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7056448 |
Method for forming circuit pattern
A method for forming a circuit pattern includes at least a step (a) of subjecting a non-conductor to electroless copper plating to form a copper film and a step (b) of etching the copper film so as...
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6821323 |
Process for the non-galvanic tin plating of copper or copper alloys
The invention describes a process for non-galvanic tin plating of copper and copper alloys by precipitation of tin from methanesulphonic acid and tin-containing electrolytes, containing a...
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6689199 |
Apparatus and method for introducing small amounts of refractory elements into a vapor deposition coating
A method of introducing small amounts of a refractory element into a vapor deposition coating. A second material ( 30 ), containing at least two elements which are desired to be deposited as a...
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6620304 |
Bath system for galvanic deposition of metals
A bath system for galvanic deposition of metals includes a solution containing at least one metal, especially a precious metal and/or precious metal alloy in the form of a water-soluble salt, at...
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6475644 |
Radioactive coating solutions methods, and substrates
Radioactive coating solutions and sol-gels, and corresponding methods for making a substrate radioactive by the application of the radioactive coating solutions and sol-gels thereto. The...
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6464762 |
Aqueous solution for the formation of an indium oxide film by electroless deposition
A method for forming an indium oxide film on an electrically conductive substrate by immersing the substrate and a counter electrode in an aqueous solution containing at least nitrate and indium...
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6399208 |
Source reagent composition and method for chemical vapor deposition formation or ZR/HF silicate gate dielectric thin films
A precursor composition for forming a zirconium and/or hafnium silicate film on a substrate, e.g., by chemical vapor deposition (CVD). Illustrative precursor compositions include (1) a first...
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6352580 |
Complexes having tris(pyrazolyl)borate ligands for forming films
Methods of forming a film on a substrate using chemical vapor deposition techniques and pyrazolyl complexes. The complexes and methods are particularly suitable for the preparation of semiconductor...
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6303231 |
Coating solutions for use in forming bismuth-based ferroelectric thin films, and ferroelectric memories formed with said coating solutions, as well as processes for production thereof
The invention discloses a coating solution for use in forming Bi-based ferroelectric thin films containing Bi, metallic element A (at least one selected from the group consisting of Bi. Pb, Ba, Sr,...
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6086790 |
Transparent conductive film and composition for forming same
The present invention discloses a double-layer structured low-resistance and low-reflectivity transparent conductive film, comprising a lower high-reflectivity conductive layer containing a fine...
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5989460 |
Electrically conductive coating
An electrically conductive floor coating comprising a ferroalloy containing layer including particles of ferroalloy interspersed with a resinous binder.
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5811153 |
Coating solutions for use in forming bismuth-based dielectric thin films, and dielectric thin films and memories formed with said coating solutions, as well as processes for production thereof
Alkoxymetals, β-diketones or metal acetates which are metal compounds corresponding independently to Bi, metallic element A (which is at least one member of the group consisting of Ca, Ba, Sr, Pb...
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5624480 |
Composition and process for substitutionally plating zinciferous surfaces
An acidic substitutional plating bath for zinciferous surfaces, particularly zinciferous metal-plated steel sheet, with which sludge production and equipment corrosion are inhibited and which has...
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5565087 |
Method for providing a tube having coke formation and carbon monoxide inhibiting properties when used for the thermal cracking of hydrocarbons
The rate of formation of carbon on the surfaces of thermal cracking tubes and the production of carbon monoxide during thermal cracking of hydrocarbons are inhibited by the use of cracking tubes...
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5492615 |
Cyclodextrin stabilization of organic metal finishing additives in aqueous metal treating baths
A method for stabilizing organic metal finishing additives in aqueous metal treating baths by dissolving the organic metal finishing additive with a cyclodextrin and a common solvent therefor, so...
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5459923 |
Method of marking hermetic packages for electrical device
A device and method of manufacture for producing electrically conductive regions in hermetically sealed insulative plates or hermetically sealed electronic component enclosures. The electrically...
