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8167684 |
Chemical mechanical polishing slurry, its preparation method, and use for the same
A chemical mechanical polishing slurry for polishing a copper layer without excessively or destructively polishing a barrier layer beneath the copper layer is disclosed and includes an acid, a...
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8157877 |
Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion
A chemical mechanical polishing aqueous dispersion includes (A) abrasive grains having a pore volume of 0.14 ml/g or more, and (B) a dispersion medium.
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8157876 |
Slurry composition containing non-ionic polymer and method for use
A wiresaw cutting fluid composition of the present invention comprises about 25 to about 75% by weight of a particulate abrasive suspended in an aqueous carrier containing a polymeric viscosity...
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8147711 |
Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry
Disclosed is an adjuvant for controlling polishing selectivity when polishing a cationically charged material simultaneously with an anionically charged material. CMP slurry comprising the adjuvant...
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8114178 |
Polishing composition for semiconductor wafer and polishing method
The present invention relates to a polishing composition for a semiconductor wafer which is excellent in polishing property, and a polishing method. The polishing composition for a semiconductor...
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8080476 |
Polishing composition and polishing process
To provide a polishing composition particularly useful for an application to polish a conductor layer made of copper in a semiconductor wiring process, and a polishing process employing it. A...
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7998229 |
Polishing composition and polishing method
The polishing composition contains polyoxyethylene sorbitan mono-fatty acid ester, silicon dioxide, water soluble cellulose, an alkaline compound, and water. The content of polyoxyethylene sorbitan...
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7998228 |
Tantalum CMP compositions and methods
A composition suitable for tantalum chemical-mechanical polishing (CMP) comprises about 0.1 to about 10 percent by weight of a zirconia or fumed alumina abrasive, about 0.1 to about 10 percent by...
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7976624 |
Nano gel wax
An aqueous gel wax formulation includes a cationic wax microemulsion and an anionically charged polishing agent having a particle size less than about 200 nanometers and optimally a quaternary...
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7964005 |
Copper CMP slurry composition
A composition that rapidly passivates copper-containing surface to yield a uniform layer of insoluble copper oxide, the composition being useful in chemical-mechanical planarization of...
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7951717 |
Post-CMP treating liquid and manufacturing method of semiconductor device using the same
Post-CMP treating liquids are provided, one of which includes water, an amphoteric surfactant, an anionic surfactant, a complexing agent, resin particles having carboxylic group and sulfonyl group...
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7942945 |
CMP slurry for polymeric interlayer dielectric planarization
The proposed slurry can be used to planarize polymeric candidate ILD materials such Benzocylobutene (BCB), SILK, Polyimide, etc. The slurry consists of colloidal suspension of nanoparticle...
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7887625 |
Sealer composition
A composition for sealing exposed wood before finishing the wood, which composition includes polymer solids and an acid neutralizing agent. The acid neutralizing agent may be a weak base and/or a...
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7887609 |
Polishing slurry for polishing aluminum film and polishing method for polishing aluminum film using the same
A polishing slurry for polishing an aluminum film used for LSI or the like and a method for polishing an aluminum film using the same are provided. A polishing slurry for polishing an aluminum film...
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7879406 |
Sealer composition
A composition for sealing exposed wood before finishing the wood, which composition includes polymer solids and an acid neutralizing agent. The acid neutralizing agent may be a weak base and/or a...
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7875212 |
Polymer matrix composites with nano-scale reinforcements
Embodiments of the present invention provide polymer matrix nanocomposites reinforced with nano-scale materials such as nanoparticles and carbon nanotubes and methods of fabricating. The...
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7872063 |
Film forming compositions containing mixtures of benzoic acid esters
This invention provides film-forming compositions, including but not limited to polishes, coatings, adhesives and inks, comprising a at least one acrylic or vinyl acetate polymer or copolymer as a...
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7867303 |
Cerium oxide abrasive and method of polishing substrates
A cerium oxide abrasive slurry having, dispersed in a medium, cerium oxide particles whose primary particles have a median diameter of from 30 nm to 250 nm, a maximum particle diameter of 600 nm or...
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7857876 |
Method of producing polishing material comprising diamond clusters
Diamond clusters are used as a polishing material of free abrading particles, each being a combination of artificial diamond particles having primary particle diameters of 20 nm or less and...
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7854777 |
Polishing compound, method for production thereof, and polishing method
A heterocyclic benzene compound such as benzotriazole, is dissolved in at least one substance selected from the group consisting of a primary alcohol having from 1 to 4 carbon atoms, a glycol...
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7842129 |
Lacquer formulation for improving surface properties
A coating formulation containing at least one surface-modified silicon dioxide having a 60° reflectometer value of <3 and a black number My of at least 140 has excellent performance properties, ...
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7825178 |
Leveling agent for floor polish and aqueous floor polish composition
A floor-polish leveling agent containing an ester compound obtained by reacting a hydroxycarboxylic acid with at least one glycol ether so that substantially all of the carboxyl groups are...
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7820067 |
Halide anions for metal removal rate control
The inventive chemical-mechanical polishing system comprises a polishing component, a liquid carrier, an oxidizing agent, and a halogen anion. The inventive method comprises chemically-mechanically...
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7807219 |
Repairing and restoring strength of etch-damaged low-k dielectric materials
A process of repairing a plasma etched low-k dielectric material having surface-bound silanol groups includes exposing at least one surface of the dielectric material to (a) a catalyst so as to...
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7753998 |
Liquid polishing composition and kit
A liquid polishing composition of the invention suitable for polishing an automobile and the like comprises about 0.01 to about 3 percent by weight of at least one silicone-based wax, about 0.20 to...
