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8152914 |
Process for applying a metal coating to a non-conductive substrate
Described is a new process for applying a metal coating to a non-conductive substrate comprising the steps of (a) contacting the substrate with an activator comprising a noble metal/group IVA metal...
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8147601 |
Composite electroless plating
This invention is directed to a process for electrolessly metallizing an article, as well as to a plating bath and the subsequent plated substrate. The process comprises contacting the surface of...
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8137447 |
Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit board
Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of μm, in a manner free from ...
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8057587 |
Composition for coloring solder
A method of coloring solder is provided. The method includes providing an aqueous coloring agent solution essentially containing 31-32% wt of copper sulfate, 64-65% wt of water and 3-4% wt of salt...
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8048284 |
Metal plating compositions
Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal...
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8012334 |
Metal plating compositions and methods
Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
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7988773 |
Electroless gold plating bath, electroless gold plating method and electronic parts
An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, an aldehyde compound, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH...
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7985285 |
Electroless gold plating bath, electroless gold plating method and electronic parts
An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, a formaldehyde metabisulfite adduct, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH...
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7973188 |
Processes for the production of organometallic compounds
This invention relates to processes for the production of organometallic compounds represented by the formula M(L)3 wherein M is a Group VIII metal, e.g., ruthenium, and L is the same or different...
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7964746 |
Copper precursors for CVD/ALD/digital CVD of copper metal films
Copper precursors useful for depositing copper or copper-containing films on substrates, e.g., microelectronic device substrates or other surfaces. The precursors includes copper compounds of...
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7887693 |
Acid copper electroplating bath composition
An aqueous acidic copper electroplating composition containing an improved additive system for use at elevated temperatures. The improved additive system comprises (a) a suppressor comprising at...
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7767009 |
Solution and process for improving the solderability of a metal surface
The invention is directed to a solution and process for improving the solderability of a metal surface. In one embodiment, the invention is a silver deposit solution comprising an acid, a source of...
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7744685 |
Composite electroless plating
This invention is directed to a process for electrolessly metallizing an article, as well as to a plating bath and the subsequent plated substrate. The process comprises contacting the surface of...
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7691189 |
Printed wiring board and its manufacturing method
The present invention is directed to a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes...
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7686875 |
Electroless deposition from non-aqueous solutions
A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is...
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7611569 |
Electroless copper compositions
Electroless copper and copper alloys plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright...
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7534289 |
Electroless gold plating solution
An electroless gold plating solution that can form a gold plating film with excellent adhesion and that does not cause corrosion of a base metal film such as nickel, copper, cobalt, or palladium,...
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7527681 |
Electroless copper and redox couples
Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright...
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7517555 |
Copper plating solution and method for copper plating
A copper plating solution according to the present invention is characterized by that it comprising 0.03 mol/L to 0.5 mol/L of copper sulfate, 0.05 mol/L to 0.7 mol/L of ethylenediaminetetraacetic...
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7510639 |
Leveler compounds
Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion...
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7501014 |
Formaldehyde free electroless copper compositions
Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright...
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7473307 |
Electroless copper plating solution, method of producing the same and electroless copper plating method
Disclosed herein is an electroless copper plating solution, including a copper salt, a completing agent, a reductant and a pH adjuster, in which the plating solution includes a 2,2-dipyridyl acid...
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7465385 |
Gold alloy electrolytes
Compositions and methods for depositing gold alloys are disclosed. The compositions include certain dithiocarboxylic acids, salts and esters thereof and mercapto group containing compounds which...
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7419536 |
Electroless gold plating liquid
There is provided a cyanide-free immersion type electroless gold plating liquid that is low in toxicity, can be used near a neutral ph, and has a good solder adhesion and plating film adhesion. The...
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7402232 |
Silver electroplating solution
A silver electroplating solution containing a cyanide as a silver source, said silver electroplating solution characterized by containing at least one type of compound of As, Tl, Se, and Te as a...
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7396394 |
Electroless gold plating solution
The invention provides a displacement electroless gold plating solution that is low in toxicity, can be used at a pH near to neutrality, and affords good solder adhesion and film adhesion. The...
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7384458 |
Non-cyanide electroless gold plating solution and process for electroless gold plating
The non-cyanide electroless gold plating solution according to the invention is a non-cyanide electroless gold plating solution free from a cyanide compound, wherein bis-(3-sulfopropyl)disulfide is...
