Matches 351 - 400 out of 477 < 1 2 3 4 5 6 7 8 9 10 >
Match Document Document Title
4754276 System to display sawblade angle and height  
An apparatus for determining the angle and height of a rotary power saw blade by sensing the angle of the saw blade from the vertical and the sine of the angle with respect to a horizontal...
4712535 Method and apparatus for severing wafers  
A method and an apparatus for severing a workpiece into wafer slices, wherein the inclined surface to be cut can be processed to remove protrusions or impressions which occur around the cut...
4711055 Displaceable protective cover for handtools provided with rotatable disc-shaped tools  
The invention relates to a displaceable protective cover for handtools using rotary, disc-shaped tools. The protective cover comprises two halves (7,8) which completely enclose the tool (3) when in...
4711014 Method for handling semiconductor die and the like  
Method for handling semiconductor chips and the like objects are disclosed which include the use of a flat flexible film that is supported on a flat porous texturized fabric sheet such as a woven...
4705016 Precision device for reducing errors attributed to temperature change reduced  
A precision device including a holding mechanism for holding an object and a supporting mechanism for supporting an operating element, one of which is movable in a predetermined direction. The...
4688540 Semiconductor wafer dicing machine  
A dicing machine for cutting a semiconductor wafer along cutting lines arranged in a lattice pattern. The dicing machine comprises a cutting station, at least one alignment station, a cutting means...
4685214 Protective guard unit for metal working tool  
A hand held cutting tool is disclosed for use in cutting articles, especially when the tool is to be used in confined quarters while protecting the operator from being cut by the tool. The tool...
4667650 Mounting beam for preparing wafers  
A self-dressing mounting beam for slicing wafers from ingots of various materials, especially semiconductors, is described. The mounting beam is a composite material comprising an organic polymer,...
4620525 Soundproof sheath for the protection of sawing circular blades used for cutting marble, granite and hard stone  
A sheath for deadening the sound of at least one circular blade for cutting marble, granite and hard stone consists of at least one structure of "Bakelite" or other sound deadening material, the...
4619081 Combined nozzle with air foil  
A combined nozzle and air foil for providing a flow of cooling and cleaning fluid to a rotating cutting blade providing cutting of a substrate. A nozzle portion for location intermediate the...
4570609 Water-cooled hub for flush-cut concrete saws  
This invention relates to an improved hub for diamond-edged concrete saws and, more particularly, to a hub or mandrel of the so-called "flush" type which mounts the saw blade such that the latter...
4569326 Dicing apparatus  
A dicing apparatus for cutting a semiconductor wafer into a plurality of a microelectronic circuit dice each having bonding pads which are located adjacent a cutting path on the wafer. The...
4564000 Precision cutting of millimeter wave ferrite materials  
Ferrite material to be used in millimeter wavelength apparatus is sawed ug a resin bonded diamond sawblade. A cutting speed of 5400 cm/sec is achieved by appropriate selection of sawblade diameter...
4558686 Machining device equipped with blade inspecting means  
A machining device equipped with a rotating machining tool having a blade. A blade inspecting means is provided in the machining device. The blade inspecting means comprises an emission means for...
4557599 Calibration and alignment target plate  
A target plate is provided in the operating field of view of a microscopic operating system having a plurality of target patterns thereon. These target patterns include scaled rulings, to which an...
4498845 Pumper bumper  
Method and apparatus by which a malfunctioning downhole pump of the reciprocatory type can be rendered operative by bumping the pump piston against structure associated with the pump barrel. The...
4484417 Sawing apparatus  
A housing supports a rotatable saw blade with a portion of the blade projecting below the housing for contacting material to be cut. Two sets of nozzles are provided on the housing for directing a...
4475527 Ingot slicing machine and method  
An improvement in a method for simultaneously slicing one or a multiplicity of boules of silicon into silicon wafers, the improvement of which comprises forming a plurality of vertical stacks of...
4445494 Apparatus for supporting crystalline wafers  
A process and apparatus for supporting crystalline wafers utilizing the sion effect of flowing gas on the crystalline wafers. An almost point-like support of the crystalline wafer is achieved....
4436078 Apparatus for cutting stone panels  
Apparatus for cutting thin laminae of stone, e.g. marble, comprising a saw having two disc blades, a bogie movable beneath the saw and having a pair of vacuum-operated slab-gripping devices each of...
4424649 Abrasive cutter  
An abrasive cutter for cutting metallurgical samples and the like including a motor-driven rotatable abrasive cutter wheel, a vise assembly for holding a workpiece to be cut, and a manually...
4407262 Wafer dicing apparatus  
Installation for the sawing of wafers of semiconductor material encompassing an alignment station (1), a sawing station (9), and a cleaning station (7). A handling device, provided to convey the...
4406274 Sound arrester of circular blade  
A sound arrester of a circular blade which is able to be rotated around an axis substantially disposed horizontally for cutting stone or the like is provided. The sound arrester includes a cover...
4350552 Method and apparatus for cutting stone panels  
The invention relates to a method of cutting thin laminae of stone, e.g. marble, which comprises bonding a backing layer to the opposed faces of a slab of stone, supporting the slab with backing...
4328553 Method and apparatus for targetless wafer alignment  
A method and apparatus for targetless X, Y and θ alignment of a semiconductor wafer having thereon a large number of identical microcircuits or dies that are arranged in a pattern to form rows and...
