|
Match
|
Document |
Document Title |
|
|
7641808 |
Azeotropic compositions comprising fluorinated olefins for cleaning applications
The present invention relates to azeotropic or azeotrope-like compositions comprising a fluorinated olefin having the formula E- or Z-C 3 F 7 CH═CHC 3 F 7 , and at least one alcohol, halocarbon,...
|
|
|
7638004 |
Method for cleaning microwave applicator tube
A method of cleaning a microwave plasma applicator tube as described herein includes preparing a microwave plasma applicator for cleaning. A general cleaning of the plasma applicator tube is...
|
|
|
7637270 |
Method of washing a polished object
An abrasive includes abrasive grains, a solvent, and an additive. MnO 2 , Mn 2 O 3 , Mn 3 O 4 , MnO or a mixture thereof as the abrasive grains, H 2 O 2 as the solvent, and HNO 3 , an organic...
|
|
|
7637269 |
Low damage method for ashing a substrate using CO2/CO-based process
A method for removing a mask layer and reducing damage to a patterned dielectric layer is described. The method comprises disposing a substrate in a plasma processing system, wherein the substrate...
|
|
|
7635670 |
Chromium-free etching solution for si-substrates and uses therefor
The present invention relates to a novel etching solution suitable for characterizing defects on semiconductor surfaces, including silicon germanium surfaces, as well as a method for treating...
|
|
|
7632357 |
Silicon wafer cleaning method
A silicon wafer cleaning method, comprising a first cleaning process, in which, after completion of mirror polishing of the surface, the silicon wafer is immersed in a non-ionic surfactant aqueous...
|
|
|
7624742 |
Method for removing aluminum fluoride contamination from aluminum-containing surfaces of semiconductor process equipment
Described are methods of removing aluminum fluoride contaminants from aluminum, anodized aluminum, and sprayed ceramic surfaces. Hydrofluoric acid, long known to be effective at removing certain...
|
|
|
7621281 |
Cleaning solution for cleaning substrate for semiconductor devices and cleaning method using the same
A cleaning solution for cleaning a substrate for semiconductor devices and a cleaning method using the said cleaning solution, which comprises at least the following components (A), (B) and (C):
...
|
|
|
7622244 |
Method for contaminant removal
Method for removing contaminants from a surface during semiconductor fabrication. A preferred embodiment comprises developing a resist layer on a top surface of a semiconductor substrate, curing...
|
|
|
7615163 |
Film formation apparatus and method of using the same
A method of using a film formation apparatus for a semiconductor process includes processing by a cleaning gas a by-product film deposited on an inner surface of a reaction chamber of the film...
|
|
|
7614406 |
Method of cleaning substrates utilizing megasonic energy
A method of cleaning a substrate without causing damage to the substrate is provided. The method comprises the steps of providing a transmitter made of a material that is a good conductor of...
|
|
|
7605113 |
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
A semiconductor wafer cleaning formulation, including 1-35% wt. fluoride source, 20-60% wt. organic amine(s), 0.1-40% wt. nitrogenous component, e.g., a nitrogen-containing carboxylic acid or an...
|
|
|
7604011 |
Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluid
An apparatus and a method is provided for using high-frequency acoustic energy with a supercritical fluid to perform a semiconductor wafer (“wafer”) cleaning process. High-frequency acoustic...
|
|
|
7598181 |
Process for enhancing solubility and reaction rates in supercritical fluids
Processes for enhancing solubility and the reaction rates in supercritical fluids are provided. In preferred embodiments, such processes provide for the uniform and precise deposition of...
|
|
|
7598654 |
Megasonic processing apparatus with frequency sweeping of thickness mode transducers
A megasonic processing apparatus and method has one or more piezoelectric transducers operating in thickness mode at fundamental resonant frequencies of at least 300 KHz. A generator powers the...
|
|
|
7591270 |
Process solutions containing surfactants
Process solutions comprising one or more surfactants are used to reduce the number of pattern collapse defects on a plurality of photoresist coated substrates during the manufacture of...
