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6458213 Method and device for automatic cleaning of opto-electronic sensor systems for substance analysis  
The invention concerns a method and device for automatic cleaning of opto-electronic measuring systems used in process-technology for the analysis of substances in liquids and gases by means of...
6454870 Chemical removal of a chromium oxide coating from an article  
A chromium oxide coating is removed from a surface of an article by cleaning the article in an alkaline degreasing/rust removal solution at a degreasing/rust removal temperature of from about 180°...
6455479 Stripping composition  
Disclosed are compositions and methods useful for the removal of polymeric material from substrates, such as electronic devices. The compositions and methods disclosed are particularly suitable for...
6454868 Permanganate desmear process for printed wiring boards  
A desmear process for removing resin smeared on an interior wall of a through hole drilled in a resinous substrate, especially resinous substrates made from epoxy, polyimide, cyanate ester resins...
6454869 Process of cleaning semiconductor processing, handling and manufacturing equipment  
A process of cleaning semiconductor processing, handling and manufacturing equipment in which such equipment is contacted with a cleaning effective amount of liquid or supercritical carbon dioxide.
6450181 Cleaning solution for electronic materials and method for using same  
A cleaning solution for electronic materials contains dissolved oxygen gas at a concentration greater than atmospheric saturation concentration, 0.1-10,000 mg/liter of ammonia, and 0.1-10,000...
6451124 Process for the chemical treatment of semiconductor wafers  
A process for the chemical treatment of semiconductor wafers in the presence of HF and then in the presence of ozone, in particular for the cleaning of silicon semiconductor wafers, is such that...
6451215 Method of producing magneto-resistive tunnel junction head  
The present invention relates to a method of producing a magneto-resistive tunnel junction head comprising a tunnel multilayered film having a tunnel barrier layer, a ferromagnetic free layer and a...
6444047 Method of cleaning a semiconductor substrate  
A method of cleaning a semiconductor substrate is disclosed. The method comprises setting a substrate to-be-treated substantially in parallel to ends of multi-nozzles including an inner tube nozzle...
6444255 Method for producing liquid crystal display and method for cleaning substrate  
An electrode substrate is brush cleaned with a hydrogen gas dissolved water, which has an oxidation-reduction potential of −860 mV to −400 mV and a pH of 8 to 12, before applying an alignment...
6436832 Method to reduce polish initiation time in a polish process  
High through-put CMP is achieved by the application of a cleaning composition on to an exposed surface of a metal layer prior to polishing the bulk metal layer. Embodiments of the present invention...
6431186 Method of cleaning electronic components  
A simple cleaning method which can remove metal, organic and fine particle contaminants on the surface of electronic components, and especially those on silicon bases, and also suppress an increase...
6431182 Plasma treatment for polymer removal after via etch  
A method and article of manufacture of a via in a semiconductor layered device. The method can include applying an OH/H containing plasma, such as H 2 O or O 2 or a forming gas, to a via which has...
6431183 Method for treating semiconductor substrates  
A system for treatment of semiconductor substrates is comprised of an ozone generating means ( 11 ) , an ejector ( 10 ) which dissolves ozone in a chemical solution or pure water to be used for...
6432218 Multi-step flow cleaning method and multi-step flow cleaning apparatus  
A multi-step flow cleaning method and a multi-step flow cleaning apparatus are provided which effectively clean workpieces with a stream of a cleaning solution and to suppress an increase of...
6430965 Process for producing glass substrate for information recording medium and process for producing recording medium using said glass substrate  
A process for producing a glass substrate for an information recording medium comprising: (a) polishing a principal surface of a glass substrate to provide a polished glass substrate; (b) washing...
6431184 Apparatus and method for washing substrate  
Disclosed is an apparatus for washing a substrate, comprising a spin chuck holding and rotating a substrate, a process solution supply mechanism having a solution discharge port through which a...
6432219 Method for separating layers from articles  
A method for separating layers from articles made of high-speed steel and having at least one layer of TiAlN, includes applying an alkaline solution containing hydrogen peroxide, a base as well as...
6428715 Method for producing sliders  
A method for producing sliders without alumina overcoat protrusion on the air bearing surface. The method comprises a method for removing alumina protrusion on the air bearing surface of a slider...
6428628 Paint-removing method, paint-removing device, and ship removed of paint  
A paint-removing method comprises the steps of putting dimethyl sulfoxide into a tank, raising the dimethyl sulfoxide at a temperature of approximately 35° C. to 189° C. in the tank; and soaking...
6428625 Process for pickling a metal using hydrogen peroxide  
In the invention pickling process, steel and nickel or chromium alloys are pickled with an acidic pickling solution employing an oxidant, particularly hydrogen peroxide, and in which liquor is...
6427703 Method and apparatus for removing carbon contamination in a sub-atmospheric charged particle beam lithography system  
A cleaning system for use with a micro-column array, electron beam lithography system is described. The cleaning system includes an oxidizer source and an oxidizer distribution mechanism that...
6425956 Process for removing chemical mechanical polishing residual slurry  
A process of removing residual slurry resulting from chemical mechanical polishing of a workpiece in which the workpiece is contacted with a composition of a supercritical fluid, said supercritical...
6425929 Metal cleaner-polish  
A metal cleaner-polish in the form of a substantially homogeneous liquid slurry containing aliphatic hydrocarbons, finely divided abrasive, and isopropanol as a stabilizer/solvent.
6425955 Process for avoiding foaming during cleaning of metal salts of intermediate length carboxylic acids from surfaces  
Aqueous alkaline cleaning solutions are used to remove metal intermediate length carboxylate salts from a solid substrate. Foaming of the aqueous alkaline cleaning solution can be adequately...
