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8100314 |
Carbon nanotubes solder composite for high performance interconnect
An embodiment of the present invention is an interconnect technique. Carbon nanotubes (CNTs) are prepared. A CNT-solder composite paste is formed containing the CNTs and solder with a pre-defined...
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8075662 |
Nickel braze alloy composition
A nickel braze alloy composition includes a blend of a first nickel alloy and a second nickel alloy. The first nickel alloy includes about 4.75 wt %-10.5 wt % of chromium, about 5.5 wt %-6.7 wt %...
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8075706 |
Paste composition for aluminum brazing
A paste composition for aluminum brazing of the invention contains 40 to 65% by weight of a metal powder for brazing (a), 5 to 35% by weight of a fluoride type flux (b), 1 to 10% by weight of a...
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8070045 |
Curable amine flux composition and method of soldering
A curable amine flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; an amine fluxing agent represented by formula I:...
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8070046 |
Amine flux composition and method of soldering
An amine flux composition is provided, comprising, as an initial component: an amine fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a...
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8070043 |
Curable flux composition and method of soldering
A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a fluxing agent represented by formula I: wherein R1,...
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8070044 |
Polyamine flux composition and method of soldering
A polyamine flux composition is provided, comprising, as an initial component: a polyamine fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a...
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8070047 |
Flux composition and method of soldering
A flux composition is provided, comprising, as an initial component: a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted...
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8043407 |
Welding solid wire
It is an object of the present invention to provide a similar composition metal type welding solid wire capable of forming a welded joint having excellent cryogenic characteristics, such as...
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8034154 |
Method for repairing cracks in components and solder material for soldering components
The invention relates to a method for repairing components that consist of a superalloy. The method comprises the following steps: a solder material is applied to the repair site; the repair site...
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8034195 |
Material and method of manufacturing of a solder joint with high thermal conductivity and high electrical conductivity
A solder composition for forming a solder joint. The composition includes a powder material including a solid metal matrix material and a filler material. The solid metal matrix material includes...
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8020745 |
Solder ball
An object of the present invention is to improve a yield of electronic devices in a ball mounting process by preventing a micro-bonding and change in color of the solder balls, and to improve a...
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8002905 |
Fluxing agent for soldering metal components
The aim of the invention is to provide a fluxing agent for soldering components, which creates one or more specific surface characteristics during the soldering process itself, thus obviating the...
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7985374 |
Cadmium-free silver brazing filler metal
A cadmium-free silver brazing filler metal containing gallium, indium, nickel and cerium falls into the field of metal material and metallurgy. Its chemical composition includes (by mass...
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RE42329 |
Flux cored preforms for brazing
A wire preform suitable for use in brazing components to one another. The preform is made from a length of wire having a core of flux material, and a longitudinal seam or gap that extends over the...
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7926700 |
Solder pastes comprising nonresinous fluxes
According to the invention, a resin-free solder paste made from a metal powder, particularly soft solder and a gel, is prepared, wherein the gel according to the invention leaves no residue on the...
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7850789 |
Pasty composition for aluminum brazing, aluminum-containing member coated with the same, and method for brazing aluminum-containing members with the same
Provided are a pasty composition for aluminum brazing which has excellent coating properties, is capable of attaining favorable dimensional accuracy of products obtained after brazing, causes less...
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7829151 |
Method for producing pieces having a modified surface
The invention relates to a method for modifying piece surfaces consisting in bringing pieces into contact with at least one type of a modifying agent in such a way that the modification of the...
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7793820 |
Solder preform and a process for its manufacture
A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder...
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7767032 |
No-clean low-residue solder paste for semiconductor device applications
A no-clean low residue solder paste is described for die-attach dispensing or fine pitch printing of semiconductor devices. The solder paste has a homogeneous consistency with no tendency to paste...
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7766218 |
Pasty silver particle composition, process for producing solid silver, solid silver, joining method, and process for producing printed wiring board
To provide a pasty silver particle composition, which, upon heating, allows silver particles to be easily sintered to form solid silver possessing excellent strength, electric conductivity and...
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7740713 |
Flux composition and techniques for use thereof
The present invention is directed to soldering techniques and compositions for use therein. In one aspect, a flux composition is provided. The flux composition comprises a fluxing agent comprising...
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7727339 |
Submerged arc flux
A highly basic particle flux for submerged arc welding that produces less than 7 ml/100 gr of diffusible hydrogen in the weld metal, which flux comprises a carbon dioxide containing compound with...
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7678203 |
Welding flux
A welding flux formulated for pipe welding or one-side welding applications including a gas releasing agent, a high melting compound and a low melting compound. The welding flux is particularly...
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7655304 |
Coated solder metal particles
A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating...
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7644855 |
Brazing filler metal, assembly method for semiconductor device using same, and semiconductor device
In conventional Sn/Sb type brazing filler metals, there are disadvantages that large grains in a β′ phase are likely to deposit and that cracks are likely to occur in the elements and the bonded po...
