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Match Document Document Title
7370306 Method and apparatus for designing a pattern on a semiconductor surface  
A method of forming a pattern of elements is shown. In one embodiment, the method is used to create a reticle. In another embodiment, the method is used to further form a number of elements on a su...
7370226 System and method for communicating a software-generated pulse waveform between two servers in a network  
A method of monitoring a status condition of a first server with a second server in a server network, and also providing synchronization and messaging between the two servers, the method including:...
7370225 System and method for communicating a software-generated pulse waveform between two servers in a network  
A method of monitoring a status condition of a first server with a second server in a server network, and also providing synchronization and messaging between the two servers, the method including:...
7370150 System and method for managing a cache memory  
A processing system optimized for data string manipulations includes data string execution circuitry associated with a bus interface unit or memory controller. Cache coherency is maintained, and da...
7370134 System and method for memory hub-based expansion bus  
A system memory includes a memory hub controller, a memory module accessible by the memory hub controller, and an expansion module having a processor circuit coupled to the memory module and also h...
7370122 Distributed configuration storage  
Systems and methods for providing distributed configuration storage are presented. The configuration storage is divided into distributed configuration target modules that are physically located in ...
7369623 Apparatuses to simultaneously distribute clock signals and data on integrated circuits, interposers, and circuit boards  
A technique is described for simultaneously and synchronously transmitting digital data and a clock signal in a digital integrated circuit, circuit board, or system. The technique is based on the p...
7369447 Random cache read  
A non-volatile memory is described that utilizes a cache read mode of operation, where a next page of memory is being read/sensed from the memory array by the sense amplifiers while a previously re...
7369436 Vertical NAND flash memory device  
Memory devices, arrays, and strings are included that facilitate the use of vertical floating gate memory cells in NAND architecture memory strings, arrays, and devices. NAND Flash memory strings, ...
7369435 Write once read only memory employing floating gates  
Structures and methods for write once read only memory employing floating gates are provided. The write once read only memory cell includes a floating gate transistor formed in a modified dynamic r...
7369434 Flash memory with multi-bit read  
A memory device is described that uses extra data bits stored in a multi-level cell (MLC) to provide error information. An example embodiment provides a memory cell that uses more than 2 X logic l...
7369379 Methods, circuits, and applications using a resistor and a Schottky diode  
A combination of a current limiting resistor and a clamping Schottky diode prevent substantial forward biasing of a pn junction associated with a pad in a snapback device during normal operation, b...
7369168 Circuit for an active pixel sensor  
A pixel circuit includes a silicon substrate having a photodiode that converts light intensity into a voltage signal and two metal layers disposed on the substrate having a pixel control circuit. T...
7369167 Photo diode ID for CMOS imagers  
A CMOS image pixel array formed on a chip is used for storing programmed information within the pixel array. Manufacturing lot and other data is written to the array during manufacturing and testin...
7369138 Full-scene anti-aliasing method and system  
A method and system for performing full-scene anti-aliasing for an image through a technique of rotating and unrotating rasterization of a scene and rendering a resulting image. A scene is rasteriz...
7369072 Method and apparatus for calibrating imaging device circuits  
A method of operating an imaging device, an imaging device, a camera system including an imaging device, and a processing system including an imaging device for calibrating an analog-to-digital con...
7368965 Clock capture in clock synchronization circuitry  
Clock capturing synchronization circuitry first generates a synchronized clock signal from a reference clock signal, then captures the synchronized clock signal, and continues to output a synchroni...
7368812 Interposers for chip-scale packages and intermediates thereof  
A carrier substrate, or interposer, for use in a chip-scale package includes a material, such as a semiconductive material, that has a coefficient of thermal expansion that is the same or similar t...
7368810 Invertible microfeature device packages  
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality o...
7368800 Methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating memory circuitry, integrated circuitry and memory integrated circuitry  
The invention includes methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating integrated circuitry including memory circuitry, and integrated circuit...
7368796 Metal gate engineering for surface P-channel devices  
A semiconductor device, such as a CMOS device, having gates with a high work function in PMOS regions and low work functions in NMOS regions and a method of producing the same. Using nitrogen impla...
7368790 Strained Si/SiGe/SOI islands and processes of making same  
A process of making a strained silicon-on-insulator structure is disclosed. A recess is formed in a substrate to laterally isolate an active area. An undercutting etch forms a bubble recess under t...
7368701 Optical channels for multi-level metal optical imagers and method for manufacturing same  
The manufacture of multi-level optical imagers and the resulting imagers are described. Multiple levels of metallization are prepared, each level having a via. The vias are aligned and a material h...
7368698 Imaging device with reduced row readout time and method of operating the same  
An imager in which a column line bias current control signal is pulsed at some time during and/or after the pulsing of the reset control and the transfer control signals to increase a bias current ...
7368696 Generation and storage of column offsets for a column parallel image sensor  
The plural signal chains of an imaging device are calibrated in the digital domain. The pixel array of the imaging device includes a row of calibration pixels. The column circuitry, prior to readin...
