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7591712 |
Method of producing silicon blocks and silicon wafers
A method of producing silicon blocks by cutting a silicon ingot is provided. The method uses a silicon ingot cutting slurry containing abrasive grains and an alkaline substance so as to provide the...
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7503831 |
System and method for cutting soluble scintillator material
A system and method for cutting soluble scintillator material are disclosed. The system includes a scintillator cutting apparatus including a filament rotated around a plurality of pulleys in at...
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7461648 |
Abrasive wire sawing
Apparatus for forming a multiplicity of thin wafers from at least two similar blocks, the apparatus comprising a supply reel ( 1 ) to supply wire, an upper pair ( 3 a , 3 b ) and a lower pair ( 3 c...
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7431028 |
Apparatus and method for slicing an ingot
A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving...
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7387118 |
Wire saw
The invention provides a wire saw in which wire tension fluctuations occurring in swinging of a row of wires can be accommodated to thereby increase a velocity of the wire and to carry out cutting...
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7373935 |
Carbide wire blade
This invention relates to a carbide wire blade that is suitable for use in sawing through subsea structures. The carbide wire blade employs a tungsten carbide cutter, a vibration dampening member,...
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7306508 |
Multi-wire saw
A multi-wire saw according to the present invention cuts a workpiece while supplying a slurry containing an alkali or mixed acid to a cutting interface between the workpiece and a wire, and...
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7195542 |
Process, apparatus and slurry for wire sawing
A wire saw ( 1; 100 ) for cutting a workpiece includes a device ( 21, 22, 24, 27 ) for setting, controlling and/or maintaining a predetermined or desired water content in at least part of the...
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7114424 |
Wire sawing device
A sawing device includes a holding device ( 22 ) arranged so as to hold in the course of wire sawing the different sawed slices ( 23 ) substantially parallel and such that the width of the sawing...
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7082940 |
Wire sawing apparatus and wire sawing method
A wire sawing apparatus includes a wire, a wire feed roller, and two basic rollers. The three rollers have the same diameter and are arranged in such a manner that their axes of rotation are in...
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7055516 |
Stone slicer
A stone slicer of slicing rough stone into stone plates having a predetermined thickness, which can improve productivity by reducing consumption of the rough stone by minimizing the thickness of a...
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7025665 |
Method and apparatus for cutting ultra thin silicon wafers
A wire saw and wafer stabilizing system are provided for holding wafer sections invariantly against vibration and unwanted movement during the sawing process. A stabilizing means is applied to the...
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6994756 |
Method of producing sintered rare earth magnetic alloy wafer
A method of producing a sintered rare earth magnetic alloy wafer comprises a step of using a cutter to slice a wafer of a thickness of not greater than 3 mm from a sintered rare earth magnetic...
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6981495 |
Wire sawing process and device
In the sawing process and device according to the invention, the pieces to be sawed are mounted on at least one support table and caused to bear against a layer of wires. Inclination structure in...
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6941940 |
Wire saw and process for slicing multiple semiconductor ingots
A wire saw ( 10 ) for simultaneously slicing multiple, generally cylindrical monocrystalline ingots ( 14 ) into wafers. The wire saw includes a cutting head ( 16 ), an ingot support ( 12 ), and...
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6923171 |
Device and method for determining the orientation of a crystallographic plane in relation to a crystal surface and device for cutting a single crystal in a cutting machine
An apparatus and a method for determining the orientation of a crystallographic plane (100) relative to a crystal surface ( 2 ) are provided, in which the orientation is free from errors of...
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6920871 |
Cable saw
The invention relates to a cable saw device ( 1 ) comprising a sawing cable ( 25 ) and a cable storage device ( 30 ) which is used for temporary accommodation of the sawing cable ( 25 ). The cable...
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6889684 |
Apparatus, system and method for cutting a crystal ingot
The apparatus, system and method for cutting crystal ingot provide techniques for cutting an ingot into wafers with a wire cutting apparatus utilizing wire with a diameter of less than 0.18 mm,...
