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7588668 |
Thermally conductive dielectric bonding of sputtering targets using diamond powder filler or thermally conductive ceramic fillers
A sputtering target assembly and method for bonding a sputtering target to a backing plate is disclosed. When insulatively bonding a sputtering target to a backing plate, it is necessary to ensure...
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7588659 |
Bonding aid for polyamide resin and method of bonding with the same
It is a joining auxiliary agent for a polyamide resin with which a predetermined joining face of a polyamide resin molded article is coated to ensure the joining strength between the predetermined...
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7566501 |
Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same
An epoxy resin composition for printed wiring boards which comprises an epoxy resin, a phenolic novolak, a curing accelerator, and a silica filler, characterized in that the silica filler has a...
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7553902 |
Water-emulsifiable isocyanates having improved properties
Mixtures comprising
(A) an isocyanurate and/or biuret of 1,6-diisocyanatohexane (HDI), (B) an isocyanurate of 1-isocyanato-3,5,5-trimethyl-5-isocyanatomethylcyclohexane (IPDI), (C) at least one...
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7550058 |
Method of manufacturing aldehyde-free engineer wood floor
The present invention relates to the technical field of manufacturing engineer wood floor for indoor decoration, and in particular to a manufacturing method that does not release any dissociated...
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7547373 |
Two-part epoxy adhesives with improved flexibility and process for making and using same
A two-part epoxy adhesive having a resin component containing a mixture of an epoxy resin and an internally flexibilized epoxy resin and a hardener component containing a mixture of a flexibilizer...
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7543373 |
Gel package structural enhancement of compression system board connections
A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of...
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7541075 |
Sealant material for plastic liquid crystal display cells including one component epoxy resin composition
A sealant composition for a plastic liquid display cell is composed of a one-component epoxy resin composition of a base resin liquid and a curing agent liquid, wherein the base resin is a liquid...
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7531244 |
Plywood, and a process for preparing plywood
The invention relates to plywood, comprising at least two wood veneer layers and at least one adhesive layer, whereby the adhesive layer comprises a resin composition comprising a triazine compound...
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7527857 |
Multilayer film, laminate using the same, and method for producing the laminate
Disclosed is a multilayer film for a strain-free laminate that is used for flexible TFT substrates or the like. Also disclosed are a laminate obtained by arranging such a multilayer film on a...
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7524394 |
Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing...
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7507461 |
Edge coating for honeycomb used in panels with composite face sheets
Core-skin bonding is improved between honeycomb and composite face sheets by applying a nylon-based (polyamide) adhesive to the edge of the honeycomb prior to bonding. Edge coating of honeycomb...
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7498389 |
Multi-component kit of epoxy resin and mannich base components
A multi-component kit for a curable composition for fixing purposes, comprising an epoxy component (a), which comprises curable epoxides, and a hardener component (b), which comprises a Mannich...
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7498384 |
Multi-component epoxy-amine primer systems comprising a polythioether
Multi-component epoxy-amine primer systems are disclosed, which comprise an amine component that comprises a polythioether. Also disclosed are substrates coated with such primer systems as well as...
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7491290 |
Two-pack type adhesive
Disclosed is a two-component adhesive used for electrically and mechanically interconnecting two objects for bonding. The two-component adhesive is made up by first and second adhesive materials...
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7491287 |
Bonding method with flowable adhesive composition
A method of bonding a first article to a second article is provided. The method involves the use of a flowable, adhesive composition that contains non-aggregated, surface-modified silica...
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7482064 |
Wood panel
Disclosed is a composite wood component having upper and lower surface layers and a core layer; a first glueline layer; a second glueline layer; and an overlay layer.
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7482056 |
Transparent conductor
The present invention provides a transparent conductor comprising a substrate, and a conductive layer containing conductive particles and a conductive polymer.
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7470451 |
Binding agent component for surface coating agents with improved adhesive properties
The invention relates to a binding agent composition, in particular an adhesive, containing at least one epoxy compound or at least one amino compound comprising at least two amino groups, or at...
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7465778 |
Silante terminated polyurethane
A curable, alkoxysilane-functional polyether urethane composition formed by combining a) a first silane terminated polyurethane prepared by reacting i) a mono-functional compounds with ii) an...
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7462651 |
Radiation-curable desiccant-filled adhesive/sealant
A radiation-curable desiccant-filled adhesive/sealant composition comprising a radiation-curable resin, one or more desiccant fillers, one or more photoinitiators or photosensitizers, and...
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7384683 |
Substrate for flexible printed wiring board and method for manufacturing the same
The present invention provides a substrate for a flexible printed wiring board including an adhesive layer containing an epoxy resin composition, insulating layers respectively stacked on both...
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7368170 |
Viscous chemical anchoring adhesive
A chemical anchoring adhesive includes a first part having a viscosity of about 200,000 to about 4,000,000 centipoise and a second part having a viscosity of about 200,000 to about 4,000,000...
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7354499 |
Method for making a lubricating fast setting epoxy composition
A method for making a lubricating fast-setting epoxy compound comprising: mixing under vacuum dispersion a first micro-crystalline filler, a first talc, and a titanium oxide into a hardenable...
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7342053 |
Resin composition, adhesive film using the same and multilayer printed circuit board
Producing a printed circuit board, by coating a resin composition comprising an aromatic cyanate compound having two or more cyanato groups in a molecule and a radical-polymerizable resin on a...
