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8183502 |
Mounting table structure and heat treatment apparatus
A mounting table structure arranged in a processing chamber is provided for mounting a target object to be processed on the upper surface. The mounting table structure is characterized in having a...
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8168050 |
Electrode pattern for resistance heating element and wafer processing apparatus
There is disclosed a wafer processing apparatus having optimized electrode patterns for its resistive heating element. The optimized electrode pattern is designed to compensate for the heat loss...
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8169768 |
Electrostatic chuck
An electrostatic chuck for retaining a substrate. The chuck has a clamping surface for receiving the substrate, where the clamping surface is formed of a hard polymeric material filled with carbon...
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8157951 |
Capacitively coupled plasma reactor having very agile wafer temperature control
A plasma reactor for processing a workpiece includes a reactor chamber, an electrostatic chuck within the chamber having a top surface for supporting a workpiece and having indentations in the top...
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8152927 |
CVD coating device
The invention relates to a method for depositing especially crystalline layers on one or more, especially crystalline substrates in a process chamber by means of reaction gases that are introduced...
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8153536 |
Transfer of high temperature wafers
This invention provides apparatus, protocols, and methods that permit wafers to be loaded and unloaded in a gas-phase epitaxial growth chamber at high temperatures. Specifically, this invention...
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8148665 |
Apparatus and method for soft baking photoresist on substrate
An apparatus for soft baking a substrate having a dummy region is provided. The apparatus includes a heating plate, a plurality of pins, and a driving unit for individually lifting selective ones...
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8142609 |
Plasma processing apparatus
A plasma processing apparatus including a mounting table that includes a mounting table body having a temperature adjusted to be a predetermined level, and an electrostatic chuck disposed on an...
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8141513 |
Substrate holding apparatus, substrate holding method, and substrate processing apparatus
A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding...
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8141514 |
Plasma processing apparatus, plasma processing method, and storage medium
A plasma processing apparatus having a substrate processing chamber, which enables leakage of plasma into an exhaust space to be prevented. The substrate processing chamber has therein a processing...
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8137501 |
Bevel clean device
An apparatus for removing material on a bevel of a wafer is provided. A wafer support with a diameter that is less than the diameter of the wafer, wherein the wafer support is on a first side of...
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8137466 |
Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
A thin film deposition apparatus and an organic light-emitting display device by using the same. The thin film deposition apparatus includes an electrostatic chuck, an a plurality of chambers; at...
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8123863 |
Evaporation apparatus
An evaporation apparatus is capable of preventing a sag phenomenon in a substrate. The evaporation apparatus includes a substrate supporting unit. The substrate supporting unit includes a substrate...
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8117987 |
Hot wire chemical vapor deposition (CVD) inline coating tool
Methods and apparatus for hot wire chemical vapor deposition (HWCVD) are provided herein. In some embodiments, an inline HWCVD tool may include a linear conveyor for moving a substrate through the...
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8118940 |
Clamping mechanism for semiconductor device
A clamping mechanism for a semiconductor substrate includes: a C-shaped pickup plate; a susceptor top plate having a periphery adapted to receive and support an inner periphery portion of the...
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8118938 |
Lower liner with integrated flow equalizer and improved conductance
A plasma processing chamber has a lower liner with an integrated flow equalizer. In an etching process, the processing gases may be unevenly drawn from the processing chamber which may cause an...
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8118941 |
Semiconductor processing parts having apertures with deposited coatings and methods for forming the same
Holes in semiconductor processing reactor parts are sized to facilitate deposition of protective coatings, such as by chemical vapor deposition at atmospheric pressure. In some embodiments, the...
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8118936 |
Method and apparatus for an improved baffle plate in a plasma processing system
The present invention presents an improved baffle plate for a plasma processing system, wherein the design and fabrication of the baffle plate advantageously provides for a uniform processing...
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8115141 |
Heating element
There is disclosed a heating element 10 comprising: at least a heat-resistant base member 1; a conductive layer 3 having a heater pattern 3a formed on the heat-resistant base member;a protection...
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8114525 |
Process chamber component having electroplated yttrium containing coating
A component capable of being exposed to a plasma in a process chamber has a structure having an electroplated coating comprising yttrium-containing species. The electroplated coating can include...
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8114247 |
Plasma processing apparatus and focus ring
A plasma processing apparatus and a focus ring enables to perform uniform plasma processing over the entire surface of a substrate to be processed to thereby improve in-surface uniformity of plasma...
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8110045 |
Processing equipment for object to be processed
Processing equipment for an object to be processed is provided with a process container, the internal of which can be evacuated, a gas introducing means for introducing a prescribed gas into the...
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8110435 |
Method and apparatus for manufacturing semiconductor device
A method and apparatus for manufacturing a semiconductor device is disclosed, which is capable of realizing an extension of a cleaning cycle for a processing chamber, the method comprising...
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8104428 |
Plasma processing apparatus
A plasma processing apparatus that enables formation of a deposit film on a surface of a grounding electrode to be prevented. A substrate processing chamber has therein a processing space in which...
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8105438 |
Film coating cover and film coating device using same
An exemplary film coating device includes a film coating holder and a film coating cover. The film coating holder includes a plurality of through holes defined therein for receiving workpieces to...
