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7604154 |
Thermosetting flux and solder paste
The invention aims to provide a thermosetting flux suitable for solder bonding of a semiconductor element and an electronic part and making solder bonding with a high bonding strength and a high...
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7569164 |
Solder precoating method
A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within...
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7537728 |
Method for increasing the effectiveness of a component of a material
A manufacturing method for a material increases the effectiveness of a component so the component can be present in an amount which does not produce undesirable effects. A material is prepared...
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7534309 |
Aqueous aluminum brazing composition, aluminum material coated with the brazing composition, brazing method using the aluminum material, and automotive heat exchanger manufactured by using the brazing method
An aqueous aluminum brazing composition containing an organic binder and a zinc-based flux which prevents the precipitation of the zinc-based flux having a large specific gravity while securing an...
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7524351 |
Nano-sized metals and alloys, and methods of assembling packages containing same
A nano-sized metal particle composition includes a first metal that has a particle size of about 20 nanometer or smaller. The nano-sized metal particle can include a second metal that forms a shell...
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7481353 |
Metal bonding method
A hydrocarbon compound mixed with an organic peroxide is placed between a copper electrode and a solder-coated electrode, and is heated at a temperature of about 300° C. The organic peroxide is...
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7416108 |
High strength diffusion brazing utilizing nano-powders
A braze material ( 10 ) including nano-sized filler material particles ( 14 ). The nano-sized particles will melt at a temperature significantly lower than the micron-sized particles used in prior...
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7413805 |
Preparation of metallic particles for electrokinetic or electrostatic deposition
Metallic particles for electrokinetic or electrostatic deposition, and a method for making such particles, comprising metallic particle bodies, an organic acid film on the particle bodies, and a...
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7387690 |
Repair process
In accordance with the present invention, a process for repairing metal workpieces, such as turbine engine components, is provided. The process comprises the steps of forming a braze paste...
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7380700 |
Paste composition for brazing and brazing method using the same
The invention provides a paste composition for brazing, which upon brazing, does not cause brazing insufficiency such as residual carbon in any type of industrial brazing furnace, can achieve an...
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7357291 |
Solder metal, soldering flux and solder paste
Solder metal consists essentially of 8.8 to 5.0 mass % of Zn, 0.05 to 0 mass % of Bi and the balance of Sn and unavoidable impurities.
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7337941 |
Flux coated brazing sheet
A brazing flux mixture comprised of brazing flux, a polyvinyl butyral resin binder, and an organic solvent which can be applied over an entire aluminum alloy brazing sheet, or can be applied on the...
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7331500 |
Solder bumps formation using solder paste with shape retaining attribute
Method of forming solder bumps of an integrated circuit package is described. A solder paste is formed from a material having a characteristic that the deposited instances thereof substantially...
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7326367 |
Thick film conductor paste compositions for LTCC tape in microwave applications
This invention is related to thick film conductor compositions comprising electrically conductive gold powder, one or more glass frit or ceramic oxide compositions and an organic vehicle. It is...
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7241348 |
Flux for solder paste and solder paste
A flux for solder paste contains a dicarboxylic acid of carbon number 3 to 5 and a dicarboxylic acid of carbon number 15 to 20 as an activator, which prevents skinning or changes by aging of...
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7214419 |
Conductive paste multilayered board including the conductive paste and process for producing the same
A conductive paste is provided, which has good conductivity and good adhesiveness to substrates and has good long-lasting stability of these properties, and which, when applied to a through-hole of...
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7170073 |
Stainless steel product containing B and method for production thereof
A stainless steel slab containing B, wherein a protecting material is joined onto at least two faces across the bloom from each other in a stainless steel bloom containing B of 0.3–2.5 mass %,...
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7150797 |
Filler material for use in welding of Mg-contained aluminum alloy die-cast members, welding method, and welded article
An aluminum alloy filler material for use in welding of metal members including at least one aluminum die-cast member containing Mg includes an aluminum or an aluminum alloy as base material and...
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7147725 |
Colloidal silica binder system
A welding flux that includes a flux agent, water glass and colloidal compound formed from small particles of silicon dioxide. The welding flux has a very low hygroscopicity, thus is well suited...
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7111771 |
Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same
A doped tin-indium solder composition is disclosed. The doped tin-indium solder exhibits a retained fine-grain structure and superplasticity after significant thermal cycling and thermal and...
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7047635 |
Connecting material and connecting method
A connecting material can form a detachable connecting structure. According to the connecting material, a connecting portion between a certain object and another object can be more readily formed,...
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7022266 |
Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards
A composition for use in the production of metal traces and other metal components of printed circuit boards, wiring boards and the like. The composition includes the following components: (a) a...
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6984254 |
Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy
A lead-free solder powder that can include a plurality of lead-free solder particles each having a general spherical shape with a diameter of 20–60 μm. Each of the lead-free solder particles can...
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6936115 |
Soldering flux vehicle additive and fine pitch printing method
A lubricant additive which is a branched chain fatty alcohol or fatty acid containing a total of from 8 to 50 carbon atoms with a minimum of 4 carbon atoms being present in the shorter alkyl chain,...
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6926849 |
Solder paste
A solder paste comprising a powder of a Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.5-10.0 wt % of isocyanuric acid or a haloalkyl ester...
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6923875 |
Solder precipitating composition
According to present invention, there is provided a lead-free solder precipitating composition comprising a tin powder, and a complex of silver ions and/or copper ions and aryl phosphines, alkyl...