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7335301 |
Fold protection for spiral filtration modules utilizing UV cured adhesive and method of providing same
The present invention encompasses a leaf packet useful in forming a spiral filtration module, wherein the fold area of the leaf packet is reinforced with a UV cured adhesive. The invention further...
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7326316 |
Electrical interconnect using locally conductive adhesive
An anisotropic electrically conducting interconnect is disclosed in which an adhesive comprising particles having a breakable coating of at feast one electrically nonconductive material is...
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7317055 |
Adhesive resin and adhesive resin composition for liquid crystalline polymer
An adhesive resin for a liquid crystal polymer, comprising a modified polyolefin (D) prepared by graft polymerizing at least one epoxy group-containing ethylenically unsaturated monomer (B) to a...
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7303675 |
Blister protection for spiral wound elements
A method for preventing osmotic blistering in spirally-wound elements of semipermeable membrane sheet material ( 14 ) by applying an effective coating of a sealant ( 41, 43, 45 ) to the upstream...
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7288161 |
Reworkable adhesives containing thermally labile groups
Embodiments of the present invention relate to adhesive compositions containing thermally-labile groups for decreasing the degradation temperature of the adhesive for reworkability of electronic...
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7278212 |
Universal joint with adhesive bearing cup retention method
A universal joint including a spider having a plurality of trunnions. The universal joint also includes a pair of yokes, where each yoke has a pair of arms with an aperture formed therethrough, and...
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7268183 |
Reactive polyurethane hotmelts with large PSA range
Reactive polyurethane hotmelts comprising crystallizing polyesterpolyols based on fumaric acid and 1,6-hexanediol. These hotmelts exhibit good pressure-sensitive adhesive (PSA) properties over a...
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7262514 |
Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device
An epoxy resin composition for semiconductor encapsulation in producing surface mount lead-less thin semiconductor devices. The epoxy resin composition for surface mount lead-less semiconductor...
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7259207 |
Single-component polyurethane adhesive
A pasty single component polyurethane adhesive is provided. The NCO terminated polyurethane prepolymer is substantially linear, contains from 2.0% to 8.0% based on the weight of the prepolymer, of...
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7255897 |
Use of aqueous polyurethane dispersions is formulations for sports floor coverings
The invention relates to the use of aqueous, isocyanate-free, polyurethane dispersions with a solid content of ≧30 wt. % and a solvent content of ≦10 wt. % in sports floor coverings. The...
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7252735 |
Formaldehyde-free lignocellulosic adhesives and composites made from the adhesives
Method for making lignocellulosic composites by adhering lignocellulosic substrates together. A first variant of the method involves using an adhesive composition that comprises a reaction product...
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7208105 |
Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure
There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit...
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7208062 |
Method of producing multilayer printed wiring board
Adhesive films which are useful for preparing laminated circuit boards may be produced by laminating a resin composition layer made of a layer A and layer B on a support base film, in which
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7189793 |
Iodine/iodide-containing hot melt coatable adhesive, methods and uses therefor
An iodine/iodide-containing hot melt coatable adhesive is provided. This adhesive is prepared by mixing iodine and an iodide salt, individually or in combination, with solubilizing liquids. The...
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7186311 |
Process for producing substrate for flexible circuit board
The invention provides a process for producing a substrate for flexible circuit boards which comprises: providing a multilayered insulating resin layer comprising an insulating layer and an...
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7166180 |
Method of vacuum-laminating adhesive film
The present invention relates to a vacuum-laminating method for adhesive films where adhesive bleeding is reduced.
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7144630 |
Aqueous adhesive compositions for bonding elastomers
The present invention relates to improved compositions for aqueous adhesives and aqueous primers that increase the durability of composites made by adhering elastomers to metal.
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7125461 |
Activatable material for sealing, baffling or reinforcing and method of forming same
An activatable material and articles incorporating the same is disclosed. The activatable material includes at least three of an epoxy resin; a thermoplastic polyether; a blowing agent; a curing...
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7112631 |
Moisture cured reactive hot melt adhesive with monofunctional reactants as grafting agents
High green strength reactive hot melt adhesives are prepared using crystalline monofunctional reactants.
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7101456 |
Ion triggerable, cationic polymers, a method of making same and items using same
The present invention is directed to ion triggerable, water-dispersible cationic polymers. The present invention is also directed to a method of making ion triggerable, water-dispersible cationic...
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7090920 |
Poly(arylene ether) adhesive compositions
A laminate, comprises a thermoplastic substrate, a conductive metal foil at least partially disposed on at least one side of the substrate, and an adhesive disposed between the substrate and the...
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7087304 |
Polysulfide-based toughening agents, compositions containing same and methods for the use thereof
In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example,...
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7070670 |
Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device
There are disclosed an adhesive composition comprising: (a) an epoxy resin, (b) a curing agent and (c) a polymer compound with a weight average molecular weight of 100,000 or more, wherein a ratio...
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7037594 |
Electromagnetic wave shielding member and process for producing the same
There is provided an electromagnetic wave shielding member which has see-through properties and electromagnetic wave shielding properties, is free from a change in color of an adhesive at the time...
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7037399 |
Underfill encapsulant for wafer packaging and method for its application
A curable underfill encapsulant composition that is applied directly onto semiconductor wafers before the wafers are diced into individual chips. The composition comprises a thermally curable epoxy...
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