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8163104 |
Fluxing agent
A flux or a flux preparation, which contains complex alkali metal fluorides and additionally includes a water-soluble polymer, preferably polyvinyl alcohol or a polyvinyl alcohol derivative. The...
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8075663 |
Anti-oxidative agent for molten metal, method of preparing and method of using thereof
An anti-oxidative agent for molten metal containing at least nonylphenol polyoxyethylene ether, organic amine, phosphoric acid, and phytic acid. A method of preparing the anti-oxidative agent for...
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8075706 |
Paste composition for aluminum brazing
A paste composition for aluminum brazing of the invention contains 40 to 65% by weight of a metal powder for brazing (a), 5 to 35% by weight of a fluoride type flux (b), 1 to 10% by weight of a...
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8070045 |
Curable amine flux composition and method of soldering
A curable amine flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; an amine fluxing agent represented by formula I:...
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8070046 |
Amine flux composition and method of soldering
An amine flux composition is provided, comprising, as an initial component: an amine fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a...
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8070043 |
Curable flux composition and method of soldering
A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a fluxing agent represented by formula I: wherein R1,...
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8070044 |
Polyamine flux composition and method of soldering
A polyamine flux composition is provided, comprising, as an initial component: a polyamine fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a...
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8070047 |
Flux composition and method of soldering
A flux composition is provided, comprising, as an initial component: a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted...
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7950126 |
Simplified method and apparatus for making cored wire and other tubular products
Improved cored-wire fabrication replaces multiple roller pairs with one or more dies. In the preferred embodiment, flat stock is pulled through a single cylindrical die including an upper tab to...
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RE42329 |
Flux cored preforms for brazing
A wire preform suitable for use in brazing components to one another. The preform is made from a length of wire having a core of flux material, and a longitudinal seam or gap that extends over the...
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7926700 |
Solder pastes comprising nonresinous fluxes
According to the invention, a resin-free solder paste made from a metal powder, particularly soft solder and a gel, is prepared, wherein the gel according to the invention leaves no residue on the...
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7896979 |
Activating flux for welding stainless steels
An activating flux for welding stainless steel includes: from 25 to 40 weight percent of titanium dioxide (TiO2); from 25 to 30 weight percent of chromium oxide (Cr2O3); from 10 to 30 weight...
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7829151 |
Method for producing pieces having a modified surface
The invention relates to a method for modifying piece surfaces consisting in bringing pieces into contact with at least one type of a modifying agent in such a way that the modification of the...
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7811389 |
Flux and process for hot dip galvanization
A flux for use in a hot dip galvanization process has an acidic component so that the flux has a pH of about 1.5 or less. The flux also includes an alkali metal chloride and a nonionic surfactant...
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7798389 |
Flux for soldering, soldering method, and printed circuit board
A flux for soldering used when soldering is performed to a board subjected to electroless nickel plating, the flux containing resin having film forming ability, activator, and solvent, and further...
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7780801 |
Flux composition and process for use thereof
The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent...
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7767032 |
No-clean low-residue solder paste for semiconductor device applications
A no-clean low residue solder paste is described for die-attach dispensing or fine pitch printing of semiconductor devices. The solder paste has a homogeneous consistency with no tendency to paste...
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7754105 |
Water-soluble preflux and usage of the same
It is an object to provide a water-soluble preflux containing a low-volatile solubilizing agent excellent in performance to dissolve an imidazole compound in water and capable of bringing out an...
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7749340 |
Technique for increasing the compliance of lead-free solders containing silver
A technique for technique for increasing the compliance of lead-free solders containing silver is disclosed. In one particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al all...
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7740713 |
Flux composition and techniques for use thereof
The present invention is directed to soldering techniques and compositions for use therein. In one aspect, a flux composition is provided. The flux composition comprises a fluxing agent comprising...
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7727339 |
Submerged arc flux
A highly basic particle flux for submerged arc welding that produces less than 7 ml/100 gr of diffusible hydrogen in the weld metal, which flux comprises a carbon dioxide containing compound with...
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7678203 |
Welding flux
A welding flux formulated for pipe welding or one-side welding applications including a gas releasing agent, a high melting compound and a low melting compound. The welding flux is particularly...
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7601228 |
Solder composition
A solder composition containing a lead-free SnZn alloy and a solder flux that contains at least an epoxy resin and an organic carboxylic acid. The organic carboxylic acid is dispersed in the solder...
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7572343 |
Composite metal matrix castings and solder compositions, and methods
A composite composition and methods for making the composition, providing a metal matrix and dispersed inorganic oxide particles with a bound organofunctional group on a surface of the particles...
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7569164 |
Solder precoating method
A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within...
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7534309 |
Aqueous aluminum brazing composition, aluminum material coated with the brazing composition, brazing method using the aluminum material, and automotive heat exchanger manufactured by using the brazing method
An aqueous aluminum brazing composition containing an organic binder and a zinc-based flux which prevents the precipitation of the zinc-based flux having a large specific gravity while securing an...
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7481353 |
Metal bonding method
A hydrocarbon compound mixed with an organic peroxide is placed between a copper electrode and a solder-coated electrode, and is heated at a temperature of about 300° C. The organic peroxide is ...