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6883701 |
Iron-chromium base brazing filler metals
A plurality of parts are brazed using an iron/chromium filler metal. The parts are preferably composed of stainless steel. The brazed assembly forms a heat exchanger characterized by good corrosion...
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6881278 |
Flux for solder paste
A solder powder comprises solder particles having a distribution such that the number of particles having a particle diameter of 20 μm or less is 30% or less, wherein the oxygen content is 500 ppm...
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6880746 |
Fluorostannate-containing brazing or soldering fluxes and use thereof in brazing or soldering aluminum or aluminum alloys
Fluxing agents comprising potassium fluorostannate and/or cesium fluorostannate which can be used for brazing or soldering components of aluminum or of an aluminum alloy, even by solderless brazing...
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6849136 |
Filler metal for aluminum brazing sheet for heat exchangers and method of manufacturing same
An object of the present invention is to provide a filler metal for an aluminum brazing sheet for heat exchangers capable of preventing or controlling occurrence of a melting hole during heating...
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6830632 |
Flux cored preforms for brazing
A wire preform suitable for use in brazing components to one another. The preform is made from a length of wire having a core of flux material, and a longitudinal seam or gap that extends over the...
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6790293 |
Solder work material for forming solder-coated circuit board and circuit board
There is provided a solder work material for forming solder-coated circuit boards, which is capable of preventing the malfunction of circuit that may be caused to generate by voltage noises that...
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6767411 |
Lead-free solder alloy and solder reflow process
A lead-free solder alloy consisting essentially of, by weight, 3.0% to 3.5% silver, greater than 1% to about 15% copper, the balance tin and incidental impurities, and having an effective melting...
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6743409 |
Alkali metal fluorozincate and method for producing it
Novel methods for producing alkali metal fluorozincates, especially potassium fluorozincate. Products having defined particle size ranges are obtained depending on the sequence of introduction of...
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6726780 |
Lead-free solder, and paste solder composition
There is provided a lead-free solder which makes it possible to reliably and accurately perform the inspection of various kinds of defective soldering in the inspection using an image inspection...
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6725517 |
Method for plugging a hole and a cooling element manufactured by said method
A method for plugging a hole, particularly a hole provided in a cooling element, in which method a hole formed in a piece essentially made of mainly copper, for instance in the housing element of a...
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6712262 |
Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board
The invention provides a water-soluble preflux that can solve problems with a soldering land array having a narrow spacing in that fused solder is likely to cause soldering bridges with defective...
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6703113 |
Pb-free solder composition and soldered article
Provided is a Pb-free solder composition having an excellent heat resistance which does not damage a glass substrate and parts on the substrate when the soldering is carried out on to an electrode...
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6692581 |
Solder paste for fabricating bump
A solder paste for fabricating bumps includes a flux and metallic alloy powder. The metallic alloy powder includes a plurality of low eutectic metallic alloy granules, and the size of these...
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6669079 |
Conductive paste and semiconductor component having conductive bumps made from the conductive paste
A conductive paste ( 16 ) for use in making conductive bumps ( 18 ) and a method for using the conductive paste to make conductive bumps ( 18 ) on a substrate ( 10 ). The conductive paste ( 16 ) is...
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6659329 |
Soldering alloy
A new soldering technique and solder alloy for wetting and joining hard-to-wet materials including titanium alloys such as nitinol uses a solder alloy containing tin and an active wetting promoting...
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6656290 |
Soldering paste for hard-soldering and coating aluminum and aluminum alloys
A soldering paste for hard-soldering and coating working parts made of aluminum or aluminum alloys, which contains 25 to 35 percent in weight of a water-miscible organic binding agent on the basis...
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6656291 |
Solder paste and soldering method of the same
A solder paste including a solder powder; and a flux including at least an activating agent, and acid anhydride obtained by a dehydration reaction of aliphatic carboxylic acid having up to seven...
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6648214 |
Method for partially or completely coating the surfaces of components produced from aluminum or its alloys with solders, fluxing agents or binders for brazing
In a method for partial or complete coating of surfaces of components of aluminum and its alloys with a uniform layer of homogeneously distributed solder, fluxing agent and binder for brazing of...
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6648212 |
Components coated with an aluminum-silicon alloy
Components composed of aluminum or an aluminum alloy with a coating comprising an aluminum-silicon alloy deposited thereon by applying an alkali metal fluorosilicate and heating the resulting...
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6648210 |
Lead-free solder alloy powder paste use in PCB production
Tombstoning susceptibility and reflow peak temperature reduction of solder alloys, in particularly lead-free solder alloys, has been found to be achieved effectively by mixing the solder alloy in...
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6641679 |
Flux for soldering and solder composition
A soldering flux according to the present invention is a soldering flux containing an epoxy resin and an organic carboxylic acid, wherein the epoxy resin and the organic carboxylic acid are...
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6620261 |
Flux cored wire for dual phase stainless steel
Flux cored wire for dual stainless steel having flux filled into a stainless steel sheath of the invention, the flux contains, with respect to the total weight of the wire: 0.02 to 0.10 wt % C;...
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6616032 |
Brazing composition and method for brazing parts made of alumina-based materials with said composition
A refractory braze composition and process for assembling alumina-containing parts to another alumina-based material, metal or a metal alloy by reactive or non-reactive refractory brazing using a...
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6613123 |
Variable melting point solders and brazes
Variable melting point solders and brazes having compositions comprising a metal or metal alloy powder having a low melting point with a metal powder having a higher melting point. Upon heating,...
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