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7753974 |
Polishing composition for semiconductor wafer, method for production thereof and polishing method
The present invention relates to a polishing composition for a substrate including a metal such as wiring, etc., formed on a semiconductor wafer, which can provide a high polishing rate without...
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7736405 |
Chemical mechanical polishing compositions for copper and associated materials and method of using same
A CMP composition containing a rheology agent, e.g., in combination with oxidizing agent, chelating agent, inhibiting agent, abrasive and solvent. Such CMP composition advantageously increases the...
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7708788 |
Cerium oxide abrasive and method of polishing substrates
A cerium oxide abrasive slurry having, dispersed in a medium, cerium oxide particles whose primary particles have a median diameter of from 30 nm to 250 nm, a maximum particle diameter of 600 nm or...
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7700159 |
Hydrophilizing wax composition
There is provided a hydrophilizable wax composition which provides a wax coating layer having a hydrophilic surface and imparts a gloss and long-lasting stain-proofing property on a substrate. The...
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7666238 |
Polishing composition
A polishing composition comprising an abrasive and water, wherein the polishing composition has an index of degree of sedimentation of 80 or more and 100 or less; a process for producing a...
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7666239 |
Hydrothermal synthesis of cerium-titanium oxide for use in CMP
The present invention provides a method of synthesizing abrasive particles and methods of using the same in chemical mechanical polishing slurry applications. The nanosized abrasive particles...
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7658870 |
Polymer matrix composites with nano-scale reinforcements
Embodiments of the present invention provide polymer matrix nanocomposites reinforced with nano-scale materials such as nanoparticles and carbon nanotubes and methods of fabricating. The...
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7628848 |
Water-based composition for renewing plastic surfaces
A water-based, non-oily, scented, liquid composition, with an ultraviolet filter, to be applied manually by brush or sponge, or by using an air gun, to surfaces of a synthetic nature. When...
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7611552 |
Semiconductor polishing composition
A semiconductor polishing composition is disclosed. The composition includes fumed silica. The semiconductor polishing composition is an aqueous dispersion solution of fumed silica. Further, the...
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7597729 |
Polishing composition and polishing method using the same
A polishing composition contains an abrasive such as colloidal silica, at least one kind of compound selected from imidazole and an imidazole derivative, and water. The polishing composition...
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7582127 |
Polishing composition for a tungsten-containing substrate
The invention provides a method of chemically-mechanically polishing a substrate comprising tungsten through use of a composition comprising a tungsten etchant, an inhibitor of tungsten etching,...
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7578862 |
Abrasive compound for glass hard disk platter
The present invention provides an abrasive compound suitable for polishing the surface of a glass substrate for an optical disk platter or a magnetic disk platter. More specifically, the present...
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7575615 |
Process for preparing a polishing composition
The present invention relates to a process for preparing a polishing composition comprising a colloidal silica prepared from a silicate. The first step involves adjusting the pH of a silica...
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7569205 |
Nanodiamond fractional and the products thereof
In certain embodiments, a method of processing detonation nanodiamonds to fractionate the detonation nanodiamonds involves, in order forming a combination of detonation nanodiamonds and a solvent,...
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7553345 |
Polishing composition
A microwaviness reducing agent for polishing a substrate for a precision part, containing either a surfactant having two or more ionic hydrophilic groups, or a polycarboxylic acid compound having 2...
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7550020 |
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
A chemical mechanical polishing aqueous dispersion comprises abrasives in a concentration of not more than 1.5% by mass, wherein the abrasives comprise ceria and have an average dispersed particle...
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7547335 |
Metal polishing composition and method of polishing using the same
A metal polishing composition comprising at least one of the compound represented by formula (1) defined herein and the compound represented by formula (2) defined herein, and an oxidizing agent,...
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7534277 |
Slurry composition for secondary polishing of silicon wafer
Disclosed is a slurry composition for secondary polishing of silicon wafers comprising: 2˜10 weight % of colloidal silica having an average particle size of 30˜80 nm; 0.5˜1.5 % by weight of am...
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7524347 |
CMP composition comprising surfactant
The invention provides a polishing composition comprising fumed alumina, alpha alumina, silica, a nonionic surfactant, a metal chelating organic acid, and a liquid carrier. The invention further...
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7524346 |
Compositions of chemical mechanical planarization slurries contacting noble-metal-featured substrates
A composition for chemical-mechanical planarization comprises periodic acid and an abrasive present in a combined amount sufficient to planarize a substrate surface having a feature thereon...
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7513920 |
Free radical-forming activator attached to solid and used to enhance CMP formulations
A CMP composition having: a fluid comprising water and at least one oxidizing compound that produces free radicals when contacted with an activator; and a plurality of particles having a surface...
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7503963 |
Cleaning and polishing wax composition
A water in oil emulsion wax composition composed of natural and synthetic waxes, surfactants, suspending agents, and aluminum oxide particles of high purity of 0.20 micrometer or less containing no...
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7503964 |
Paste wax composition
A solvent based paste wax polish composition for metallic, plastic, and painted surfaces containing a blend of synthetic and natural waxes, a blend of silicone fluids, blend of solvents, zinc oxide...
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7491252 |
Tantalum barrier removal solution
A chemical mechanical planarization solution is useful for removing tantalum barrier materials. The solution includes by weight percent 0 to 25 oxidizer, 0 to 15 inhibitor for a nonferrous metal...
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7470295 |
Polishing slurry, method of producing same, and method of polishing substrate
Disclosed herein is a polishing slurry for chemical mechanical polishing. The polishing slurry comprises polishing particles, which have a particle size distribution including separated fine and...
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