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6881131 |
Method and apparatus for diamond wire cutting of metal structures
A method and apparatus for diamond wire cutting of metal structures, such as nuclear reactor vessels, is provided. A diamond wire saw having a plurality of diamond beads with beveled or chamfered...
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6832606 |
Wire saw and cutting method thereof
When a work W is cut by moving a wire in an axial direction thereof while the wire is pressed onto the work and an abrasive liquid which is made by dispersing abrasive grains in a dispersion medium...
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6817925 |
Multistage fine hole machining method and device
A multistage fine-hole machining device has lap stations for lapping an inner surface defining a through-hole of a workpiece. Each of the lap stations has a passing unit for passing wire through...
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6773333 |
Method for cutting slices from a workpiece
A method for cutting up a workpiece which is in rod or block form by means of a saw, wherein the temperature of the workpiece is measured during the cutting, and the measurement signal is...
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6763823 |
Machining method not causing any damage to major cut surfaces of cut objects
An ingot is placed below parallel wires of a multiwire saw, and the wires are driven to run. The ingot is moved upward and cut by the wires to obtain wafers. The wires are displaced toward one side...
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6742424 |
Cutting apparatus for ceramic green bodies
An apparatus for cutting green ceramic bodies, includes a traveling path for green ceramic bodies, beds for supporting green ceramic bodies at constant intervals in series along the traveling path,...
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6652356 |
Wire saw and cutting method
There is provided a cutting method comprising winding a wire around plural grooved rollers, and pressing the wire against the work with running it, to cut the work, wherein the work is cut with...
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6640796 |
Method for separating slices from a hard brittle workpiece, and wire saw for carrying out the method
A method for separating slices from a hard brittle workpiece involves subjecting the workpiece to an advancing movement and pressing it onto wires of a wire web of a wire saw, the wires being under...
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6615817 |
Recycling system of wire saw abrasive grain slurry and centrifugal separators therefor
A constitution comprises separated processing of an abrasive grain waste liquid into recycled abrasive grain and a fine abrasive grain mixed liquid in a first centrifugal separator, adding a fresh...
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6598597 |
Method for cutting blocks of stone and frame cutting machine for carrying out said method
The invention refers to a method for cutting blocks of stone ( 12 ), by means of a gangsaw ( 1 ) provided with diamond sector blades ( 35 ), comprising, besides a reciprocal approaching movement...
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6568384 |
Semiconductor material cutting and processing method
The present invention is a cutting and processing method for cutting semiconductor materials such as silicon ingots, or machining grooves therein, using a wire saw, a purpose whereof is to obtain a...
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6554686 |
Sawing wire and method for the cutting and lapping of hard brittle workpieces
A sawing wire is for the simultaneous cutting and lapping of a multiplicity of wafers from a hard brittle workpiece. The sawing wire exhibits torsion. There is also a method for cutting and lapping...
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6543434 |
Device for simultaneously separating a multiplicity of wafers from a workpiece
A device for simultaneously separating a multiplicity of wafers from a hard brittle workpiece having a longitudinal axis, with a wire web made from saw wire and with an advancing device which...
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6539932 |
Apparatus and method for cutting ingots
A thin strip-shaped grindstone 12 is held flat under tension and moved backwards and forwards in the longitudinal direction, while the grindstone is moved in a direction perpendicular to a...
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6520061 |
Cutting apparatus for ceramic green bodies
An apparatus for cutting green ceramic bodies, includes a traveling path for green ceramic bodies, beds for supporting green ceramic bodies at constant intervals in series along the traveling path,...
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6513513 |
Saw-cable guide with two swivelling cable guide rolls
A saw cable guide ( 1 ) is provided with a stand ( 2 ) and at least two rotatable cable guide rollers ( 5, 9 ) mounted pivotably thereon. These are arranged with their pivot axes ( 8, 12 ) forming...