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5418193 |
Copper paste for forming conductive thick film
Disclosed herein is copper paste for forming a conductive thick film, which contains 80 wt. % to 95 wt. % of spherical first copper powder of 1 μm to 10 μm in mean particle diameter, 0.5 wt. % to...
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5378347 |
Reducing tin sludge in acid tin plating
The present invention relates to a solution for use in the electroplating of tin and tin alloys comprising a basis solution which includes fluoboric acid or an organic sulfonic acid or one of their...
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5376596 |
Conductive paste
A conductive paste contains at least a conductive powder and a glass frit. The glass frit includes 9.0 to 45.0 wt % of SiO 2 and 1.0 to 18.5 wt % of CaO, the balance being ZnO, B 2 O 3 and Li 2 ...
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5336444 |
Ceramic via composition, multilayer ceramic circuit containing same, and process for using same
A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the...
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5292552 |
Method for forming metallized layer on an aluminum nitride sintered body
An aluminum nitride sintered body that has been fired/formed to have a prescribed sintered configuration, is used as a substrate. A metal paste of tungsten is prepared and applied to the substrate....
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5279650 |
Corrosion resistant seal coat composition and method of forming
A seal coat composition comprises a slurry consisting essentially of an aluminum neutralized phosphate bonding solution and iron oxide (Fe 2 O 3 ) powder. The bonding solution advantageously...
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5279649 |
Coating composition and method of forming
A coating composition comprises a slurry consisting essentially of an aluminum neutralized phosphate bonding solution and aluminum powder. The bonding solution advantageously contains a relatively...
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5185076 |
Bath and method for electrodepositing tin, lead and tin-lead alloy
A bath for electrodepositing tin, lead or an alloy thereof, containing a tin and/or lead ion and a sulfate ion becomes stable at pH 1 or higher when a condensed phosphate ion is added thereto. The...
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5173109 |
Process for forming reflowable immersion tin lead deposit
An acid solution for displacement plating of a reflowable tin lead alloy having a melting point not exceeding 500° F. over a cupreous surface. The displacement plating solution contains stannous...
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5145516 |
Composition for coating electrodes of a surge arrester
The present invention is directed to coating compositions of surge arrester electrodes which do not contain any radioactive materials and which permit the surge arrester to operate both in a...
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5098748 |
Method of producing a flame-spray-coated article and flame spraying powder
Powder which has primary particle size of not larger than 10 μm and is formed of mixture of Ni powder and Cr powder added with hard particles containing carbide is mixed with Cr 3 C 2 powder and...
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4975330 |
Coating compositions containing unreacted hexavalent chromium, a method of applying and an article
A coating composition for providing a part with improved salt spray resistance, which includes undissolved solid hexavalent chromate in an aqueous acid solution which is the reaction product of...
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4940849 |
Metallizing paste
A metallizing paste capable of being used for screen printing applications which comprises tungsten powder and an organic vehicle system. The organic vehicle system can comprise a polymeric...
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4906514 |
Metallized substrate for electronic device
Metallizing pastes, for forming thick film circuitry on low expansion substrates in electronic devices, are disclosed. The paste contains a glass powder that crystallizes on firing to a...
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4904415 |
Oxide glasses having low glass transformation temperatures
PbO-B 2 O 3 -Ag 2 O glasses having a preferred weight ratio range of 76-88:10-15:2-10 have glass transition temperatures of less than 300° C. and are especially useful for adhering together...
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4894273 |
Bonding additives for refractory metallization inks
Bonding additives for refractory metallization compositions allow for circuit traces having good resistivities and adhesion values in excess of 6 kpsi, generally between about 10 and 20 kpsi. The...
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4891069 |
Composition for the electrolytic coating of circuit boards without an electroless metal coating
A process and composition are disclosed for directly electrometallizing a non-conductive substrate such as the non conductive surfaces of a circuit board and to directly effect through hole plating...
