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7384458 |
Non-cyanide electroless gold plating solution and process for electroless gold plating
The non-cyanide electroless gold plating solution according to the invention is a non-cyanide electroless gold plating solution free from a cyanide compound, wherein bis-(3-sulfopropyl)disulfide is...
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7371880 |
Copper (I) compounds useful as deposition precursors of copper thin films
Copper (I) amidinate precursors for forming copper thin films in the manufacture of semiconductor devices, and a method of depositing the copper (I) amidinate precursors on substrates using...
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7323581 |
Source reagent compositions and method for forming metal films on a substrate by chemical vapor deposition
A metalorganic complex composition comprising a metalorganic complex selected from the group consisting of: metalorganic complexes comprising one or more metal central atoms coordinated to one or...
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7306662 |
Plating solution for electroless deposition of copper
An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a triamine based complexing agent, and an...
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7300501 |
Electroless gold plating liquid
The object is to provide an electroless gold plating liquid which has an adequate deposition speed for practical use without containing any thallium or other heavy metal ions, excellent stability...
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7297190 |
Plating solutions for electroless deposition of copper
An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a polyamine-based complexing agent, a chemical...
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7282088 |
Method for copper-plating or bronze-plating an object and liquid mixtures therefor
The invention relates to an aqueous concentrate which is stable with respect to freezing and defrosting and which contains at least one water-soluble or water-dispersible copper compound and,...
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7220347 |
Electrolytic copper plating bath and plating process therewith
An electrolytic copper plating bath used for via-filling plating of blind via-holes formed on a substrate, containing a water-soluble copper salt, sulfuric acid, chloride ions, and a leveler as an...
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7220296 |
Electroless plating baths for high aspect features
An electroless plating bath for filling high aspect ratio features with copper metal comprises water, a water soluble copper containing compound having an initial concentration of 0.5 to 50 g/L, a...
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7169216 |
Electroless copper plating solution, electroless copper plating process and production process of circuit board
An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt...
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7169215 |
Copper molybdenum electroless deposition process and materials
Materials and methods are described for electroless deposition of copper molybdenum. An aqueous bath composition for the electroless deposition of copper molybdenum includes;
a soluble...
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7150781 |
Pyrophosphoric acid bath for use in copper-tin alloy plating
The invention relates to a pyrophosphoric acid bath for use in cyanogen-free copper-tin alloy plating that contains an additive (A) composed an amine derivative, an epihalohydrin and a glycidyl...
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7147767 |
Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor
The present invention provides plating solutions having either copper bis(perfluoroalkanesulfonyl) imides or copper tris(perfluoroalkanesulfonyl) methides and methods of electrochemically or...
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7144491 |
Copper electrolytic solution containing organic sulfur compound and quaternary amine compound of specified skeleton as additives and electrolytic copper foil produced therewith
It is an object of the present invention to obtain a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous...
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7128822 |
Leveler compounds
Compounds that function to provide level or uniform metal deposits are provided. These compounds are particularly useful in providing level copper deposits. Copper plating baths and methods of...
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7122108 |
Tin-silver electrolyte
A tin-silver electrolyte and methods of depositing tin-silver alloys on a substrate.
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7105082 |
Composition and method for electrodeposition of metal on a work piece
A composition for electrodeposition of a metal on a work piece, which electrodeposition is conducted at an electrodeposition temperature, is provided. The composition comprises a metal salt, a...
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7084288 |
Organometallic precursor for forming metal film or pattern and method of forming metal film or pattern using the same
The object of this invention is to provide an organometallic precursor for forming a metal film or pattern and a method of forming the metal film or pattern using the same. More particularly, the...
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7074315 |
Copper bath and methods of depositing a matt copper coating
In the production of printed circuit boards it is required that organic protective coatings adhere tightly on the copper surfaces. Accordingly, matt layers of copper are to be preferred over...
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7022169 |
Electroless gold plating solution
An electroless gold plating solution is provided that contains no cyanide compound as a source of gold and that contains a decomposition inhibitor represented by general formula (1), provided that,...
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7011697 |
Electroless gold plating solution
An electroless gold plating solution is provided that includes a cyanide compound and ascorbic acid or a derivative thereof, the electroless gold plating solution containing one or more than one...
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6998036 |
Electrolyte and method for depositing tin-silver alloy layers
The invention relates to an acidic electrolyte used for depositing tin-silver alloys. The acidic electrolyte comprises one or more alkylsulfonic acids and/or alkanolsulfonic acids, one or more...
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6991675 |
Electroless displacement gold plating solution and additive for use in preparing plating solution
An object of the present invention is to provide an electroless displacement gold plating solution, an additive for use in preparing the plating solution, and a metal composite material obtained by...
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6911068 |
Plating bath and method for depositing a metal layer on a substrate
A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated...
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6908504 |
Electroless plating bath composition and method of using
The present invention relates to a cobalt electroless plating bath composition and method of using it for microelectronic device fabrication. In one embodiment, the present invention relates to...