4327703 Method of preparing concrete column for attachment to beam  
A method of preparing the upper end of a concrete column containing elongated reinforcing elements for connection to a cast-in-place beam supported by the column. The method comprises the steps of...
4323049 Quartz wafering machine  
A machine for wafering bars of quartz or other minerals wherein a plurality of wafers can be manufactured by a simultaneous pass of the machine is provided. The structure comprises a framework, an...
4315494 Masonary saw jig  
The present invention relates to a mitre guide jig adapted for use with a masonary saw. The jig comprises a body portion and an end portion to which the body portion is adjustably secured. The body...
4253280 Method of labelling directional characteristics of an article having two opposite major surfaces  
In the production of varistors, diode chips are cut from a p-n sheet-diffused semiconductor wafer. Instead of having conventional rectangular shapes, the chips have a rhomboidal shape. This makes...
4243011 Dust shroud for pipe-cutting portable circular saw  
A dust shroud is disclosed for a pipe-cutting portable circular saw. The shroud comprises upper and lower blade housings which are nested and guided so that the lower housing can be moved into and...
4236356 Cutting saw and concrete groover  
An apparatus for cutting material or grooving concrete has a housing including a curved top for partially accommodating one or more circular saw blades. The housing has a bottom having an opening...
4227348 Method of slicing a wafer  
The quality of the as-sawn surfaces of a wafer is improved by preventing the saw blade from striking the wafer surfaces during the blade return stroke by leaning the just-sawn wafer away from the...
4217689 Process for preparing semiconductor devices  
A process for preparing semiconductor devices by forming an insulation coating, such as a low melting point glass, on the surface of a semiconductor substrate and then forming a shaved groove...
4210184 Circular resaw apparatus and method  
A resaw apparatus and method for rapidly and accurately cutting elongate wood cants longitudinally. A thin-kerfed circular saw blade is utilized to cut the cants and a high-speed feed mechanism,...
4188934 Step safety groover apparatus  
A step groover apparatus has a housing to which a direct drive means is attached. The drive means has a rotatable shaft extending into the interior of the housing and on which a plurality of...
4188935 Roller handle for saw  
A handle assembly for a portable powered saw of the chain saw type which has an inverted, generally U-shaped handle with its upper central portion extending over the saw and the depending legs...
4167174 Method and apparatus for aligning the streets of a semiconductor wafer  
A method and apparatus for aligning the streets of a semiconductor wafer for sawing or scribing with a single motion control switch. One end of a street is first aligned with a reticle in the...
4138304 Wafer sawing technique  
A method for dividing a semiconductor wafer into pellets includes attaching the wafer to a vinyl membrane with a coupling material which adheres more tenaciously to the membrane than to the pellets...
4131103 Apparatus for sawing stone  
An apparatus for sawing a stone block to be severed into a plurality of slabs. The apparatus comprises a plurality of saw blades characterized by arranging said blades in series in the cutting...
4107883 Apparatus for controlling feed mechanisms of grinding and cutting apparatus  
Apparatus for controlling infeed speed of a power screw feed system or the like for cutting and abrading materials in response to resistance sensed by the feed mechanism moving the material into...
4090489 Fracture toughness test method  
An improved method for testing fracture toughness of tungsten carbide, and more particularly sintered tungsten carbide, consists of preparing a specimen from a short rod of sample material by...
4080952 Rim pump  
A lapidary saw is provided including a flat rotary blade having a circular peripheral cutting edge with the blade supported for rotation in an up-sawing angular direction for cutting a stone at a...
4078539 Rock gripper assembly  
A chuck assembly for gripping and holding objects including a base, a face plate rotatably mounted on the base, and a plurality of arms pivotally connected to and extending outwardly from the face...
4068648 Brick saw apparatus  
A rotating brick saw has an enclosure which substantially surrounds a rotating saw, a sliding table which carries a brick into the saw and tracks on which the table slides. The enclosure has an...
4044748 Continuous cutting machine for stone and building materials  
A cutting machine for petrous and building materials comprises first, second and third endless conveyor belts. The first belt is made up of a plurality of plates which extend transversely to the...
4033319 Blade guide and slab support for lapidary saw  
A blade guide for lapidary saws acts to prevent blade wobble and thus an uneven cut of the resulting slab. The blade guide comprises holder means, mounting means which attach the holder means to...
4022182 Dust and water confinement unit for portable circular saw  
A housing unit is disclosed for use with portable circular saws. The housing unit comprises a rigid structure which completely encloses the cutting blade of the saw and which confines water and...
4016855 Grinding method  
A method for segmenting a plate-like material, particularly a semiconductor wafer on which a plurality of elements are formed in regular arrangement, is provided. Segmentation is performed while...
3976045 Stone cutting machine  
A stone cutting machine is disclosed comprising a frame, a sliding beam movably supported on the frame, and one or more flexible wires having a plurality of cutting or honing segments projecting...
3896783 Cutting apparatus for cutting concrete material and the like  
An improved cutting apparatus, having a cutting blade supported via a frame assembly and an assembly supporting a removable, replaceable tube near the cutting blade, wherein a fluid source is...
Matches 351 - 400 out of 477 < 1 2 3 4 5 6 7 8 9 10 >