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7371880 |
Copper (I) compounds useful as deposition precursors of copper thin films
Copper (I) amidinate precursors for forming copper thin films in the manufacture of semiconductor devices, and a method of depositing the copper (I) amidinate precursors on substrates using...
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7323581 |
Source reagent compositions and method for forming metal films on a substrate by chemical vapor deposition
A metalorganic complex composition comprising a metalorganic complex selected from the group consisting of: metalorganic complexes comprising one or more metal central atoms coordinated to one or...
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7306662 |
Plating solution for electroless deposition of copper
An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a triamine based complexing agent, and an...
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7300501 |
Electroless gold plating liquid
The object is to provide an electroless gold plating liquid which has an adequate deposition speed for practical use without containing any thallium or other heavy metal ions, excellent stability...
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7297190 |
Plating solutions for electroless deposition of copper
An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a polyamine-based complexing agent, a chemical...
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7282088 |
Method for copper-plating or bronze-plating an object and liquid mixtures therefor
The invention relates to an aqueous concentrate which is stable with respect to freezing and defrosting and which contains at least one water-soluble or water-dispersible copper compound and,...
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7220296 |
Electroless plating baths for high aspect features
An electroless plating bath for filling high aspect ratio features with copper metal comprises water, a water soluble copper containing compound having an initial concentration of 0.5 to 50 g/L, a...
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7220347 |
Electrolytic copper plating bath and plating process therewith
An electrolytic copper plating bath used for via-filling plating of blind via-holes formed on a substrate, containing a water-soluble copper salt, sulfuric acid, chloride ions, and a leveler as an...
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7169216 |
Electroless copper plating solution, electroless copper plating process and production process of circuit board
An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt...
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7169215 |
Copper molybdenum electroless deposition process and materials
Materials and methods are described for electroless deposition of copper molybdenum. An aqueous bath composition for the electroless deposition of copper molybdenum includes; a soluble source of...
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7150781 |
Pyrophosphoric acid bath for use in copper-tin alloy plating
The invention relates to a pyrophosphoric acid bath for use in cyanogen-free copper-tin alloy plating that contains an additive (A) composed an amine derivative, an epihalohydrin and a glycidyl...
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7147767 |
Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor
The present invention provides plating solutions having either copper bis(perfluoroalkanesulfonyl) imides or copper tris(perfluoroalkanesulfonyl) methides and methods of electrochemically or...
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7144491 |
Copper electrolytic solution containing organic sulfur compound and quaternary amine compound of specified skeleton as additives and electrolytic copper foil produced therewith
It is an object of the present invention to obtain a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous...
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7122108 |
Tin-silver electrolyte
A tin-silver electrolyte and methods of depositing tin-silver alloys on a substrate.
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7105082 |
Composition and method for electrodeposition of metal on a work piece
A composition for electrodeposition of a metal on a work piece, which electrodeposition is conducted at an electrodeposition temperature, is provided. The composition comprises a metal salt, a...
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7084288 |
Organometallic precursor for forming metal film or pattern and method of forming metal film or pattern using the same
The object of this invention is to provide an organometallic precursor for forming a metal film or pattern and a method of forming the metal film or pattern using the same. More particularly, the...
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7074315 |
Copper bath and methods of depositing a matt copper coating
In the production of printed circuit boards it is required that organic protective coatings adhere tightly on the copper surfaces. Accordingly, matt layers of copper are to be preferred over...
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7022169 |
Electroless gold plating solution
An electroless gold plating solution is provided that contains no cyanide compound as a source of gold and that contains a decomposition inhibitor represented by general formula (1), provided that,...
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7011697 |
Electroless gold plating solution
An electroless gold plating solution is provided that includes a cyanide compound and ascorbic acid or a derivative thereof, the electroless gold plating solution containing one or more than one...
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6998036 |
Electrolyte and method for depositing tin-silver alloy layers
The invention relates to an acidic electrolyte used for depositing tin-silver alloys. The acidic electrolyte comprises one or more alkylsulfonic acids and/or alkanolsulfonic acids, one or more...
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6991675 |
Electroless displacement gold plating solution and additive for use in preparing plating solution
An object of the present invention is to provide an electroless displacement gold plating solution, an additive for use in preparing the plating solution, and a metal composite material obtained by...
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6911068 |
Plating bath and method for depositing a metal layer on a substrate
A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated...
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6908504 |
Electroless plating bath composition and method of using
The present invention relates to a cobalt electroless plating bath composition and method of using it for microelectronic device fabrication. In one embodiment, the present invention relates to...
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