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4889558 |
Coating compositions containing undissolved hexavalent chromium salt
A coating composition for providing a part with improved salt spray resistance, which comprises undissolved solid hexavalent chromate in an aqueous acid solution which is the reaction product of...
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4861641 |
Substrates with dense metal vias
Dense vias may be made with a metallizing composition containing tungsten, alumina, and either nickel or palladium. Further, an infiltration process ensures that vias in ceramic substrates are...
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4828614 |
Ferrophosphorous composition having improved conductivity and passivation resistance
A ferrophosphorous composition with improved conductivity and passivation resistance in prepared by treating ferrophosphorus particles with an aqueous solution containing a dilute mineral acid and...
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4822645 |
Metallizing paste and a process for metallizing ceramic articles by using such a metallizing paste
Metallizing pastes are disclosed, which contain, as inorganic materials, 15 to 50% by weight of a component to form a glass phase and 50 to 85% by weight of a metallic molybdenum powder. The glass...
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4820562 |
Metallizing composition for sintered ceramic article
This invention relates to a metallizing composition capable of forming an electroconductive coating of satisfactory adherence properties on the surface of a sintered ceramic article, particularly...
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4816364 |
Magnetic carrier particles for electrophotographic developer having plated layer of iron oxide
The present invention is intended to provide a carrier to be used as a two-component developer, wherein a nuclide particle surface has a magnetic plated layer composed of an iron oxide. The carrier...
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4806160 |
Metallizing composition
Disclosed is a metallizing composition comprising an oxynitride glass of the Mg-Al-Si system and/or the Y-Al-Si system and a powder of a high-melting-point metal. This composition has a good...
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4800132 |
Mechanical plating with oxidation-prone metals
In a mechanical plating process, oxidation-prone metals, such as aluminum, titanium, magnesium, and mixtures thereof, can be applied to metal substrates without the corrosion problems encountered...
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4799958 |
Metallizing paste
A metallizing paste capable of being used for screen printing applications which comprises tungsten powder and an organic vehicle system. The organic vehicle system can comprise a polymeric...
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4719038 |
Corrosion resistant, coated metal laminate, its preparation and coating materials
Corrosive resistant, coated laminate consisting of metal substrate, anti-corrosive layer and paint layer, which is characterized by the fact that the anti-corrosive layer is formed by a composition...
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4696764 |
Electrically conductive adhesive composition
An electrically conductive adhesive composition which provides electric conductivity between facing electrodes but maintains electric insulation in the lateral direction across the facing...
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4692234 |
Antifoulants for thermal cracking processes
The formation of carbon on metals exposed to hydrocarbons in a thermal cracking process is reduced by contacting such metals with an antifoulant selected from the group consisting of a combination...
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4687567 |
Antifoulants for thermal cracking processes
The formation of carbon on metals exposed to hydrocarbons in a thermal cracking process is reduced by contacting such metals with an antifoulant selected from the group consisting of a combination...
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4683157 |
Thixotropic coating compositions and methods
Metal part coated with a cured coating composition comprising (a) an acid aqueous solution of phosphate ions and ions of chromate or molybdate, (b) an acid-stable amorphous silica and (c) a...
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4659613 |
Parts coated with thick coating compositions of uni- and polymodal types
A coated metal or ceramic part having improved salt corrosion and oxidation resistance having a liquid binder which comprises phosphate ions and ions of the group of chromate or molybdate ions, and...
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4647308 |
Soldering compositions, fluxes and methods of use
A zinc-based composition comprising, by weight: from about 0.1 to 4 percent copper; from about 0.1 to about 1 percent nickel; from about 0.01 to less than 0.5 percent aluminum; 0 to...
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4617056 |
Thick coating compositions
A coating composition especially suitable for a machinable aluminum-filled coating possessing improved salt corrosion and oxidation resistance having a liquid binder which comprises phosphate ions...
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