|
|
|
7583196 |
Method and system for detecting a body in a zone located proximate an interface
The invention concerns a method and a system for detecting a body ( 801 ) in a zone ( 802 ) located proximate an interface ( 803 ). The body is illuminated by an electromagnetic radiation ( 804 )...
|
|
|
7582168 |
Method and apparatus for cleaning semiconductor wafer
A wafer is placed on a rotatable stage to clean an upper surface of the wafer with a cleaning liquid while the stage and wafer are rotating. A cup-shaped cover is provided over the upper surface of...
|
|
|
7578302 |
Megasonic cleaning using supersaturated solution
A method and system for the megasonic cleaning of one or more substrates that reduces damage to the substrate(s) resulting from the megasonic energy. The substrates are supported in a process...
|
|
|
7578886 |
Substrate processing apparatus, substrate processing method, and substrate holding apparatus
A substrate processing apparatus and a substrate processing method is provided for performing a chemical liquid process, a cleaning process, a drying process, or the like while rotating a substrate...
|
|
|
7579309 |
Methods for characterizing defects on silicon surfaces and etching composition and treatment process therefor
The present invention relates to a method for characterizing defects on silicon surfaces, such as silicon wafers, a method for treating silicon surfaces with an etching solution, and an etching...
|
|
|
7579253 |
Method for cleaning a semiconductor wafer
Bottom electrodes of stacked capacitor DRAM cells are formed by depositing a metal layer on the side walls of trenches within a hard mask layer, which serves as a mold for the bottom electrode...
|
|
|
7578890 |
Method for removing contaminants from silicon wafer surface
Taught is a method of removal surface contaminants, including organic contaminants, metal ions and solid particles, from silicon wafer surface comprising the following steps: (a) submerging the...
|
|
|
7579307 |
Cleaner for semiconductor devices
The invention has for its object the provision of a cleaner capable of removing particles and metal impurities present on the surface of a wafer without corrosion of wirings, gates or the like yet...
|
|
|
7575007 |
Chamber recovery after opening barrier over copper
A chamber dry cleaning process particularly useful after a dielectric plasma etch process which exposes an underlying copper metallization. After the dielectric etch process, the production wafer...
|
|
|
7576046 |
Cleaning liquid for lithography and method of cleaning therewith
A cleaning liquid for lithography that exhibits equally excellent cleaning performance for resists of a wide variety of compositions, such as various resists for i-line, KrF and ArF, silicic resist...
|
|
|
7571732 |
Ignition control of remote plasma unit
A method of maintaining a remote plasma unit for cleaning a semiconductor-processing apparatus includes: (i) detecting if the semiconductor-processing apparatus is in an idle state; (ii) if the...
|
|
|
7568489 |
Method of and apparatus for eluting impurities
Impurities can be eluted simultaneously from a plurality of local areas of a surface layer of a semiconductor substrate. A supporting unit supports the substrate, and a sample plate is disposed on...
|
|
|
7569111 |
Method of cleaning deposition chamber
A process for cleaning a deposition chamber. The process includes feeding a fluorine-containing gas into the deposition chamber; maintaining the fluorine-containing gas in the deposition chamber at...
|
|
|
7566370 |
Wafer clamping apparatus and method for operating the same
A wafer clamping apparatus is provided to secure a wafer within a chamber during wafer processing. The wafer clamping apparatus creates a pressure differential between a top surface and a bottom...
|
|
|
7562662 |
Cleaning solution and cleaning method of a semiconductor device
A cleaning method for removing foreign bodies during the fabrication of semiconductor devices including treating a substrate with a cleaning solution including an oxidizer to form a chemical oxide...
|
|
|
7563754 |
Composition for removing photoresist residue and polymer residue
A composition for removing a photoresist residue and a polymer residue remaining on a semiconductor substrate after dry etching and after ashing is provided, the composition containing at least one...
|
|
|
7563753 |
Cleaning solution for removing photoresist
Cleaning solutions for removing photoresist resins and a method of forming patterns using the same are disclosed. The cleaning solution includes water (H 2 O) as main component, one or more...