7368678 Method for sorting integrated circuit devices  
A method for sorting integrated circuit (IC) devices of the type having a substantially unique identification (ID) code, such as a fuse ID, including automatically reading the ID code of each of th...
7368416 Methods of removing metal-containing materials  
Various methods for selectively etching metal-containing materials (such as, for example, metal nitrides, which can include, for example, titanium nitride) relative to one or more of silicon, silic...
7368402 Systems and methods for forming tantalum oxide layers and tantalum precursor compounds  
A method of forming (and apparatus for forming) a tantalum oxide layer on a substrate, particularly a semiconductor substrate or substrate assembly, using a vapor deposition process and a tantalum ...
7368399 Methods of forming patterned photoresist layers over semiconductor substrates  
This invention includes methods of forming patterned photoresist layers over semiconductor substrates. In one implementation, a porous antireflective coating is formed over a semiconductor substrat...
7368391 Methods for designing carrier substrates with raised terminals  
A method for designing a carrier substrate includes configuring at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adh...
7368389 Methods of forming electrically conductive plugs  
A method of forming an electrically conductive plug includes providing an opening within electrically insulative material over a node location on a substrate. An electrically conductive material is...
7368382 Atomic layer deposition methods  
The invention includes an atomic layer deposition method of forming a layer of a deposited composition on a substrate. The method includes positioning a semiconductor substrate within an atomic lay...
7368381 Methods of forming materials  
The invention includes methods of forming films over substrates. A substrate is provided within a reaction chamber, and a mixture is also provided within the chamber. The mixture includes a precurs...
7368378 Methods for making integrated-circuit wiring from copper, silver, gold, and other metals  
Integrated circuits, the key components in thousands of electronic and computer products, include interconnected networks of electrical components. The components are typically wired, or interconne...
7368374 Super high density module with integrated wafer level packages  
A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer...
7368372 Methods of fabricating multiple sets of field effect transistors  
The invention includes methods of fabricating multiple sets of field effect transistors. In one implementation, an etch stop layer is formed over an insulative capping layer which is formed over a ...
7368366 Methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating memory circuitry, integrated circuitry and memory integrated circuitry  
The invention includes methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating integrated circuitry including memory circuitry, and integrated circuit...
7368362 Methods for increasing photo alignment margins  
Methods and structures are provided for increasing alignment margins when contacting pitch multiplied interconnect lines with other conductive features in memory devices. The portions of the lines ...
7368344 Methods of reducing floating body effect  
Methods of reducing the floating body effect in vertical transistors are disclosed. The floating body effect occurs when an active region in a pillar is cut off from the substrate by a depletion re...
7368343 Low leakage MIM capacitor  
Capacitor structures for use in integrated circuits and methods of their manufacture. The capacitor structures include a bottom electrode, a top electrode and a dielectric layer interposed between ...
7368339 Method and apparatus providing CMOS imager device pixel with transistor having lower threshold voltage than other imager device transistors  
A transistor of a pixel cell for use in a CMOS imager with a low threshold voltage of about 0.3 V to less than about 0.7 V is disclosed. The transistor is provided with high dosage source and drain...
7368320 Method of fabricating a two die semiconductor assembly  
A semiconductor die assembly includes a substantially planar lead frame including a die paddle and a plurality of lead fingers, a first semiconductor die secured by an active surface thereof to the...
7368014 Variable temperature deposition methods  
A deposition method may include, at a first temperature, contacting a substrate with a first precursor and chemisorbing a first layer at least one monolayer thick over the substrate. At a second te...
7367871 Semiconductor processing methods of removing conductive material  
The invention includes a semiconductive processing method of electrochemical-mechanical removing at least some of a conductive material from over a surface of a semiconductor substrate. A cathode i...
7367845 Modular sockets using flexible interconnects  
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined v...
7367343 Method of cleaning a surface of a cobalt-containing material, method of forming an opening to a cobalt-containing material, semiconductor processing method of forming an integrated circuit comprising a copper-containing conductive line, and a cobalt-containing film cleaning solution  
The invention includes methods of cleaning a surface of a cobalt-containing material, methods of forming an opening to a cobalt-containing material, semiconductor processing methods of forming an i...
7367252 Integrated circuit package separators  
An integrated circuit package separator. A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plur...
7366985 Text based markup language resource interface  
A software control method and apparatus for displaying a text based markup language interface. The interface can interact with a computer to provide reference documents, install system drivers and ...
7366966 System and method for varying test signal durations and assert times for testing memory devices  
A testing system includes a phase interpolator receiving a clock signal. An output of the phase interpolator is coupled to both a first signal distribution tree that includes a first delay line in ...
7366946 ROM redundancy in ROM embedded DRAM  
Redundancy in a read only memory (ROM) embedded dynamic random access memory (DRAM) is accomplished by programming redundancy elements such as antifuses or registers with ROM data which is read ins...

Matches 1 - 50 out of 16907 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >