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8177910 |
System and method for crystal growing
To reduce the heat input to the bottom of the crucible and to control heat extraction independently of heat input, a shield can be raised between a heating element and a crucible at a controlled...
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8142565 |
Vitreous silica crucible for pulling single-crystal silicon
A vitreous silica crucible for pulling single-crystal silicon, which is formed of vitreous silica and has a bottomed cylindrical shape, wherein, in a liquid-level movement range in the inner...
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8110042 |
Method for manufacturing single crystal
Using a pulling-up apparatus, an oxygen concentration of the monocrystal at a predetermined position in a pulling-up direction is controlled based on a relationship in which the oxygen...
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8105436 |
Single crystal silicon wafer for insulated gate bipolar transistors and process for producing the same
A single crystal silicon wafer for use in the production of insulated gate bipolar transistors is made of single crystal silicon grown by the Czochralski method and has a gate oxide with a film...
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8088219 |
Monocrystalline semiconductor wafer comprising defect-reduced regions and method for producing it
Monocrystalline semiconductor wafers have defect-reduced regions, the defect-reduced regions having a density of GOI-relevant defects within the range of 0/cm2 to 0.1/cm2 and occupy overall an...
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8043427 |
Semiconductor wafers of silicon and method for their production
Semiconductor wafers of silicon are produced by pulling a single crystal growing on a phase boundary from a melt contained in a crucible and cutting of semiconductor wafers therefrom, wherein...
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7972438 |
High-index UV optical materials for immersion lithography
This invention is related to material for use as an ultraviolet (UV) optical element and particularly for use as a 193 nm immersion lens element. The material for use as a UV optical element...
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7918934 |
Single crystal semiconductor manufacturing apparatus and manufacturing method, and single crystal ingot
A single crystal semiconductor manufacturing apparatus in which the concentration of oxygen in a single crystal semiconductor is controlled while pulling up a single crystal semiconductor such as...
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7906443 |
Controlling oxygen precipitates in silicon wafers using infrared irradiation and heating
A wafer processing method is provided that includes the steps of heating a silicon wafer containing oxygen and irradiating an infrared ray having a wavelength within a range of 7-25 μm on the ...
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7875116 |
Silicon single crystal producing method, annealed wafer, and method of producing annealed wafer
A method in which SSDs are reliably reduced while reducing void defects other than the SSDs on a wafer surface, which is essential for an annealed wafer, and ensuring that BMDs serving as gettering...
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7862656 |
Apparatus and method for growing a crystal and heating an annular channel circumscribing the crystal
An apparatus and method is provided for pulling a crystal seed from melt for growing a single crystal. The method includes the steps of providing a crucible and providing within the crucible an...
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7846252 |
Silicon wafer for IGBT and method for producing same
A silicon wafer for an IGBT is produced by forming an ingot having an interstitial oxygen concentration [Oi] of not more than 7.0×1017 atoms/cm3 by the Czochralski method; doping phosphorus in the ...
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7842133 |
Single crystal growing method
In a method of growing a single crystal by melting a raw material within a vessel under a nitrogenous and non-oxidizing atmosphere, the vessel is oscillated and the melted raw material is contacted...
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7837791 |
Silicon single crystal wafer for particle monitor
A silicon single crystal wafer for a particle monitor is presented, which wafer has an extremely small amount in the surface density of light point defects and is capable of still maintaining a...
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7803228 |
Process for producing high-resistance silicon wafers and process for producing epitaxial wafers and SOI wafers
By using oxygen-containing silicon wafers obtained by the CZ method and by combining the first heat treatment comprising controlled heat-up operation (ramping) with the second heat treatment...
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7799130 |
Silicon single crystal ingot and wafer, growing apparatus and method thereof
A silicon single crystal ingot growing apparatus for growing a silicon single crystal ingot based on a Czochralski method The silicon single crystal ingot growing apparatus includes a chamber; a...
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7740702 |
Silicon wafer and method for manufacturing the same
A silicon wafer and a method for manufacturing the same are provided, wherein the silicon wafer has no crystal defects in the vicinity of the surface and provides excellent gettering efficiency in...
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7708831 |
Process for producing ZnO single crystal according to method of liquid phase growth
A method for producing a ZnO single crystal by a liquid phase growth technique, comprising the steps of: mixing and melting ZnO as a solute and PbF2 and PbO as solvents; and putting a seed crystal...
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7641736 |
Method of manufacturing SiC single crystal wafer
A method of manufacturing an SiC single crystal wafer according to the present invention includes the steps of: (a) preparing an SiC single crystal wafer 10 with a mirror-polished surface; (b)...
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7641734 |
Method for producing silicon single crystal
A method of growing silicon single crystals with a [110] crystallographic axis orientation by the Czochralski method is provided according to which a silicon seed crystal doped with a high...
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7632349 |
Silicon wafer surface defect evaluation method
There is provided a silicon wafer surface defect evaluation method capable of readily detecting a region where small crystal defects exist, the evaluation method comprising: a rapid heat treatment...
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7628854 |
Process for producing silicon single crystal
A process for producing a silicon single crystal includes the steps of bringing a seed crystal into contact with a silicon melt, gradually pulling the seed crystal from the melt so as to form a...
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7621996 |
Silicon wafer and method for producing same
A method for producing a silicon wafer that has a carbon concentration of 5×1015 to 5×1017 atoms/cm3, interstitial oxygen concentration of 6.5×1017 to 13.5×1017 atoms/cm3, and a resistivity of 100...
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7594966 |
Method for producing a single crystal
A method for producing a single crystal by pulling a single crystal from a raw material melt in a chamber according to the Czochralski method, including pulling a single crystal having a...
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7582160 |
Silicone single crystal production process
In silicon single crystal growth by the Czochralski method using a quartz crucible, a silicon single crystals with a uniform distribution of oxygen concentration can be produced in high yield...
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7563319 |
Manufacturing method of silicon wafer
An active layer side silicon wafer is heat-treated in an oxidizing atmosphere to thereby form a buried oxide film therein. The active layer side silicon wafer is then bonded to a supporting side...
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7544247 |
Lithium tantalate substrate and method of manufacturing same
In a process for manufacturing a LT substrate from a LT crystal, after growing the crystal, a LT substrate in ingot form is imbedded in carbon power, or is place in a carbon vessel, and heat...
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7537658 |
Method for producing epitaxial silicon wafer
An oxide film 13 on the surface of the substrate 11 and an inner wall oxide film 112 in a COP 111 exposed to the surface of the substrate 11 are removed by cleaning the surface of the substrate 11...
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7473314 |
Method for growing silicon single crystal
A silicon single crystal is grown using the Czochralski method. During the crystal growth, a thermal stress is applied to at least a portion of the silicon single crystal. A gaseous substance...
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7470323 |
Process for producing p-doped and epitaxially coated semiconductor wafers from silicon
The Czochralski method is used for producing p−-doped and epitaxially coated semiconductor wafers from silicon, wherein a silicon single crystal is pulled, and during the pulling is doped with b...
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7442253 |
Process for forming low defect density, ideal oxygen precipitating silicon
The present invention is directed to a process for producing a silicon wafer which, during the heat treatment cycles of essentially any arbitrary electronic device manufacturing process, may form...
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7435294 |
Method for manufacturing silicon single crystal, and silicon wafer
A silicon single crystal is manufactured by growing said crystal composed of a defect-free area free from the Grown-in defects by the CZ process, adding a gas of a hydrogen atom-containing...
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7431764 |
Method for pulling up single crystal
The axial temperature gradient G at the vicinity of the solid-liquid interface 24 in an ingot is calculated in consideration of the heating value of a heater 18, the dimensions and physical...
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7431765 |
Process for preparing single crystal silicon having improved gate oxide integrity
A process for producing a single crystal silicon wafer comprising a front surface, a back surface, a lateral surface joining the front and back surfaces, a central axis perpendicular to the front...
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7404856 |
Nitrogen-doped silicon substantially free of oxidation induced stacking faults
The present invention relates to a process for forming single crystal silicon ingots or wafers that contain an axially symmetric region in which vacancies are the predominant intrinsic point...
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7384477 |
Method for producing a single crystal and a single crystal
The present invention is a method for producing a single crystal with pulling the single crystal from a raw material melt in a chamber by CZ method, wherein when growing the single crystal, where a...
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7378071 |
Silicon wafer and method for producing silicon single crystal
A method for growing a silicon single crystal ingot by a Czochralski method, which is capable of providing silicon wafers having very uniform in-plane quality and which results in improvement of...
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7364618 |
Silicon wafer, method for manufacturing the same and method for growing silicon single crystals
This silicon wafer is obtained from a silicon single crystal grown by the CZ method in a hydrogen-containing inert gas atmosphere, and is a completely grown-in defect-free wafer containing no COPs...
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7361218 |
Method and apparatus for fabricating a crystal fiber
The present invention relates to a method for fabricating a crystal fiber having different regions of polarization inversion, comprising the following steps: (a) providing a source material; (b)...
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7351282 |
Cutting method and apparatus for ingot, wafer, and manufacturing method of solar cell
Cutting method of ingot into wafers along cleavage plane. Onto surface of single crystal ingot 10 is implanted ion beam 23 to generate lattice defects in a direction defined by the crystal axes...
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7344689 |
Silicon wafer for IGBT and method for producing same
A silicon wafer for an IGBT is produced by forming an ingot having an interstitial oxygen concentration [Oi] of not more than 7.0×1017 atoms/cm3 by the Czochralski method; doping phosphorus in the ...
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7329317 |
Method for producing silicon wafer
The present invention is to produce a silicon crystal wherein the boron concentration in the silicon crystal and the growth condition V/G are controlled so that the boron concentration in the...
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7326658 |
Method for preparing nitrogen-doped annealed wafer and nitrogen-doped and annealed wafer
The present invention provides a method for producing a nitrogen-doped annealed wafer, wherein before a wafer sliced from a silicon single crystal doped with at least nitrogen and polished is...
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7326395 |
Method for producing a single crystal and silicon single crystal wafer
The present invention is a method for producing a single crystal in accordance with Czochralski method by flowing an inert gas downward in a chamber 1 of a single crystal-pulling apparatus 11 and...
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7320731 |
Process for growing silicon single crystal and process for producing silicon wafer
A process for growing a silicon single crystal which is capable of growing a silicon single crystal at a pulling rate which is not lower than the critical pulling rate at which an OSF-generating...
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7316745 |
High-resistance silicon wafer and process for producing the same
A high-resistance silicon wafer is manufactured, in which a gettering ability and economical efficiency is excellent and an oxygen thermal donor is effectively prevented from being generated in a...
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7311888 |
Annealed wafer and method for manufacturing the same
The present invention provides an annealed wafer which has a wafer surface layer serving as a device fabricating region and having an excellent oxide film dielectric breakdown characteristic, and a...
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7300517 |
Manufacturing method of hydrogen-doped silicon single crystal
A manufacturing method of a hydrogen-doped silicon single crystal. A silicon single crystal is grown under an inert atmosphere containing hydrogen in a CZ pulling furnace comprising a pull chamber...
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7294196 |
Silicon single crystal wafer, an epitaxial wafer and a method for producing a silicon single crystal
In a method for producing a silicon single crystal by Czochralski method, the single crystal is grown with controlling a growth rate between a growth rate at a boundary where a defect region...
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7291220 |
Process of producing silicon wafer
A silicon wafer made by the Czochralski method, including a ring-shaped OSF region and having nitrogen concentration ranging from 2.9×1014 to 5.0×1015 atoms/cm3 and oxygen concentration of 1...
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