|
|
|
7556697 |
System and method for carrying out liquid and subsequent drying treatments on one or more wafers
Systems for processing microelectronic substrates in a process chamber that incorporate improved technology for transitioning from a wet process to a dry process (especially transitioning from...
|
|
|
7556048 |
In-situ removal of surface impurities prior to arsenic-doped polysilicon deposition in the fabrication of a heterojunction bipolar transistor
A process for cleaning the silicon surface of a semiconductor device material layer. The surface undergoes a pre-clean process followed by exposure to a nitrogen-containing gas. A polysilicon layer...
|
|
|
7547669 |
Remover compositions for dual damascene system
A new remover chemistry based on a choline compound, such as choline hydroxide, is provided in order to address problems related to removal of residues, modified photoresists, photoresists, and...
|
|
|
7543593 |
Substrate processing apparatus
A substrate processing apparatus is provided. The apparatus includes a plurality of fluid suppliers 61, 61, 63 for supplying different processing fluids. In processing a wafer W, the substrate...
|
|
|
7543592 |
Compositions and processes for photoresist stripping and residue removal in wafer level packaging
Improved compositions and processes for removing photoresists, polymers, post etch residues, and post oxygen ashing residues from interconnect, wafer level packaging, and printed circuit board...
|
|
|
7544622 |
Passivation for cleaning a material
A contact is defined by an opening etched into borophosphosilicate glass (BPSG) down to a silicon substrate. In a contact cleaning process designed to remove native oxide at the bottom of the...
|
|
|
7541322 |
Cleaning solution for substrate for semiconductor device and cleaning method
To provide a cleaning solution for a substrate for a semiconductor device capable of removing particle contamination, organic contamination and metal contamination at the same time without...
|
|
|
7534753 |
pH buffered aqueous cleaning composition and method for removing photoresist residue
A residue cleaning composition includes: (a) water; (b) a fluoride; (c) a pH buffer system including an organic acid and a base. The organic acid can be an aminoalkylsulfonic acid and/or an...
|
|
|
7534469 |
Semiconductor-processing apparatus provided with self-cleaning device
A CVD apparatus comprising an optical unit detecting the mass of contaminants adhering to an inner surface of a CVD reactor by irradiating an inner surface of the reactor with light having...
|
|
|
7531492 |
Composition for the removal of sidewall residues
A composition for the production of semiconductors, comprising H2SiF6 and/or HBF4 in a total amount of 10-500 mg/kg, 1-17 % by weight of H2S04, 1-15% by weight of H202, optionally in combination...
|
|
|
7531047 |
Method of removing residue from a substrate after a DRIE process
The present disclosure provides a method of cleaning a semiconductor substrate after a DRIE etch process, wherein residue from the DRIE process is removed without damaging the substrate. The...
|
|
|
7531059 |
Cleaning of semiconductor wafers by contaminate encapsulation
An apparatus and method are provided for removing contaminate particulate matter from substrate surfaces such as semiconductor wafers. The method and apparatus use a material, preferably a liquid...
|
|
|
7527695 |
Apparatus and method for cleaning substrate
To provide a method and apparatus for cleaning a substrate to effectively remove an organic type or metallic type contaminant from a to-be-cleaned surface of a substrate by an increase in the...
|
|
|
7521406 |
Microelectronic cleaning composition containing halogen oxygen acids, salts and derivatives thereof
Microelectronic cleaning compositions for cleaning microelectronic substrates, and particularly cleaning compositions useful with and having improved compatibility with microelectronic substrates...
|
|
|
7521374 |
Method and apparatus for cleaning semiconductor substrates
According to one aspect of the present invention, a method and apparatus for cleaning a semiconductor substrate is provided. The method may include supporting a semiconductor substrate, the...
|
|
|
7521407 |
Remover composition
A remover composition used for cleaning of a semiconductor substrate or semiconductor element, wherein (1) the remover composition contains 65% by weight or more of water; (2) the remover...
|
|
|
7517430 |
Method and apparatus for the controlled formation of cavitation bubbles
The present invention discloses a method and apparatus for the directed formation of a re-entrant micro-jet formed upon the collapse of a cavitation bubble formed proximate to a work surface placed...
|