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8101054 |
Magnetic particle trapper for a disk sputtering system
A magnetic particle trapper for use in a sputtering system includes a roller cover plate having a plurality of openings arranged and dimensioned to accommodate a plurality of rollers associated...
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8100081 |
Edge removal of films using externally generated plasma species
The present invention provides methods and apparatuses for removing unwanted film from the edge area of substrate using remotely-generated plasmas. Activated plasma species are directed to the edge...
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8092606 |
Deposition apparatus
A deposition apparatus configured to form a thin film on a substrate includes: a reactor wall; a substrate support positioned under the reactor wall; and a showerhead plate positioned above the...
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8092602 |
Thermally zoned substrate holder assembly
A thermally zoned substrate holder including a substantially cylindrical base having top and bottom surfaces configured to support a substrate. A plurality of temperature control elements are...
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8092639 |
Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes
A plasma reactor having a reactor chamber and an electrostatic chuck with a surface for holding a workpiece inside the chamber includes a backside gas pressure source coupled to the electrostatic...
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8092607 |
Transporting means and vacuum coating installation for substrates of different sizes
In a vacuum coating installation to coat planar substrates, comprising a vacuum chamber and a transport device arranged in the vacuum chamber for transporting the substrates along a transportation...
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8092605 |
Magnetic confinement of a plasma
A method and apparatus for confining a plasma are provided herein. In one embodiment, an apparatus for confining a plasma includes a substrate support and a magnetic field forming device for...
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8088225 |
Substrate support system for reduced autodoping and backside deposition
A substrate support system comprises a substrate holder having a plurality of passages extending between top and bottom surfaces thereof. The substrate holder supports a peripheral portion of the...
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8083855 |
Temperature control module using gas pressure to control thermal conductance between liquid coolant and component body
A temperature control module for a semiconductor processing chamber comprises a thermally conductive component body, one or more channels in the component body and one or more tubes concentric...
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8084375 |
Hot edge ring with sloped upper surface
A hot edge ring with extended lifetime comprises an annular body having a sloped upper surface. The hot edge ring includes a step underlying an outer edge of a semiconductor substrate supported in...
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8083912 |
Substrate carrier
A carrier for a substrate, wherein at least a part of the carrier contains a material with a coefficient of thermal expansion which is higher than the coefficient of thermal expansion of the...
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8062487 |
Wafer supporting device of a sputtering apparatus
A wafer supporting device of a sputter apparatus includes a pedestal positioned in a sputtering chamber and used to load a wafer for sputtering, a deposition ring having a recess positioned on a...
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8057602 |
Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber
Embodiments of the invention contemplate a method, apparatus and system that are used to support, position, and rotate a substrate during processing. Embodiments of the invention may also include a...
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8056503 |
Plasma procesor and plasma processing method
An etching chamber 1 incorporates a focus ring 9 so as to surround a semiconductor wafer W provided on a lower electrode 4. The plasma processor is provided with an electric potential control DC...
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8057633 |
Post-etch treatment system for removing residue on a substrate
A post-etch treatment system is described for removing photoresist and etch residue formed during an etching process. For example, the etch residue can include halogen containing material. The...
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8051799 |
Object-processing apparatus controlling production of particles in electric field or magnetic field
An apparatus includes a housing defining a chamber in which an electric field is generated, and an internal member provided in the chamber. At least one part of the internal member is formed of a...
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8052796 |
CVD reactor comprising a photodiode array
The invention relates to a device for depositing especially crystalline layers on especially crystalline substrates, said device comprising a process chamber which is arranged in a reactor housing...
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8052853 |
Sputtering apparatus and method of preventing damage thereof
A sputtering apparatus includes a container; a plate for supporting the container; a first attachment for attaching the container to the plate; and a second attachment for less tightly attaching...
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8048228 |
Masking apparatus and method of fabricating electronic component
A masking apparatus includes a mask base body and a mask plate. The mask base body includes at least one spacer plate, and a cavity in which an electronic component can be housed. The mask plate is...
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8043472 |
Substrate processing apparatus and focus ring
A substrate processing apparatus that can reliably improve the efficiency of heat transfer between a focus ring and a mounting stage. A housing chamber with the interior thereof evacuated houses a...
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8043433 |
High efficiency electro-static chucks for semiconductor wafer processing
The present invention generally provides a high efficiency electrostatic chuck for holding a substrate in a processing volume. The high efficiency electrostatic chuck includes an electrode embedded...
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8038837 |
Ring-shaped component for use in a plasma processing, plasma processing apparatus and outer ring-shaped member
A ring-shaped component for use in a plasma processing includes an inner ring-shaped member provided to surround an outer periphery of a substrate to be subjected to the plasma processing and an...
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8034723 |
Film deposition apparatus and film deposition method
A film deposition apparatus for depositing a film on a substrate by performing a cycle of alternately supplying at least two kinds of reaction gases that react with each other on the substrate to...
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8034177 |
Inner electrode for barrier film formation and apparatus for film formation
An inner electrode for barrier film formation is an inner electrode for barrier film formation that is inserted inside a plastic container having an opening, supplies a medium gas to the inside of...
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8028978 |
Wafer handling system
A semiconductor wafer processing system has a carrier including wafer slots. A process robot engages the carrier and installs the carrier into a rotor within a process chamber. The rotor has a...
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