6423675 Cleaning-in-place composition and method for using the same  
A composition for a cleaning-in-place system is described. The composition has a halogen dioxide and a optionally hydroxide and does not require the use of a detergent to display excellent cleaning...
6423146 Method for cleaning a semiconductor substrate  
In a method for cleaning a semiconductor substrate, ozone water is supplied to a cleaning chamber, which contains the substrate, thereby to oxidize the surface thereof, and thus form a thin oxide...
6423147 Method of cleaning a wafer  
A method of removing small particles remaining on a surface of a semiconductor wafer and preventing a silicide layer covering the semiconductor wafer from corroding starts by controlling a...
6422246 Method removing residual photoresist  
A method for removing residual color photoresist material from a substrate after photoresist development. The method washes the substrate with a high-pressure jet of de-ionized water that contains...
6419754 Endpoint detection and novel chemicals in copper stripping  
An endpoint detection system for copper stripping using a colorimetric analysis of the change in concentration of a component is described. Wet copper stripping chemicals are used to strip copper...
6419757 Method for cleaning sintered silicon carbide in wet condition  
A sintered silicon carbide has a high density and only small amounts of organic and inorganic impurities on the surface and in the vicinity of the surface, i.e., a density of 2.9 g/cm 2 or more...
6419755 Chemical delacquering process  
A chemical delacquering composition, process and system for delacquering substrates such as aluminum scrap in which an aqueous solution containing at least one short-chain organic acid, preferably...
6416589 Carbon-enhanced fluoride ion cleaning  
A method and system for cleaning a metal article. The system is used to employ a method that comprises placing the article in a means defining a chamber; subjecting the article to a gaseous...
6416586 Cleaning method  
The present invention has as an object thereof to provide a cleaning method which realizes, in the cleaning process, (1) a reduction in the number of processes, (2) a simplification of the cleaning...
6417147 Cleaning agent composition, method for cleaning and use thereof  
An object of the present invention is to provide a new cleaning agent composition having excellent cleaning power for the surface contamination of a semiconductor wafer or various precisely worked...
6416587 Apparatus and method for cleaning wafer  
A wafer cleaning apparatus includes a rinsing container in which wafers to be cleaned are positioned and four sets of nozzles arranged in the rinsing container to be symmetric with respect to each...
6409891 Low energy plasma cleaning method for cryofilms  
Cryofilm/organic contaminants are removed from cryogenically cooled surfaces such as spacecraft cryo-telescope mirrors by sputtering and chemical reaction with a low energy plasma having an average...
6406550 Apparatus and method for sequential removal of oxides from steel  
Oxides on the surfaces of metal are reduced by directing reducing gases at them in a forceful and turbulent manner. In a preferred version, the gas is passed through at least two reducing zones...
6402851 Lanthanide oxide dissolution from glass surface  
A method and product for computer disk drives. Glass substrates are provided having low content of residual polishing particles on the surfaces thereof. An exemplary method includes reduction of...
6402852 Apparatus and method for continuous removal of oxides from metal  
Oxides on the surfaces of metal are reduced by directing reducing gases at them in a forceful and turbulent manner in an enclosure. The oxide-bearing surface is heated to at least 900 degrees F.
6398875 Process of drying semiconductor wafers using liquid or supercritical carbon dioxide  
A process of drying a semiconductor wafer which includes at least one microelectric structure disposed thereon which includes contacting a water-containing thin film-covered semiconductor wafer...
6398874 Use of alkoxy N-hydroxyalkyl alkanamide as resist removing agent, composition for removing resist, method for preparing the same and resist removing method using the same  
A resist removing agent and a resist removing composition, having an excellent capability for removing a resist and polymer and which does not attack underlying layers, a method for preparing the...
6399022 Simplified ozonator for a semiconductor wafer cleaner  
The invention provides water enriched with ozone by generating ozone from oxygen using short-wavelength ultraviolet light and pumping the generated ozone under pressure through a 0.1-micron filter...
6398876 Process for pickling steel  
Stainless steel is pickled by a chemical and/or electrochemical pickling process using an acid liquid, containing substantially no nitric acid. The process uses a spent electrolyte solution from an...
6395097 Method and apparatus for cleaning and removing flux from an electronic component package  
The present invention is a method for cleaning the cavities in electronic components by providing a semiconductor component having an outside surface and a cavity therein. The component including...
6394107 Use of fluorinated ketones as wet cleaning agents for vapor reactors and vapor reactor components  
A method for cleaning a vapor reactor by applying a liquid cleaning agent comprising a fluorinated ketone having about 5 to about 10 carbon atoms and up to two hydrogen atoms is described. The...
6395101 Single semiconductor wafer processor  
In a method of processing or drying a semiconductor wafer, the wafer is withdrawn from a fluid bath at an inclined angle, and at a selected withdrawal speed. A solvent vapor is provided at the...
6391117 Method of washing substrate with UV radiation and ultrasonic cleaning  
Dirt, particularly of inorganic matter, attached to a substrate, such as a glass substrate for liquid crystal devices, is effectively removed by irradiating the substrate with ultraviolet rays...
6392417 Arrangement and method for detecting the end of life of an aqueous bath utilized in semiconductor processing  
Arrangement and method for detecting the end of life of an aqueous bath utilized in semiconductor processing, the bath containing water, an amount of hydrogen peroxide and an amount of a...
6391118 Method for removing particles from surface of article  
A method and an apparatus for removing particles from a surface of an article, such as a semiconductor wafer in a clean room. The particles are supplied with an electric charge. Subsequently, an...