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6881319 |
Electrolytic copper plating solution and method for controlling the same
Disclosed are an electrolytic copper plating solution containing a specific sulfur-containing compound and a thiol-reactive compound, and an electrolytic copper plating process using such an...
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6860925 |
Printed circuit board manufacture
A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads...
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6858123 |
Galvanizing solution for the galvanic deposition of copper
The invention relates to a novel galvanizing solution for the galvanic deposition of copper. Hydroxylamine sulfate or hydroxylamine hydrochloride are utilized as addition reagents and added to the...
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6852210 |
Plating method and plating bath precursor used therefor
To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for...
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6814850 |
Acid bath for electrodeposition of glossy gold and gold alloy layers and a gloss additive for same
The invention provides an acid bath for the electrodeposition of glossy gold and gold alloy layers and a gloss additive for same. By using compounds of the formula I R—SO m —H (I) in which m...
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6811828 |
Electroless gold plating solution and method for electroless plating
The present invention is aimed to provide an electroless gold plating solution which requires less amount of a reducing agent, retains a sufficient deposition rate for a practical use, and has an...
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6808614 |
Electroplating solution for high speed plating of tin-copper solder
In accordance with the present invention, an electroplating solution is provided for electroplating satin bright tin-copper alloy solder coatings at high speed. The preferred solution comprises...
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6800188 |
Copper plating bath and plating method for substrate using the copper plating bath
A copper plating bath comprising a reaction condensate of an amine compound and glycidyl ether and/or a quaternary ammonium derivative of this reaction condensate, and a plating method using this...
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6787239 |
Electrode material, dielectric material and plasma display panel using them
A material usable for the electrodes and the dielectric layer plasma display panels and capable of reducing the occurrence of yellowing and a high-image-quality plasma display panel using the...
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6776893 |
Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
A copper electroplating bath and a method to plate substrates with the bath are provided. The bath and method are particularly effective to plate electronic components such as semiconductive wafer...
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6776828 |
Plating composition
Disclosed are compositions suitable for electroless gold plating including one or more water soluble gold compounds, one or more gold complexing agents, one or more organic stabilizer compounds,...
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6776826 |
Composition and method for electroless plating of non-conductive substrates
Compositions and methods for coating and plating a non-conductive substrate, the substrate having a surface, comprising coating the surface with a binding solution composition, the binding solution...
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6773573 |
Plating bath and method for depositing a metal layer on a substrate
A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated...
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6767392 |
Displacement gold plating solution
The present invention provides a non-cyanide displacement gold plating solution with which even an electroless nickel-boron plated or electrolytic nickel plated substrate can be subjected to...
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6764537 |
Copper metal precursor
A method for chemical vapor deposition of copper metal thin film on a substrate includes heating a substrate onto which the copper metal thin film is to be deposited in a chemical vapor deposition...
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6736886 |
Electroless gold plating bath and method
Electroless gold plating baths and plating methods using these baths are provided. The electroless gold plating bath includes i) water-soluble gold compound, ii) complexing agent that stabilizes...
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6709563 |
Copper-plating liquid, plating method and plating apparatus
There is provided a copper-plating liquid free from an alkali metal and a cyanide which, when used in plating of a substrate having an outer seed layer and fine recesses of a high aspect ratio, can...
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6682642 |
Seed repair and electroplating bath
Disclosed are compositions useful for repair and electroplating of seed layers. Also disclosed are methods of repairing and electroplating such seed layers.
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6676823 |
High speed acid copper plating
One aspect of the invention relates to an aqueous copper plating bath containing sulfuric acid with a specific ratio to at least one supplemental acid selected from the group consisting of...
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6660071 |
Electroless copper plating bath, electroless copper plating method and electronic part
An electroless copper plating bath containing a cupric compound, a cupric ion complexing agent, a reducing agent, and a pH adjusting agent is provided, in which a carboxylic acid is added as a...
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6585811 |
Method for depositing copper or a copper alloy
The present invention is related to the fabrication of at least a part of a Cu-containing layers or a Cu-containing pattern used for the electrical connection of active or passive devices as well...
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6582814 |
Rare earth-transition metal oxide pigments
Rare earth-transition metal oxides are used as pigments. The rare earth-transition metal oxide pigments are preferably of the formula (Re x Tm)O y , where Re is at least one rare earth element, Tm...
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6576114 |
Electroplating composition bath
There is provided an electrodeposit free of cobalt, cadmium and nickel which contains 1.25 to 1.55% w/w iron, 1 to 2 ppm zirconium; and 97.7 to 98.2% gold and has a pale yellow color less than 3N...
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6544398 |
Non-cyanide-type gold-tin alloy plating bath
The present invention provides a non-cyanide-type gold-tin alloy plating bath comprising: (i) at least one water-soluble gold compound, (ii) at least one completing agent for gold, (iii) at least...
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6533849 |
Electroless gold plated electronic components and method of producing the same
An neutral electroless gold plating method that minimises “black band” corrosion problem in the final product. The electroless gold plating solution is provided at neutral pH in the presence of...
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