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6513514 |
Wire saw for cutting up stone blocks into slabs with tension adjustment of individual saw wires
A machine for cutting slabs from a block of stone-like material includes: a fixed support structure; at least two rollers mounted for rotation about their axes at opposite ends of the frame and...
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6505394 |
Method for cutting rare earth alloy, method for manufacturing rare earth alloy plates and method for manufacturing rare earth alloy magnets using wire saw, and voice coil motor
A method for cutting a rare earth alloy according to the present invention includes the steps of: a) supplying slurry containing abrasive grains onto a wire; and b) machining the rare earth alloy...
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6463922 |
Wedge intended to be inserted in a cutting slot
A wedge ( 6, 6 ′) intended to be inserted into a cutting slot is made in two parts ( 41, 42 ), the two parts ( 41, 42 ) comprising means ( 3 ) which allow them to slide one over the other, so as...
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6443143 |
Method and apparatus for cutting rare earth alloy
A method for cutting a rare earth alloy of the invention using a wire having abrasive grains stuck thereon is disclosed. The method includes the step of cutting the rare earth alloy while supplying...
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6418921 |
Method and apparatus for cutting workpieces
A cutting machine has a blade mounted for reciprocating movement. A workpiece is rotated while the blade is reciprocated, and then the workpiece is rotated through smaller angles to complete the...
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6408839 |
Wire sawing device for cutting fine slices using angular crossing of at least two sawing yarn layers
The invention concerns a wire sawing device comprising at least a support table ( 35 ) bearing a piece to be sawed ( 34 ) urged against the set of wires layer ( 26, 27 ) two outer wire-guide rolls...
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6390896 |
Method and device for cutting a multiplicity of disks from a hard brittle workpiece
A method for cutting a multiplicity of disks from a hard brittle workpiece is by moving the workpiece at a defined feed rate through a wire web of a wire saw. In the method, the wire web is formed...
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6367467 |
Holding unit for semiconductor wafer sawing
A holding unit is provided to support an ingot in a semiconductor wafer sawing machine, which minimizes the instability of a blade during a sawing process. The holding unit is formed from...
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6352071 |
Apparatus and method for reducing bow and warp in silicon wafers sliced by a wire saw
A wire saw slicing apparatus capable of slicing a cylindrical workpiece into wafers having a flat shape with reduced bow and warp. The slicing apparatus includes a layer of parallel wires moving...
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6295977 |
Method and device for simultaneously cutting off a multiplicity of wafers from a workpiece
A method is for simultaneously cutting off a multiplicity of wafers from a hard, brittle workpiece which has a longitudinal axis and a peripheral surface. The workpiece is guided, by means of a...
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6279564 |
Rocking apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
An apparatus for cutting a substantially cylindrical work piece in a direction generally perpendicular to a longitudinal axis of the work piece includes a wire having a plurality of cutting...
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6261166 |
Wire cleaning apparatus
A newly proposed wire cleaning apparatus used for removing slurry from a wire, which reciprocatively travels between a slicing chamber and a wiring chamber. The wire cleaning apparatus has a couple...
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6237585 |
Wire-sawing machine
An ingot 9 is sliced to wafers by a wire 5 which travels around grooved rollers 1 to 3. A tension applied to the wire 5 is detected by tension sensors 21, while vertical displacement of dancer...
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6234160 |
Abnormality transmission system for wire saw
If something goes wrong with a wire saw, a personal computer outputs a dial signal to a modem, which dials a calling number of a pager carried by an operator through a telephone system. The sound...
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6234159 |
Wire saw and process for cutting off shaped articles
A wire saw for cutting shaped articles from a workpiece, having at least two wire webs made from sawing wire, which are used for cutting off the shaped articles and which lie one above the other at...
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6178962 |
Saw wire assembly, cutting method utilizing the same, and system therefor
A cutting system by which a material to be worked is cut off by the use of each of abrasive grain-bonded saw wires contained in a saw wire assembly prepared by arranging the abrasive grain-bonded...
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