a supporting substrate, a wavelength conversion layer, a base adhesive layer made of an organic resin, an upper-side substrate provided on an upper surface side of the...
|
|
|
7875210 |
Adhesive composite material with controlled resistivity
The invention relates to a composite polymer material comprising an adhesive resin matrix and an electrically-conductive filler that consists of an oligoaniline in an electrically-conductive form...
|
|
|
7868435 |
Adhesive containing a filler, and a method for attaching and manufacturing a thin plate using the same
An adhesive comprises a base material which generates adhesive strength through curing, a hardening agent which promotes the curing of the base material, and a filler. In order to solve the...
|
|
|
7863758 |
Adhesive film composition, associated dicing die bonding film, and die package
An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a...
|
|
|
7863374 |
Self-curable water-based solid adhesive and bonding method using the self-curable water-based solid adhesive
Self-curable water-based solid adhesives of this invention include the following components (A), (B), (C), and (D): (A) an anionic-group-containing polymer terminally having an alkoxysilyl group,...
|
|
|
7842146 |
Ultrasonic energy for adhesive bonding
An adhesive is contacted with a surface of a substrate and ultrasonic energy is applied to the adhesive to enhance the bonding of the adhesive to the surface of the substrate. The ultrasonic...
|
|
|
7834091 |
Bonding surfaces with two-component adhesive of epoxy resins and amine compound
The present invention relates to a two-component epoxy adhesive composition comprising a) a first component comprising a first epoxy resin and a second epoxy resin, the second epoxy resin being...
|
|
|
7785440 |
Formaldehyde-free lignocellulosic adhesives and composites made from the adhesives
Method for making lignocellulosic composites by adhering lignocellulosic substrates together. A first variant of the method involves using an adhesive composition that comprises a reaction product...
|
|
|
7786214 |
Composition of epoxy resin, epoxy adduct, urea derivative thixotropic agent and curing agent
Disclosed are compositions containing at least one epoxy resin A with on average more than one epoxy group per molecule; at least one epoxy adduct B with on average one epoxy group per molecule; at...
|
|
|
7759452 |
Aspartic ester functional compounds
A functional aspartate prepared by A) reacting an aziridine with a Michael-acceptor molecule to form an aziridinyl aspartate, and B) reacting the aziridinyl aspartate with an active hydrogen...
|
|
|
7745006 |
Low odor, fast cure, toughened epoxy adhesive
An epoxy adhesive composition of an epoxy resin and an amine hardener includes a synergistic accelerator of an effective amount of short chain polyol and an effective amount of a dihydric phenol...
|
|
|
7740734 |
Low shrinkage epoxy-cationic curable compositions
The present invention relates to compositions comprising an epoxy resin; a reagent selected from the group of cationic compounds or compounds which are capable to form cationic compounds or...
|
|
|
7736559 |
Binding wood using a thermosetting adhesive composition comprising a protein-based component and a polymeric quaternary amine cure accelerant
Thermosetting adhesive compositions for use in e.g., particleboard or fiberboard, wherein the compositions comprise a blend of a protein-based component and a polymeric quaternary amine cure...
|