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7413805 |
Preparation of metallic particles for electrokinetic or electrostatic deposition
Metallic particles for electrokinetic or electrostatic deposition, and a method for making such particles, comprising metallic particle bodies, an organic acid film on the particle bodies, and a...
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7326367 |
Thick film conductor paste compositions for LTCC tape in microwave applications
This invention is related to thick film conductor compositions comprising electrically conductive gold powder, one or more glass frit or ceramic oxide compositions and an organic vehicle. It is...
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7303944 |
Microelectronic devices having underfill materials with improved fluxing agents
Microelectronic packages formed by using novel fluxing agents are disclosed. In one aspect, a microelectronic package may include a microelectronic device, a substrate, and an interconnect...
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7300528 |
Flux binder system
A welding flux that includes a flux agent and a binder. The binder includes a colloidal binder formed from small particles of silicon dioxide. The binder can be dried at lower temperatures to...
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7285173 |
Desoldering systems and processes
A process for recovering a solder contaminant from a substrate surface with a wick structure comprising a plurality of heat conductive metal strands and a desoldering flux comprising a mixture of a...
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7282174 |
Lead-free solder and soldered article
The present invention provides a Sn—Zn based lead-free solder which can prevent peeling of solder from soldered portions even after the passage of long periods after soldering of portions to be s...
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7244317 |
Dispensible brazing paste
A dispensable brazing paste useful in lamp manufacturing includes a brazing powder and a water soluble vehicle that has water, glycerin, a binder, and a dispersant that includes ammonium stearate...
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7214419 |
Conductive paste multilayered board including the conductive paste and process for producing the same
A conductive paste is provided, which has good conductivity and good adhesiveness to substrates and has good long-lasting stability of these properties, and which, when applied to a through-hole of...
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7147725 |
Colloidal silica binder system
A welding flux that includes a flux agent, water glass and colloidal compound formed from small particles of silicon dioxide. The welding flux has a very low hygroscopicity, thus is well suited...
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7143928 |
Flux and method for joining dissimiliar metals
Disclosed herein is a method for joining dissimilar metals without a need for a separate welding process. The method comprises applying a flux on a metal to be joined, inserting the metal into a...
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7108755 |
Simplification of ball attach method using super-saturated fine crystal flux
A method for preparing a metal surface (34) for a soldering operation is provided. In accordance with the method, the metal surface is treated with a solder flux (31) comprising a supersaturated...
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7070085 |
Water soluble protective paste for manufacturing printed circuit boards
An improved water soluble protective paste and a method for protecting metal circuits and pads on the surface of an electronic board during the manufacturing steps. A densifier is added to the...
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7059512 |
Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductor device
An object of the present invention is to provide solder bumps sufficiently satisfying the expected functions and having a small diameter which conventional methods cannot attain, a semiconductor...
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7052559 |
Welding flux for use in arc-welding of stainless steels, method of welding stainless steel members using the welding flux
A welding flux for use in welding stainless steel parts to increase welding penetration, consisting essentially a base material obtained from manganese peroxide (MnO2), and an activator selected...
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7052558 |
Solder paste flux composition
A soldering paste flux for use in soldering copper and copper alloy piping and the like is formed of 40–70% nonylphenol ethoxylate (preferably Tergitol NO-10® made by Dow Chemical), 10–30% glyc...
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7017795 |
Solder pastes for providing high elasticity, low rigidity solder joints
Solder pastes for providing high elasticity, low rigidity solder joints are disclosed. The solder pastes may be used between two parts having large mismatches in their coefficients of thermal...
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6936115 |
Soldering flux vehicle additive and fine pitch printing method
A lubricant additive which is a branched chain fatty alcohol or fatty acid containing a total of from 8 to 50 carbon atoms with a minimum of 4 carbon atoms being present in the shorter alkyl chain,...
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6915944 |
Soldering flux, solder paste and method of soldering
The present invention relates to a soldering flux, a soldering paste and a soldering method that achieve a sufficient degree of bonding strength even when components are mounted at a higher...
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6887319 |
Residue-free solder paste
A residue-free solder paste which leaves little or no flux residue after reflow soldering and which have good printability, storage stability, retainability of parts, and wettability, comprises a...
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6884389 |
Lead-free solder alloy and lead-free solder paste using the same
Disclosed is a lead-free solder alloy containing 43 to 47% by weight of bismuth, 0.5 to 2.5% by weight of silver, 0.25 to 0.75% by weight of copper, 0.25 to 0.75% by weight of indium, 0.02 to 0.09%...
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6880746 |
Fluorostannate-containing brazing or soldering fluxes and use thereof in brazing or soldering aluminum or aluminum alloys
Fluxing agents comprising potassium fluorostannate and/or cesium fluorostannate which can be used for brazing or soldering components of aluminum or of an aluminum alloy, even by solderless brazing...
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6881278 |
Flux for solder paste
A solder powder comprises solder particles having a distribution such that the number of particles having a particle diameter of 20 μm or less is 30% or less, wherein the oxygen content is 500 ppm ...
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6848609 |
Method of making finned tubes
In a method of making finned tubes as components of air-cooled systems or condensers, a sheet metal strip of aluminum is first shaped into a waved finned structure with plural fins in parallel...
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