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7645348 |
Repair process
In accordance with the present invention, a process for repairing metal workpieces, such as turbine engine components, is provided. The process comprises the steps of forming a braze paste...
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7604154 |
Thermosetting flux and solder paste
The invention aims to provide a thermosetting flux suitable for solder bonding of a semiconductor element and an electronic part and making solder bonding with a high bonding strength and a high...
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7569164 |
Solder precoating method
A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within...
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7537728 |
Method for increasing the effectiveness of a component of a material
A manufacturing method for a material increases the effectiveness of a component so the component can be present in an amount which does not produce undesirable effects. A material is prepared...
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7534309 |
Aqueous aluminum brazing composition, aluminum material coated with the brazing composition, brazing method using the aluminum material, and automotive heat exchanger manufactured by using the brazing method
An aqueous aluminum brazing composition containing an organic binder and a zinc-based flux which prevents the precipitation of the zinc-based flux having a large specific gravity while securing an...
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7524351 |
Nano-sized metals and alloys, and methods of assembling packages containing same
A nano-sized metal particle composition includes a first metal that has a particle size of about 20 nanometer or smaller. The nano-sized metal particle can include a second metal that forms a shell...
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7481353 |
Metal bonding method
A hydrocarbon compound mixed with an organic peroxide is placed between a copper electrode and a solder-coated electrode, and is heated at a temperature of about 300° C. The organic peroxide is ...
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7416108 |
High strength diffusion brazing utilizing nano-powders
A braze material (10) including nano-sized filler material particles (14). The nano-sized particles will melt at a temperature significantly lower than the micron-sized particles used in prior art...
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7413805 |
Preparation of metallic particles for electrokinetic or electrostatic deposition
Metallic particles for electrokinetic or electrostatic deposition, and a method for making such particles, comprising metallic particle bodies, an organic acid film on the particle bodies, and a...
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7380700 |
Paste composition for brazing and brazing method using the same
The invention provides a paste composition for brazing, which upon brazing, does not cause brazing insufficiency such as residual carbon in any type of industrial brazing furnace, can achieve an...
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7357291 |
Solder metal, soldering flux and solder paste
Solder metal consists essentially of 8.8 to 5.0 mass % of Zn, 0.05 to 0 mass % of Bi and the balance of Sn and unavoidable impurities.
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7337941 |
Flux coated brazing sheet
A brazing flux mixture comprised of brazing flux, a polyvinyl butyral resin binder, and an organic solvent which can be applied over an entire aluminum alloy brazing sheet, or can be applied on the...
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7331500 |
Solder bumps formation using solder paste with shape retaining attribute
Method of forming solder bumps of an integrated circuit package is described. A solder paste is formed from a material having a characteristic that the deposited instances thereof substantially...
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7326367 |
Thick film conductor paste compositions for LTCC tape in microwave applications
This invention is related to thick film conductor compositions comprising electrically conductive gold powder, one or more glass frit or ceramic oxide compositions and an organic vehicle. It is...
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7241348 |
Flux for solder paste and solder paste
A flux for solder paste contains a dicarboxylic acid of carbon number 3 to 5 and a dicarboxylic acid of carbon number 15 to 20 as an activator, which prevents skinning or changes by aging of...
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7214419 |
Conductive paste multilayered board including the conductive paste and process for producing the same
A conductive paste is provided, which has good conductivity and good adhesiveness to substrates and has good long-lasting stability of these properties, and which, when applied to a through-hole of...
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7170073 |
Stainless steel product containing B and method for production thereof
A stainless steel slab containing B, wherein a protecting material is joined onto at least two faces across the bloom from each other in a stainless steel bloom containing B of 0.3–2.5 mass %, b...
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7150797 |
Filler material for use in welding of Mg-contained aluminum alloy die-cast members, welding method, and welded article
An aluminum alloy filler material for use in welding of metal members including at least one aluminum die-cast member containing Mg includes an aluminum or an aluminum alloy as base material and...
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7147725 |
Colloidal silica binder system
A welding flux that includes a flux agent, water glass and colloidal compound formed from small particles of silicon dioxide. The welding flux has a very low hygroscopicity, thus is well suited...
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7111771 |
Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same
A doped tin-indium solder composition is disclosed. The doped tin-indium solder exhibits a retained fine-grain structure and superplasticity after significant thermal cycling and thermal and...
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7047635 |
Connecting material and connecting method
A connecting material can form a detachable connecting structure. According to the connecting material, a connecting portion between a certain object and another object can be more readily formed,...
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7022266 |
Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards
A composition for use in the production of metal traces and other metal components of printed circuit boards, wiring boards and the like. The composition includes the following components: (a) a...
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6984254 |
Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy
A lead-free solder powder that can include a plurality of lead-free solder particles each having a general spherical shape with a diameter of 20–60 μm. Each of the lead-free solder particles can co...
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6936115 |
Soldering flux vehicle additive and fine pitch printing method
A lubricant additive which is a branched chain fatty alcohol or fatty acid containing a total of from 8 to 50 carbon atoms with a minimum of 4 carbon atoms being present in the shorter alkyl chain,...
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